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eLibrary > PD CEN/TR 17603-32-25:2022 Space engineering. Mechanical shock design and verification handbook >

PD CEN/TR 17603-32-25:2022 Space engineering. Mechanical shock design and verification handbook, 2022

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PD CEN/TR 17603-32-25:2022 Space engineering. Mechanical shock design and verification handbook, 2022

undefined [Go to Page]
2.4 24BReferences of Part 4
3.1 25BTerms and definitions from other documents
3.2 26BTerms and definitions specific to the present document
3.3 27BAbbreviated terms
4 6BBackground – Shock environment description [Go to Page]
4.1 28BShock definition and main characteristics [Go to Page]
4.1.4 92BShock response spectra (SRS)
5 7BShock events [Go to Page]
5.1 29BShock occurrence
5.2 30BShock environmental categories
6 8BIntroduction to shock design and verification process [Go to Page]
6.1 31BPresentation of the global process
6.2 32BMeans to conduct an evaluation of shock environment and criticality
7 9BShocks in spacecraft [Go to Page]
7.1 33BOverview
7.2 34BPotential shock sources for spacecraft
7.3 35BShocks devices description
7.4 36BDetailed information on specific shock events [Go to Page]
7.4.1 93BOverview
7.4.2 94BLauncher induced shocks
7.4.3 95BClampband release
7.5 37BConclusion
8 10BShock inputs derivation by similarityheritageextrapolation [Go to Page]
8.1 38BOverview
9 11BShock inputs derivation by numerical analysis
10 12BDeriving a specification from a shock environment [Go to Page]
[Go to Page]
7.4.4 96BOther S/C separation systems
7.4.5 97BInternal shock sources
7.4.6 98BLanding and splashdown
8.2 39BSimilarity-heritage-extrapolation methods principle [Go to Page]
8.2.1 99BOverview
8.2.2 100BUse of database
8.2.3 101BZoning procedure
8.2.4 102BSRS ratio as approximation of transfer functions
8.2.5 103BDifference between structural model and flight model
8.2.6 104BStatistical methods to derive maximum expected environment
8.3 40BSimilarity-heritage-extrapolation methods in practice [Go to Page]
8.3.1 105BMethod A – Point source excitation
8.3.2 106BMethod B – Clampband excitation
8.3.3 107BMethod C – Launcher induced shock
8.3.4 108BMethod D – Unified approach and practical implementation of attenuation rules for typical spacecraft shock generated environments
8.3.5 109BAdditional attenuation factors
8.3.6 110BMethod E – Shock responses in instruments
9.1 41BNumerical simulation principles [Go to Page]
9.1.1 111BRationale and limitations
9.2 42BFinite Element Analysis (FEA) Numerical methods [Go to Page]
9.2.1 112BComparison of explicit and implicit methods
9.2.2 113BExplicit and implicit integration schemes
9.2.3 114BExample of simulation codes (implicit and explicit)
9.2.4 115BModelling aspects
9.3 43BStatistical Energy Analysis (SEA) Numerical Methods [Go to Page]
9.3.1 116BThe classical SEA approach
9.3.2 117BThe Transient SEA formulation
9.3.3 118BPrediction of shock response by Local Modal Phase Reconstruction (LMPR)
9.3.4 119BVirtual SEA modelling for robust SEA modelling in the mid-frequency
9.4 44BBest practices for shock derivation by simulation
9.5 45BExamples of methodology for numerical simulation [Go to Page]
9.5.1 120BNumerical simulation for clampband release
9.5.2 121BNumerical simulation for Shogun
10.1 46BSpecification tool
11 13BShock attenuation
12 14BGeneral approach to shock verification [Go to Page]
[Go to Page]
9.5.3 122BNumerical simulation for launcher induced shock
9.5.4 123BImplicit vs. explicit method: Example of a shock prediction on a complex structure
9.5.5 124BShock prediction analysis examples using SEA-Shock module of SEA+ software
10.2 47BDeriving the qualification environment – MEE and qualification margin
10.3 48BFrom level derivation/Measure to specification
