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eLibrary > PD IEC TR 61189-5-506:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test >

PD IEC TR 61189-5-506:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test, 2019

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PD IEC TR 61189-5-506:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test, 2019

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CONTENTS
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test board concept for intercomparison [Go to Page]
4.1 The need for a fine-pitch SIR pattern
4.2 Test board design
4.3 Test board fluxing
Figures [Go to Page]
Figure 1 – TB144
Tables [Go to Page]
Table 1 – SIR pattern information
5 Test procedure for intercomparison [Go to Page]
5.1 Sample preparation
Table 2 – Flux to be used for SIR evaluation test
Table 3 – Samples for SIR evaluation testing
5.2 Preparation of samples for humidity chamber
5.3 Placement of samples inside the humidity chamber
Figure 2 – Connector arrangement
5.4 Resistance measurements
5.5 Evaluation of results
5.6 Additional information
6 Results [Go to Page]
Figure 3 – Sample orientation in test chamber
Figure 4 – Participants' (a to f) resistance measurements for the six test patterns on the checkerboard
Figure 5 – Participant A control boards
Figure 6 – Participant A flux loaded boards
Figure 7 – Participant B control boards
Figure 8 – Participant B flux loaded boards
Figure 9 – Participant C control boards
Figure 10 – Participant C flux loaded boards
Figure 11 – Participant D control boards
Figure 12 – Participant D flux loaded boards
Figure 13 – Participant E control boards
Figure 14 – Participant E flux loaded boards
Figure 15 – Participant F control boards
Figure 16 – Participant F flux loaded boards
Figure 17 – Participant G control boards
Figure 18 – Participant G flux loaded boards
Figure 19 – Participant D, and evidence of a fibre and the effect on the SIR
Figure 20 – Participant E and evidence of corrosion shorting across the gap
Figure 21 – Participant G and evidence of a water droplet and the resulting drop in SIR and dendrite like failure
Figure 22 – Participant G and a corrosion defect probably from a flux residue
Figure 23 – Participant C dendrites and corrosions formed on all SIR patternsof all fluxed samples tested at 85°C/85%
Figure 24 – The average final SIR value for the control boards
Figure 25 – The average final SIR value for the flux loaded boards
Figure 26 – The average final SIR for flux-loaded patterns by participant
Figure 27 – Final SIR plotted as ohm.squares
Figure 28 – Ratio of the log Ω.square value to the 500-µm pattern
Bibliography [Go to Page]

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PD IEC TR 61189-5-506:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test, 2019

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