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BS EN IEC 61280-4-1:2019+A1:2022 Fibre-optic communication subsystem test procedures - Installed cabling plant. Multimode attenuation measurement, 2023
- undefined
- English [Go to Page]
- CONTENTS
- FOREWORD
- 1 Scope
- 2 Normative references
- 3 Terms, definitions, graphical symbols and abbreviated terms [Go to Page]
- 3.1 Terms and definitions
- 3.2 Graphical symbols
- Figures [Go to Page]
- Figure 1 – Connector symbols
- Figure 2 – Symbol for cabling under test
- 3.3 Abbreviated terms
- 4 Test methods [Go to Page]
- 4.1 General
- 4.2 Cabling configurations and applicable test methods
- Tables [Go to Page]
- Table 1 – Cabling configurations
- Table 2 – Test methods and configurations
- Figure 3 – Reference plane for configuration A tested with the 1-cord method
- Figure 4 – Reference plane for configuration B tested with the 3-cord method
- 5 Overview of uncertainties [Go to Page]
- 5.1 General
- 5.2 Sources of significant uncertainties
- Figure 5 – Reference plane for configuration C tested with the 2-cord method
- Figure 6 – Reference plane for configuration D tested with the EC method
- 5.3 Consideration of the PM
- 5.4 Consideration of test cord connector grade
- 5.5 Typical uncertainty values
- Table 3 – Measurements bias related to test cord connector grade
- 6 Apparatus [Go to Page]
- 6.1 General
- 6.2 Light source [Go to Page]
- 6.2.1 Stability
- 6.2.2 Spectral characteristics (LSPM measurement)
- Table 4 – Uncertainty for a given attenuation at 850 nm
- Table 5 – Spectral requirements
- 6.3 Launch cord
- 6.4 Receive or tail cord
- 6.5 Substitution cord
- 6.6 Power meter – LSPM methods only
- 6.7 OTDR apparatus
- Figure 7 – OTDR schematic
- 6.8 Connector end face cleaning and inspection equipment
- 6.9 Adapters
- 7 Procedures [Go to Page]
- 7.1 General
- 7.2 Common procedures [Go to Page]
- 7.2.1 Care of the test cords
- 7.2.2 Make reference measurements (LSPM methods only)
- 7.2.3 Inspect and clean the ends of the optical fibres in the cabling
- 7.2.4 Make the measurements
- 7.2.5 Make the calculations
- 7.2.6 Duplex and bi-directional testing
- 7.3 Calibration
- 7.4 Safety
- 8 Calculations
- 9 Documentation [Go to Page]
- 9.1 Information for each test
- 9.2 Information to be available
- Annexes [Go to Page]
- Annex A (normative) One-cord method [Go to Page]
- A.1 Applicability of test method
- A.2 Apparatus
- A.3 Procedure
- A.4 Calculation
- A.5 Components of reported attenuation
- Figure A.1 – Reference measurement
- Figure A.2 – Test measurement
- Annex B (normative) Three-cord method [Go to Page]
- B.1 Applicability of test method
- B.2 Apparatus
- B.3 Procedure
- Figure B.1 – Reference measurement [Go to Page]
- B.4 Calculations
- B.5 Components of reported attenuation
- Figure B.2 – Test measurement
- Annex C (normative) Two-cord method [Go to Page]
- C.1 Applicability of test method
- C.2 Apparatus
- C.3 Procedure
- Figure C.1 – Reference measurement [Go to Page]
- C.4 Calculations
- C.5 Components of reported attenuation
- Figure C.2 – Test measurement
- Figure C.3 – Test measurement for plug-socket style connectors
- Annex D (normative) Equipment cord method [Go to Page]
- D.1 Applicability of the test method
- D.2 Apparatus
- D.3 Procedure
- D.4 Calculation
- D.5 Components of reported attenuation
- Figure D.1 – Reference measurement
- Figure D.2 – Test measurement [Go to Page]
- D.6 Typical uncertainty values
- Table D.1 – Uncertainty for a given attenuation at 850 nm
- Annex E (normative) Optical time domain reflectometer [Go to Page]
- E.1 Applicability of the test method
- E.2 Apparatus [Go to Page]
- E.2.1 General
- E.2.2 OTDR
- E.2.3 Test cords
- E.3 Procedure (test method)
- Figure E.1 – OTDR method [Go to Page]
- E.4 Calculation [Go to Page]
- E.4.1 General
- E.4.2 Connection location
- Figure E.2 – Location of the ports of the cabling under test [Go to Page]
- [Go to Page]
- E.4.3 Definition of power levels F1 and F2
- E.4.4 Alternative calculation
- Figure E.3 – Graphic construction of F1 and F2 [Go to Page]
- E.5 OTDR uncertainties
- Figure E.4 – Graphic construction of F1, F11, F12 and F2
- Annex F (normative) Requirements for the source characteristics [Go to Page]
- F.1 Encircled flux
- F.2 Assumptions and limitations
- F.3 Encircled flux templates [Go to Page]
- F.3.1 General
- F.3.2 Uncertainties expectations
- F.3.3 Templates
- Table F.1 – Attenuation, threshold tolerance and confidence level
- Table F.2 – EF requirements for 50 µm core optical fibre cabling at 850 nm [Go to Page]
- F.4 Graphical representation of templates
- Table F.3 – EF requirements for 50 μm core optical fibre cabling at 1 300 nm