11.1 49BDefinitions [Go to Page]
11.1.1 125BHistory of shock attenuation
11.1.2 126BImpedance breakdown
11.1.3 127BShock and vibration Isolator
11.1.4 128BDamper
11.1.5 129BShock absorber
11.2 50BTheoretical background [Go to Page]
11.2.1 130BShock attenuation problematic approach
11.2.2 131BShock isolator device features
11.2.3 132BRubber and damping effect
11.2.4 133BElastomer type selection
11.3 51BAttenuator device development [Go to Page]
11.3.1 134BOverview
11.3.2 135BAttenuator requirement definition
11.3.3 136BAttenuator device development logic
11.4 52BAttenuator device manufacturing [Go to Page]
11.4.1 137BOverview
11.4.2 138BManufacturing process
11.4.3 139BMoulding technology
11.4.4 140BManufacturing limitations
11.5 53BProduct assurance logic
11.6 54BExisting attenuator products [Go to Page]
11.6.1 141BOverview
11.6.2 142BCompact shock attenuators for electronic equipment
11.6.3 143BSASSA (shock attenuator system for spacecraft and adaptor)
11.6.4 144BShock isolators for EXPERT on-board equipment
12.1 55BRationale for shock verification
12.2 56BTest rationale and model philosophy
12.3 57BEnvironmental test categories
13 15BShock testing
14 16BData analysis tools for shock [Go to Page]
[Go to Page]
12.2.1 145BQualification test
12.2.2 146BAcceptance test
12.2.3 147BSystem / subsystem distinction
12.2.4 148BModel philosophy
12.3.1 149BCombination or separation of sources
12.3.2 150BPyroshock environmental categories
12.4 58BShock sensitive equipment and severity criteria [Go to Page]
12.4.1 151BIdentification of shock sensitive equipment
12.4.2 152BSeverity criteria
12.4.3 153BSynthesis
12.5 59BEquivalence between shock and other mechanical environment [Go to Page]
12.5.1 154BQuasi static equivalence – effective mass method
12.5.2 155BUse of sine vibration test data
12.5.3 156BUse of random vibration test data
12.6 60BSimilarity between equipment – Verification by similarity [Go to Page]
12.6.1 157BIntroduction
12.6.2 158BSimilarity criteria for shock
12.6.3 159BExample of process for verification by similarity
12.7 61BSpecific guidelines for shock verification [Go to Page]
12.7.1 160BOptical instrument
12.7.2 161BPropulsion sub system
13.1 62BShock test specifications [Go to Page]
13.1.1 162BTest levels and forcing function
13.1.2 163BNumber of applications
13.1.3 164BMounting conditions
13.1.4 165BTest article operation
13.1.5 166BSafety and cleanliness
13.1.6 167BInstrumentation
13.1.7 168BTest tolerances
13.1.8 169BTest success criteria
13.2 63BCriteria for test facility selection
13.3 64BTest methods and facilities [Go to Page]
13.3.1 170BBasis
13.3.2 171BProcedure I – System level shock test
13.4 65BTest monitoring
15 17BShock data validation
16 18BIntroduction to shock damage risk assessment and objective [Go to Page]
[Go to Page]
13.3.3 172BProcedure II – Equipment shock test by pyrotechnic device (explosive detonation)
13.3.4 173BProcedure III – Equipment shock test by mechanical impact (metal-metal impact)
13.3.5 174BProcedure IV – Equipment shock test with an electrodynamic shaker
13.4.1 175BAccelerometers
13.4.2 176BStrain gauges
13.4.3 177BLoad cells
13.4.4 178BLaser vibrometer
13.4.5 179BAcquisition systems
13.5 66BIn-flight shock monitoring [Go to Page]
13.5.1 180BOverview
13.5.2 181BVEGA in-flight acquisition systems
14.1 67BIntroduction
14.2 68BShock Response Spectra (SRS) [Go to Page]
14.2.1 182BBasis
14.2.2 183BDefinition
14.2.3 184BSRS properties
14.2.4 185BSRS algorithm
14.2.5 186BRecommendations on SRS computation
14.2.6 187BQ-factor
14.2.7 188BSRS limitations
14.3 69BFast Fourier Transform (FFT) [Go to Page]
14.3.1 189BFFT definition
14.3.2 190BPrecautions
14.4 70BTime-Frequency Analysis (TFA) [Go to Page]
14.4.1 191BGeneral
14.4.2 192BLinear Time-Frequency Transform (TFT)
14.4.3 193BQuadratic Time-Frequency Transform
