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BS EN 61709:2017 - TC Tracked Changes. Electric components. Reliability. Reference conditions for failure rates and stress models for conversion, 2020
- 30310532_NEW.pdf [Go to Page]
- National foreword
- English [Go to Page]
- CONTENTS
- FOREWORD
- INTRODUCTION
- 1 Scope
- 2 Normative references
- 3 Terms, definitions and symbols [Go to Page]
- 3.1 Terms and definitions
- 3.2 Symbols
- 4 Context and conditions [Go to Page]
- 4.1 Failure modes and mechanisms
- 4.2 Thermal modelling
- 4.3 Mission profile consideration [Go to Page]
- 4.3.1 General
- 4.3.2 Operating and non-operating conditions
- 4.3.3 Dormancy
- 4.3.4 Storage
- 4.4 Environmental conditions
- Tables [Go to Page]
- Table 1 – Basic environments
- 4.5 Components choice
- Table 2 – Values of environmental parameters for basic environments
- 4.6 Reliability growth during the deployment phase of new equipment
- 4.7 How to use this document
- 5 Generic reference conditions and stress models [Go to Page]
- 5.1 Recommended generic reference conditions
- Figures [Go to Page]
- Figure 1 – Comparison of the temperature dependence of for CMOS IC
- 5.2 Generic stress models [Go to Page]
- 5.2.1 General
- Table 3 – Recommended reference conditions for environmentaland mechanical stresses [Go to Page]
- 5.2.2 Stress factor for voltage dependence,
- 5.2.3 Stress factor for current dependence,
- 5.2.4 Stress factor for temperature dependence,
- 5.2.5 Environmental application factor,
- 5.2.6 Dependence on switching rate,
- Table 4 – Environmental application factor, [Go to Page]
- 5.2.7 Dependence on electrical stress,
- 5.2.8 Other factors of influence
- 6 Integrated semiconductor circuits [Go to Page]
- 6.1 Specific reference conditions
- Table 5 – Memory
- Table 6 – Microprocessors and peripherals, microcontrollers and signal processors
- Table 7 – Digital logic families and bus interfaces, bus driver and receiver circuits
- 6.2 Specific stress models [Go to Page]
- 6.2.1 General
- Table 8 – Analog ICs
- Table 9 – Application-specific ICs (ASICs) [Go to Page]
- 6.2.2 Voltage dependence, factor
- 6.2.3 Temperature dependence, factor
- Table 10 – Constants for voltage dependence
- Table 11 – Factor for digital CMOS-family ICs
- Table 12 – Factor for bipolar analog ICs
- Table 13 – Constants for temperature dependence
- Table 14 – Factor for ICs (without EPROM; FLASH-EPROM; OTPROM; EEPROM; EAROM)
- Table 15 – Factor for EPROM; FLASH-EPROM; OTPROM; EEPROM; EAROM
- 7 Discrete semiconductors [Go to Page]
- 7.1 Specific reference conditions
- Table 16 – Transistors common, low frequency
- Table 17 – Transistors, microwave, (e.g. RF > 800 MHz)
- 7.2 Specific stress models [Go to Page]
- 7.2.1 General
- Table 18 – Diodes
- Table 19 – Power semiconductors [Go to Page]
- 7.2.2 Voltage dependence for transistors, factor
- 7.2.3 Temperature dependence, factor
- Table 20 – Constants for voltage dependence of transistors
- Table 21 – Factor for transistors
- Table 22 – Constants for temperature dependence of discrete semiconductors
- Table 23 – Factor for transistors, reference and microwave diodes
- Table 24 – Factor for diodes (without reference and microwave diodes) and power semiconductors
- 8 Optoelectronic components [Go to Page]
- 8.1 Specific reference conditions
- Table 25 – Optoelectronic semiconductor signal receivers
- Table 26 – LEDs, IREDs, laser diodes and transmitter components
- Table 27 – Optocouplers and light barriers
- Table 28 – Passive optical components
- Table 29 – Transceiver, transponder and optical sub-equipment
- 8.2 Specific stress models [Go to Page]
- 8.2.1 General
- 8.2.2 Voltage dependence, factor
- 8.2.3 Current dependence, factor
- Table 30 – Constants for voltage dependence of phototransistors
- Table 31 – Factor for phototransistors [Go to Page]
- 8.2.4 Temperature dependence, factor
- Table 32 – Constants for current dependence of LEDs and IREDs
- Table 33 – Factor for LEDs and IREDs