- Table F.4 – EF requirements for 62,5 μm core optical fibre cabling at 850 nm
- Table F.5 – EF requirements for 62,5 μm core optical fibre cabling at 1 300 nm
- Figure F.1 – Encircled flux example
- Annex G (informative) OTDR configuration information [Go to Page]
- G.1 General
- G.2 Fundamental parameters that define the operational capability of an OTDR [Go to Page]
- G.2.1 Dynamic range
- G.2.2 Pulse width
- G.2.3 Averaging time
- G.2.4 Dead zone
- G.3 Other parameters [Go to Page]
- G.3.1 Index of refraction
- G.3.2 Measurement range
- G.3.3 Distance sampling
- G.4 Other measurement configurations [Go to Page]
- G.4.1 General
- G.4.2 Macrobend or splice attenuation measurement
- Table G.1 – Default effective group index of refraction values [Go to Page]
- [Go to Page]
- G.4.3 Splice attenuation measurement
- G.4.4 Measurement with high reflection connectors or short length cabling
- Figure G.1 – Splice and macrobend attenuation measurement
- Figure G.2 – Attenuation measurement with high reflection connectors [Go to Page]
- [Go to Page]
- G.4.5 Ghost
- Figure G.3 – Attenuation measurement of a short length cabling [Go to Page]
- G.5 More on the measurement method
- Figure G.4 – OTDR trace with ghost [Go to Page]
- G.6 Bi-directional measurement
- Figure G.5 – Cursor positioning [Go to Page]
- G.7 Non-recommended practices [Go to Page]
- G.7.1 Measurement without tail test cord
- G.7.2 Cursor measurement
- Annex H (informative) Test cord attenuation verification [Go to Page]
- H.1 General
- H.2 Apparatus
- H.3 Procedure [Go to Page]
- H.3.1 General
- H.3.2 Test cord verification for the one-cord and two-cord methods when using non-pinned/unpinned and non-plug/socket style connectors
- H.3.3 Test cord verification for the one-cord and two-cord methods when using pinned/unpinned or plug/socket style connectors
- Figure H.1 – Obtaining reference power level P0
- Figure H.2 – Obtaining power level P1
- Figure H.3 – Obtaining reference power level P0
- Figure H.4 – Obtaining power level P1 [Go to Page]
- [Go to Page]
- H.3.4 Test cord verification for the three-cord method when using non-pinned/unpinned and non-plug/socket style connectors
- Figure H.5 – Obtaining reference power level P0
- Figure H.6 – Obtaining power level
- Figure H.7 – Obtaining reference power level P0
- Figure H.8 – Obtaining power level P1 [Go to Page]
- [Go to Page]
- H.3.5 Test cord verification for the three-cord method when using pinned/unpinned or plug/socket style connectors
- Figure H.9 – Obtaining power level P5
- Figure H.10 – Obtaining reference power level P0
- Figure H.11 – Obtaining power level P1
- Annex I (normative) On the use of reference-grade test cords [Go to Page]
- I.1 General
- I.2 Practical configurations and assumptions [Go to Page]
- I.2.1 Component specifications
- I.2.2 Conventions
- I.2.3 Reference planes
- I.3 Impact of using reference grade test cords for recommended LSPM methods
- I.4 Examples for LSPM measurements [Go to Page]
- I.4.1 Example 1 (configuration A, 1-C method – Annex A)
- I.4.2 Example 2 (configuration D, EC method – Annex D)
- Table I.1 – Measurement bias when using reference-grade test cords [Go to Page]
- I.5 Impact of using reference-grade test cords for different configurations using the OTDR test method [Go to Page]
- I.5.1 Cabling configurations A, B and C
- Figure I.1 – Cabling configurations A, B and C tested with the OTDR method [Go to Page]
- [Go to Page]
- I.5.2 Cabling configuration D
- Table I.2 – Measurement bias when using reference grade test cords – OTDR test method
- Figure I.2 – Cabling configuration D tested with the OTDR method
- Annex J (informative) Launch cord output near-field verification [Go to Page]
- J.1 Direct verification
- J.2 Test equipment manufacturer verification
- J.3 Field check with physical artefact [Go to Page]
- J.3.1 General
- Figure J.1 – Initial power measurement
- Figure J.2 – Verification of reference-grade connection
- Figure J.3 – Two offset splices [Go to Page]
- [Go to Page]
- J.3.2 Procedure for attenuation characterization of artefacts
- J.3.3 Construction details
- Figure J.4 – Five offset splices [Go to Page]
- [Go to Page]
- J.3.4 Example results
- Figure J.5 – EF centred
- Figure J.6 – EF underfilling
- Figure J.7 – EF overfilling
- Figure J.8 – L1 attenuation with mandrel
- Figure J.9 – L1 attenuation with mandrel and mode conditioner
- Figure J.10 – L2 attenuation with mandrel
- Figure J.11 – L2 attenuation with mandrel and mode conditioning
- Figure J.12 – L3 attenuation with mandrel
- Figure J.13 – L3 attenuation with mandrel and mode conditioning
- Bibliography [Go to Page]