14.4.4 194BInterpretation and precautions
14.5 71BProny decomposition [Go to Page]
14.5.1 195BDefinition
14.5.2 196BBasic scheme
14.5.3 197BAdvanced scheme
14.6 72BDigital filters
15.1 73BOverview
15.2 74BVisual inspection
17 19BUnit susceptibility with respect to shock [Go to Page]
2.1 21BReferences of Part 1
2.2 22BReferences of Part 2 [Go to Page]
14.5.4 198BUse and limitation
14.6.1 199BBasis
14.6.2 200BDefinition and parameters
14.6.3 201BFIR filters
14.6.4 202BIIR filters
14.6.5 203BPrecautions
15.3 75BData analysis – simplified criteria [Go to Page]
15.3.1 204BDuration analysis
15.3.2 205BValidity frequency range
15.3.3 206BFinal validity criteria - Positive versus negative SRS
15.4 76BData analysis – refined criteria – Velocity validation
15.5 77BCorrections for anomalies [Go to Page]
15.5.1 207BOverview
15.5.2 208BCorrection for zeroshift
15.5.3 209BCorrection for power line pickup
16.1 78BOverview
16.2 79BAssessment context
16.3 80BOutputs of SDRA and associated limitations
17.1 81BOverview
17.2 82BDerivation of qualification shock levels at unit interface
17.3 83BIdentification of critical frequency ranges
17.4 84BConsiderations related to life duration and mission
17.5 85BList of shock sensitive components/units [Go to Page]
17.5.1 210BOverview
17.5.2 211BElectronic components and associated degradation modes
17.5.3 212BFunctional mechanical assemblies
17.5.4 213BMechanisms and associated degradation modes
18 20BShock damage risk analysis [Go to Page]
18.1 86BRequired inputs for detailed SDRA
18.2 87BEvaluation of transmissibility between equipment and sensitive components interfaces [Go to Page]
18.2.1 214BOverview
18.2.2 215BDerivation by extrapolation from test data
18.2.3 216BShock response prediction based on transmissibility
18.3 88BVerification method per type of components and/or units
2.3 23BReferences of Part 3 [Go to Page]
4.1.1 89BShock definition
4.1.2 90BPhysical aspects of shocks
4.1.3 91BMain shock effects [Go to Page]
4.1.4.1 222BOverview
4.1.4.2 223BShock response spectra definition
4.1.4.3 224BSRS properties
18.2.4 217BGuideline for equipment shock analysis
18.3.1 218BElectronic equipment
18.3.2 219BMechanisms – Ball bearings
18.3.3 220BValves
18.3.4 221BOptical components
1 3BScope
2 4BReferences
3 5BTerms, definitions and abbreviated terms [Go to Page]
[Go to Page]
[Go to Page]
4.1.4.4 225BRecommendations on SRS calculation
4.1.4.5 226BSRS limitations
7.4.2.1 227BExample of spacecraft/LV shock compatibility test – SHOGUN
7.4.2.2 228BExample of spacecraft/LV shock compatibility test – VESTA
7.4.3.1 229BOverview
7.4.3.2 230BStandard clampband device
7.4.3.3 231BLow shock clampband device
7.4.4.1 232BMechanical lock systems by EUROCKOT
7.4.4.2 233BPSLV separation system
7.4.4.3 234BDnepr explosive bolts
7.4.4.4 235BAriane 5 micro satellite separation system
7.4.4.5 236BSoyouz Dispenser
8.2.2.1 237BCharacterization database
8.2.2.2 238BSpacecraft test results databases
8.2.6.1 239BOverview
8.2.6.2 240BNormal Tolerance Limit method
8.2.6.3 241BBootstrap method
8.2.6.4 242BComparison between P99/90 and P95/50+3 dB levels
8.2.6.5 243BConclusions
8.3.1.1 244BPresentation of the used method
8.3.1.2 245BExample 1 – Shock mapping of the EXPERT re-entry vehicle due to separation from LV
8.3.1.3 246BExample 2 – Internal shock induced by appendages deployment
8.3.2.1 247BPresentation of the used method
8.3.2.2 248BGeneral observations for a better understanding of Clampband release shock propagation
8.3.3.1 249BPresentation of the used method
8.3.3.2 250BGeneral observations for a better understanding of launcher induced shock propagation
8.3.3.3 251BDifferences between clampband and launcher induced shock
8.3.4.1 252BJunction attenuation factors
8.3.4.2 253BDistance attenuation factors