- Table 34 – Constants for temperature dependence of optoelectronic components
- Table 35 – Factor for optical components
- 9 Capacitors [Go to Page]
- 9.1 Specific reference conditions
- 9.2 Specific stress model [Go to Page]
- 9.2.1 General
- 9.2.2 Voltage dependence, factor
- Table 36 – Capacitors
- Table 37 – Constants for voltage dependence of capacitors
- Table 38 – Factor for capacitors [Go to Page]
- 9.2.3 Temperature dependence, factor
- Table 39 – Constants for temperature dependence of capacitors
- 10 Resistors and resistor networks [Go to Page]
- 10.1 Specific reference conditions
- Table 40 – Factor for capacitors
- 10.2 Specific stress models [Go to Page]
- 10.2.1 General
- 10.2.2 Temperature dependence, factor
- Table 41 – Resistors and resistor networks
- Table 42 – Constants for temperature dependence of resistors
- 11 Inductors, transformers and coils [Go to Page]
- 11.1 Reference conditions
- 11.2 Specific stress model [Go to Page]
- 11.2.1 General
- 11.2.2 Temperature dependence, factor
- Table 43 – Factor for resistors
- Table 44 – Inductors, transformers and coils
- Table 45 – Constants for temperature dependence of inductors, transformers and coils
- 12 Microwave devices [Go to Page]
- 12.1 Specific reference conditions
- Table 46 – Factor for inductors, transformers and coils
- Table 47 – Microwave devices
- 12.2 Specific stress models
- 13 Other passive components [Go to Page]
- 13.1 Specific reference conditions
- 13.2 Specific stress models
- 14 Electrical connections [Go to Page]
- 14.1 Specific reference conditions
- Table 48 – Other passive components
- 14.2 Specific stress models
- 15 Connectors and sockets [Go to Page]
- 15.1 Reference conditions
- 15.2 Specific stress models
- 16 Relays [Go to Page]
- 16.1 Reference conditions
- Table 49 – Electrical connections
- Table 50 – Connectors and sockets
- 16.2 Specific stress models [Go to Page]
- 16.2.1 General
- 16.2.2 Dependence on switching rate, factor
- Table 51 – Relays [Go to Page]
- 16.2.3 Dependence on electrical stress, factor
- Figure 2 – Selection of stress regions in accordance with current and voltage-operating conditions
- Table 52 – Factor for low current relays
- Table 53 – Factor for general purpose relays [Go to Page]
- 16.2.4 Temperature dependence, factor
- 17 Switches and push-buttons [Go to Page]
- 17.1 Specific reference conditions
- Table 54 – Factor for automotive relays
- Table 55 – Constants for temperature dependence of relays
- Table 56 – Factor for relays
- 17.2 Specific stress model [Go to Page]
- 17.2.1 General
- 17.2.2 Dependence on electrical stress, factor
- Figure 3 – Selection of stress regionsin accordance with current and voltage-operating conditions
- Table 57 – Switches and push-buttons
- 18 Signal and pilot lamps [Go to Page]
- 18.1 Specific reference conditions
- 18.2 Specific stress model [Go to Page]
- 18.2.1 General
- Table 58 – Factor for switches and push-buttons for low electrical stress
- Table 59 – Factor for switches and push-buttons for higher electrical stress
- Table 60 – Signal and pilot lamps [Go to Page]
- 18.2.2 Voltage dependence, factor
- 19 Printed circuit boards (PCB)
- 20 Hybrid circuits [Go to Page]
- Table 61 – Factor for signal and pilot lamps
- Annexes [Go to Page]
- Annex A (normative) Failure modes of components
- Table A.1 – Failure modes: ICs (digital)
- Table A.2 – Failure modes: transistors, diodes, optocouplers
- Table A.3 – Failure modes: LEDs
- Table A.4 – Failure modes: laser diodes and modules
- Table A.5 – Failure modes: photodiodes and receiver modules
- Table A.6 – Failure modes: capacitors
- Table A.7 – Failure modes: resistors, inductive devices, relays
- Annex B (informative) Thermal model for semiconductors [Go to Page]
- B.1 Thermal model
- B.2 Junction temperature calculation
- Figure B.1 – Temperatures inside equipment [Go to Page]
- B.3 Thermal resistance evaluation
- Figure B.2 – Thermal resistance model [Go to Page]
- B.4 Power dissipation of an integrated circuit P
