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21/30437739 DC BS EN 16603-20-07. Space engineering. Electromagnetic compatibility, 2021
- JTC5_JT005179_enq1e.pdf [Go to Page]
- 1 Scope
- 2 Normative references
- 3 Terms, definitions and abbreviated terms [Go to Page]
- 3.1 Terms from other standards
- 3.2 Terms specific to the present standard
- 3.3 Abbreviated terms
- 4 Requirements [Go to Page]
- 4.1 General system requirements
- 4.2 Detailed system requirements [Go to Page]
- 4.2.1 Overview
- 4.2.2 EMC with the launch system [Go to Page]
- 4.2.2.1 Overview
- 4.2.2.2 Detailed system requirements
- 4.2.3 Lightning environment [Go to Page]
- 4.2.3.1 Overview
- 4.2.3.2 Requirements to the space system
- 4.2.4 Spacecraft charging and effects [Go to Page]
- 4.2.4.1 Overview
- 4.2.4.2 EMI control requirements to system and equipment in relation with ESD
- 4.2.5 Spacecraft DC magnetic emission [Go to Page]
- 4.2.5.1 Spacecraft with susceptible payload
- 4.2.5.2 Attitude control system (ACS)
- 4.2.6 Radiofrequency compatibility
- 4.2.7 Hazards of electromagnetic radiation
- 4.2.8 Intrasystem EMC
- 4.2.9 EMC with ground equipment
- 4.2.10 Grounding [Go to Page]
- 4.2.10.1 Overview
- 4.2.10.2 Requirements
- 4.2.11 Electrical bonding requirements [Go to Page]
- 4.2.11.1 Overview
- 4.2.11.2 Normative provisions
- 4.2.11.3 External grounds
- 4.2.12 Shielding (excepted wires and cables) [Go to Page]
- 4.2.12.1 Overview
- 4.2.12.2 Requirement
- 4.2.13 Wiring (including wires and cables shielding) [Go to Page]
- 4.2.13.1 Classification of cables
- 4.2.13.2 Cable shields
- 5 Verification [Go to Page]
- 5.1 Overview [Go to Page]
- 5.1.1 Introduction
- 5.1.2 Electromagnetic effects verification plan
- 5.1.3 Electromagnetic effects verification report
- 5.2 Test conditions [Go to Page]
- 5.2.1 Measurement tolerances
- 5.2.2 Test site [Go to Page]
- 5.2.2.1 Overview
- 5.2.2.2 Shielded enclosures
- 5.2.2.3 Ambient electromagnetic level
- 5.2.2.4 Ambient conducted level
- 5.2.3 Ground plane [Go to Page]
- 5.2.3.1 General
- 5.2.3.2 Metallic ground plane
- 5.2.3.3 Composite ground plane
- 5.2.4 Power source impedance
- 5.2.5 General test precautions [Go to Page]
- 5.2.5.1 Safety
- 5.2.5.2 Excess personnel and equipment
- 5.2.5.3 Overload precautions
- 5.2.6 EUT test configurations [Go to Page]
- 5.2.6.1 General
- 5.2.6.2 Bonding of EUT
- 5.2.6.3 Shock and vibration isolators
- 5.2.6.4 Safety grounds
- 5.2.6.5 Orientation of EUTs
- 5.2.6.6 Construction and arrangement of EUT cables
- 5.2.6.7 Electrical and mechanical interfaces
- 5.2.7 Operation of EUT [Go to Page]
- 5.2.7.1 General
- 5.2.7.2 Operating frequencies for tuneable RF equipment
- 5.2.7.3 Operating frequencies for spread spectrum equipment
- 5.2.7.4 Susceptibility monitoring
- 5.2.8 Use of measurement equipment [Go to Page]
- 5.2.8.1 Overview
- 5.2.8.2 Detector
- 5.2.8.3 Calibration fixture (jig)
- 5.2.9 Emission testing [Go to Page]
- 5.2.9.1 Bandwidths
- 5.2.9.2 Emission identification
- 5.2.9.3 Frequency scanning
- 5.2.9.4 Emission data presentation
- 5.2.10 Susceptibility testing [Go to Page]
- 5.2.10.1 Frequency stepping
- 5.2.10.2 Modulation of susceptibility signals