8.3.4.3 254BCalculation of total shock attenuation factors and derivation of shock output
8.3.4.4 255BCorrection factors
8.3.4.5 256BMethodology correlation with test results
8.3.4.6 257BExample of implementation of the methodology
8.3.6.1 258BMethod E-1: Transmissibility approach – transfer function scaled to input shock specification
8.3.6.2 259BMethod E-2: Transient analysis approach – coupled analysis with platform
9.2.4.1 260BMeshing size
9.2.4.2 261BTime step
9.2.4.3 262BElements type
9.2.4.4 263BModelling of equipment
9.2.4.5 264BRestitution point
9.2.4.6 265BModelling of junctions
9.2.4.7 266BDamping modelling
9.2.4.8 267BSource modelling and boundary conditions
9.5.3.1 268BOverview
9.5.3.2 269BA5 / MSG coupled shock analyses
9.5.3.3 270BAriane5 Low Shock Recovery Plan Analyses
9.5.3.4 271BSynthesis
11.2.4.1 272BOverview
11.2.4.2 273BNatural rubber
11.2.4.3 274BBlack Synthetic rubbers
11.2.4.4 275BSilicon rubbers
11.3.2.1 276BIntroduction
11.3.2.2 277BPerformance specification
11.3.2.3 278BEnvironment definition
11.3.2.4 279BImportant factors affecting isolator selection / definition
11.3.2.5 280BModel specification
11.3.3.1 281BIntroduction
11.3.3.2 282BAttenuator pre-dimensioning
11.3.3.3 283BMaterial characterization
11.3.3.4 284BDesign preliminaries
11.3.3.5 285BPrototyping
11.3.3.6 286BAttenuator design development
11.6.2.1 287BPurpose of shock isolation device
11.6.2.2 288BShock isolation device principle
11.6.2.3 289BPerformance achieved with the isolator device
11.6.3.1 290BRequirement specification analysis
11.6.3.2 291BBaseline design presentation (QM for pre-qualification)
11.6.3.3 292BSASSA system qualification with Eurostar3000 STM
11.6.3.4 293BSASSA lessons learnt
11.6.4.1 294BOverview
11.6.4.2 295BMain Technical specifications and assessments
11.6.4.3 296BPresentation of the design
11.6.4.4 297BPerformances
12.2.1.1 298BQualification shock test on QM unit
12.2.1.2 299BCase of re-test on QM unit
12.2.1.3 300BCase of qualification shock test on PFM unit
12.4.2.1 301BOverview
12.4.2.2 302BElectronic units
12.4.2.3 303BStructural and non-sensitive equipment
12.4.2.4 304BOther sensitive units
12.5.1.1 305BDefinition
12.5.1.2 306BExample of application
12.5.1.3 307BApplicability and limitations:
12.5.3.1 308BIntroduction
12.5.3.2 309BSignal processing tools to convert random PSD into Response Spectrum
12.5.3.3 310BApplicability of random equivalence w.r.t. shock
12.6.3.1 311BAt complete unit level
12.6.3.2 312BAt Sub-equipment level (module, PCB,…)
12.6.3.3 313BAt component level (module, PCB,…)
12.6.3.4 314BComplementary activities to support a verification by similarity
12.7.1.1 315BOverview
12.7.1.2 316BOptical instrument definition and sensitive components
12.7.1.3 317BTypical instrument architecture and accommodation on the spacecraft
12.7.1.4 318BGeneral design rules w.r.t. shock
12.7.1.5 319BVerification logic w.r.t. shock
12.7.2.1 320BOverview
12.7.2.2 321BPropulsion sub-system description
12.7.2.3 322BPropulsion shock source
12.7.2.4 323BGeneral design rules
12.7.2.5 324BVerification of the propulsion sub-system w.r.t. shock environment
13.3.2.1 325BTest configuration
13.3.2.2 326BShock test required by Launcher Authority
13.3.2.3 327BShock test required by Spacecraft
13.3.2.4 328BTest sequence
13.3.2.5 329BSystem test specificities
13.3.3.1 330BTest facility presentation
13.3.3.2 331BTest sequence
13.3.4.1 332BTest facility presentation
13.3.4.2 333BTest sequence
13.3.5.1 334BIntroduction
13.3.5.2 335BTest facility presentation
13.3.5.3 336BShaker test specificities
13.4.1.1 337BPiezoelectric accelerometers (PE)
13.4.1.2 338BPiezoelectric accelerometers with integrated electronics (IEPE)
13.4.1.3 339BPiezoresistive accelerometers (PR)
13.4.1.4 340BShock sensor selection criteria
13.4.1.5 341BCharge amplifiers
13.4.1.6 342BAccelerometer mounting