- Table B.1 – Thermal resistance as a function of package type, pin number and airflow factor
- Table B.2 – Typical values of are
- Table B.3 – Values of and
- Annex C (informative) Failure rate prediction [Go to Page]
- C.1 General
- C.2 Failure rate prediction for assemblies [Go to Page]
- C.2.1 General
- C.2.2 Assumptions and limitations
- C.2.3 Process for failure rate prediction
- C.2.4 Prediction models
- C.2.5 Other methods of reliability prediction
- C.2.6 Validity considerations of reliability models and predictions
- C.3 Component considerations [Go to Page]
- C.3.1 Component model
- C.3.2 Components classification
- C.4 General consideration about failure rate [Go to Page]
- C.4.1 General
- C.4.2 General behaviour of the failure rate of components
- C.4.3 Expected values of failure rate
- C.4.4 Sources of variation in failure rates
- Annex D (informative) Considerations on mission profile [Go to Page]
- D.1 General
- D.2 Dormancy
- D.3 Mission profile
- D.4 Example of mission profile
- Figure D.1 – Mission profile
- Annex E (informative) Useful life models [Go to Page]
- E.1 General
- E.2 Power transistors
- E.3 Optocouplers [Go to Page]
- E.3.1 Useful life L
- E.3.2 Factor L0
- E.3.3 Factor (0
- E.4 LED and LED modules [Go to Page]
- E.4.1 Useful life L
- E.4.2 Factor L0
- E.4.3 Factor (0
- E.5 Aluminium, non-solid electrolyte capacitors
- E.6 Relays
- E.7 Switches and keyboards
- E.8 Connectors
- Table E.1 – Useful life limitations for switches and keyboards
- Annex F (informative) Physics of failure [Go to Page]
- F.1 General
- F.2 Failure mechanisms of integrated circuits
- Table F.1 – Failure mechanism for Integrated circuits
- Annex G (informative) Considerations for the design of a data base on failure rates [Go to Page]
- G.1 General
- G.2 Data collection acquisition – collection process
- G.3 Which data to collect and how to collect it
- G.4 Calculation and decision making
- G.5 Data descriptions
- G.6 Identification of components [Go to Page]
- G.6.1 General
- G.6.2 Component identification
- G.6.3 Component technology
- G.7 Specification of components [Go to Page]
- G.7.1 General
- G.7.2 Electrical specification of components
- G.7.3 Environmental specification of components
- G.8 Field related issues data [Go to Page]
- G.8.1 General
- G.8.2 Actual field conditions
- G.8.3 Data on field failures
- G.9 Test related issues data [Go to Page]
- G.9.1 General
- G.9.2 Actual test conditions
- G.9.3 Data on test failures
- G.10 Failure rate database attributes
- Table G.1 – Reliability prediction database attributes
- Annex H (informative) Potential sources of failure rate data and methods of selection [Go to Page]
- H.1 General
- H.2 Data source selection
- H.3 User data
- H.4 Manufacturer’s data
- H.5 Handbook reliability data [Go to Page]
- H.5.1 General
- H.5.2 Using handbook data with this document
- H.5.3 List of available handbooks
- Table H.1 – Result of calculation for transistors common, low frequency
- Table H.2 – Sources of reliability data (in alphabetical order)
- Annex I (informative) Overview of component classification [Go to Page]
- I.1 General
- I.2 The IEC 61360 system
- Table I.1 – Classification tree (IEC 61360-4) [Go to Page]
- I.3 Other systems [Go to Page]
- I.3.1 General
- I.3.2 NATO stock numbers
- I.3.3 UNSPSC codes
- I.3.4 STEP/EXPRESS
- I.3.5 IECQ
- I.3.6 ECALS
- I.3.7 ISO 13584
- I.3.8 MIL specifications
- Annex J (informative) Presentation of component reliability data [Go to Page]
- J.1 General
- J.2 Identification of components [Go to Page]
- J.2.1 General
- J.2.2 Component identification
- J.2.3 Component technology
- J.3 Specification of components [Go to Page]
- J.3.1 General
- J.3.2 Electrical specification of components
- J.3.3 Environmental specification of components
- J.4 Test related issues data [Go to Page]
- J.4.1 General
- J.4.2 Actual test conditions
- J.5 Data on test failures
- Annex K (informative) Examples [Go to Page]
- K.1 Integrated circuit
- K.2 Transistor
- K.3 Capacitor
- K.4 Relay
- Bibliography [Go to Page]