- 5.2.10.3 Thresholds of susceptibility
- 5.2.10.4 Susceptibility data presentation
- 5.2.11 Calibration of measuring equipment [Go to Page]
- 5.2.11.1 General
- 5.2.11.2 Measurement system test
- 5.2.12 Power bus voltage
- 5.2.13 Photographic data
- 5.3 System level [Go to Page]
- 5.3.1 General
- 5.3.2 Safety margin demonstration for critical or EED circuits
- 5.3.3 EMC with the launch system
- 5.3.4 Lightning
- 5.3.5 Spacecraft and static charging
- 5.3.6 Spacecraft DC magnetic field emission
- 5.3.7 Intra–system electromagnetic compatibility
- 5.3.8 Radiofrequency compatibility
- 5.3.9 Grounding
- 5.3.10 Electrical bonding
- 5.3.11 Wiring and shielding
- 5.4 Equipment and subsystem level test procedures [Go to Page]
- 5.4.1 Overview
- 5.4.2 CE, power leads, differential mode, 30 Hz to 100 kHz [Go to Page]
- 5.4.2.1 Purpose
- 5.4.2.2 Test equipment
- 5.4.2.3 Setup
- 5.4.2.4 Procedure
- 5.4.3 CE, power and signal leads, 50 kHz to 100 MHz [Go to Page]
- 5.4.3.1 Purpose
- 5.4.3.2 Test equipment
- 5.4.3.3 Setup
- 5.4.3.4 Procedures
- 5.4.4 CE, power leads, inrush current [Go to Page]
- 5.4.4.1 Purpose
- 5.4.4.2 Test equipment
- 5.4.4.3 Setup
- 5.4.4.4 Procedures
- 5.4.4.5 Data presentation
- 5.4.5 DC Magnetic field emission, magnetic moment [Go to Page]
- 5.4.5.1 Overview
- 5.4.5.2 Set-Up
- 5.4.5.3 Test sequence
- 5.4.5.4 Data presentation
- 5.4.6 RE, electric field, 30 MHz to 18 GHz [Go to Page]
- 5.4.6.1 Purpose
- 5.4.6.2 Test equipment
- 5.4.6.3 Test setup
- 5.4.6.4 Test procedures
- 5.4.6.5 Data Presentation
- 5.4.7 CS, power leads, 30 Hz to 100 kHz [Go to Page]
- 5.4.7.1 Purpose
- 5.4.7.2 Test equipment
- 5.4.7.3 Setup
- 5.4.7.4 Procedures
- 5.4.8 CS, bulk cable injection, 50 kHz to 100 MHz [Go to Page]
- 5.4.8.1 Purpose
- 5.4.8.2 Test equipment
- 5.4.8.3 Setup
- 5.4.8.4 Test procedures
- 5.4.9 CS, power leads, transients [Go to Page]
- 5.4.9.1 Purpose
- 5.4.9.2 Test equipment
- 5.4.9.3 Setup
- 5.4.9.4 Procedures
- 5.4.10 RS, magnetic field, 30 Hz to 100 kHz [Go to Page]
- 5.4.10.1 Purpose
- 5.4.10.2 Test equipment
- 5.4.10.3 Setup
- 5.4.10.4 Test procedures
- 5.4.10.5 Data Presentation
- 5.4.11 RS, electric field, 30 MHz to 18 GHz [Go to Page]
- 5.4.11.1 Purpose and overview
- 5.4.11.2 Test equipment
- 5.4.11.3 Test setup
- 5.4.11.4 Test procedures
- 5.4.11.5 Test report content and data presentation
- 5.4.12 Susceptibility to wire-coupled electrostatic discharges (legacy method) [Go to Page]
- 5.4.12.1 Overview
- 5.4.12.2 Test equipment
- 5.4.12.3 Setup
- 5.4.12.4 Procedure
- 5.4.12.5 Data presentation
- 5.4.13 Susceptibility to wire-coupled electrostatic discharges (current injection probe method) [Go to Page]
- 5.4.13.1 Overview
- 5.4.13.2 Test equipment
- 5.4.13.3 Calibration
- 5.4.13.4 EUT testing
- 5.4.13.5 Data presentation
- 5.4.14 Susceptibility to electrostatic discharges into the chassis [Go to Page]
- 5.4.14.1 Overview
- 5.4.14.2 Test equipment
- 5.4.14.3 Test setup
- 5.4.14.4 Procedure
- 5.4.14.5 Data presentation
- 5.4.15 CE, power leads, time domain [Go to Page]
- 5.4.15.1 Purpose
- 5.4.15.2 Test equipment
- 5.4.15.3 Test setup
- 5.4.15.4 Procedure
- 5.4.15.5 Data presentation [Go to Page]