13.4.1.7 343BAccelerometer cabling
13.4.2.1 344BOverview
13.4.2.2 345BType of resistance elements
13.4.2.3 346BGauge size
13.4.2.4 347BConditions of bonding (gluing or adhesion) of the strain gauge to the structure
13.4.2.5 348BSensitivity
13.4.2.6 349BFactors affecting optimum excitation
13.4.2.7 350BThermal Considerations
13.4.2.8 351BPotential Error Sources
13.4.5.1 352BOverview
13.4.5.2 353BFar field and mid field measurements
13.4.5.3 354BNear field measurements
13.4.5.4 355BConcerns with acceleration measurement with transducers: zero shift during shock, or dynamic offset
13.4.5.5 356BConcerns with strain measurement via cables glued to the structure
13.4.5.6 357BAnalog versus digital
13.4.5.7 358BPreventive techniques for clean measurement
14.4.2.1 359BOverview
14.4.2.2 360BShort-time Fourier transform
14.4.2.3 361BWavelet Transform (WT)
14.4.3.1 362BOverview
14.4.3.2 363BSpectrogram
14.4.3.3 364BWigner-Ville Distribution (WVD)
14.4.3.4 365BPseudo Wigner-Ville Distribution (PWVD)
14.4.3.5 366BSmoothed-Pseudo Wigner-Ville Distribution
15.3.2.1 367BOverview
15.3.2.2 368BSignal duration
15.3.2.3 369BBackground noise
15.3.2.4 370BData sampling
15.5.3.1 371BOverview
15.5.3.2 372BPower line pick-up cleaning principle
15.5.3.3 373BPower line pick-up cleaning steps
15.5.3.4 374BPrecautions
17.5.2.1 375BRelay
17.5.2.2 376BQuartz
17.5.2.3 377BMagnetic component (RM), transformer and self
17.5.2.4 378BHybrid
17.5.2.5 379BTantalum capacitor
17.5.2.6 380BHeavy or large component
17.5.2.7 381BOptical components and connectors
17.5.2.8 382BComponents mounted on low insertion force DIP socket
17.5.2.9 383BMobile Particles in the cavities of electronic components
17.5.2.10 384BSynthesis on threshold levels
17.5.3.1 385BOverview
17.5.3.2 386BRF channel filters (IMUX, OMUX,…)
17.5.3.3 387BIso-static mount and bonding
18.2.4.1 388BOverview
18.2.4.2 389BMethod 1 - Transient excitation of unit-plate coupled system
18.2.4.3 390BMethod 2 – Base transient excitation of the unit
18.2.4.4 391BMethod 3 - Modal solutions
18.2.4.5 392BExample of advanced transient (method 2) and spectrum response analyses (method 3B)
18.3.1.1 393BVerification methodology
18.3.1.2 394BValidation for structural parts
18.3.1.3 395BValidation for component mounting technologies
18.3.1.4 396BValidation for acceleration sensitive components
18.3.1.5 397BGeneral considerations on equipment design and verification w.r.t. shock
18.3.1.6 398BImportant considerations for robust equipment design w.r.t. shock
18.3.1.7 399BSDRA example 1 – Damage assessment of a large hybrid on PCB
18.3.1.8 400BSDRA example 2 – Damage assessment of relay mounted on a PCB
18.3.2.1 401BVerification methodology
18.3.2.2 402BBearing applications
18.3.2.3 403BMethods of Bearing Preloading
18.3.2.4 404BBearing Damage
18.3.2.5 405BAnalysis of Bearing Loads, Deflections and Stresses
18.3.2.6 406BConsequences of dynamic behaviour
18.3.2.7 407BLogic for Allowable Stresses Resulting from Shock
18.3.2.8 408BDerivation of guidelines for SDRA of bearings
18.3.2.9 409BGuidelines for calculating allowable shock-induced peak Hertzian contact stress levels and bearing gapping
18.3.2.10 410BRole of the Lubricant
18.3.2.11 411BExamples and Application of Method
18.3.2.12 412BSDRA example 1 – MSG Scan Mirror Bearing
18.3.2.13 413BSDRA example 2 – MSG Scan Mirror Bearing – Higher loads inducing gapping
18.3.3.1 414BVerification methodology
18.3.3.2 415BSDRA Example 1 – Valve with mechanical “stop-end”
18.3.3.3 416BSDRA Example 2 – Valve without mechanical “stop-end”
18.3.4.1 417BVerification methodology
18.3.4.2 418BEvaluation of stress induced by the shock transient
18.3.4.3 419BStructural brittle materials
18.3.4.4 420BSDRA example – Mirror mounted on “mirror cell” and ISM [Go to Page]

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