Already a subscriber? ![](/assets/images/login.png)
![](/assets/images/x.png)
MADCAD.com Free Trial
Sign up for a 3 day free trial to explore the MADCAD.com interface, PLUS access the
2009 International Building Code to see how it all works.
If you like to setup a quick demo, let us know at support@madcad.com
or +1 800.798.9296 and we will be happy to schedule a webinar for you.
Security check![](/assets/images/x.png)
Please login to your personal account to use this feature.
Please login to your authorized staff account to use this feature.
Are you sure you want to empty the cart?
![](/assets/images/159.gif)
BS EN IEC 61439-1:2021 + Ex Comm Low-voltage switchgear and controlgear assemblies - General rules, 2021
- 30301662-WEB (1).pdf [Go to Page]
- undefined
- Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
- Annex ZZ (informative)Relationship between this European standard and the safety objectives of Directive 2014/35/EU [2014 OJ L96] aimed to be covered
- English [Go to Page]
- CONTENTS
- FOREWORD
- INTRODUCTION
- 1 Scope
- 2 Normative references
- 3 Terms and definitions [Go to Page]
- 3.1 General terms
- 3.2 Constructional units of assemblies
- 3.3 External design of assemblies
- 3.4 Structural parts of assemblies
- 3.5 Conditions of installation of assemblies
- 3.6 Insulation characteristics
- 3.7 Protection against electric shock
- 3.8 Characteristics
- 3.9 Verification
- 3.10 Manufacturer
- 4 Symbols and abbreviations
- 5 Interface characteristics [Go to Page]
- 5.1 General
- 5.2 Voltage ratings [Go to Page]
- 5.2.1 Rated voltage (Un) (of the assembly)
- 5.2.2 Rated operational voltage (Ue) (of a circuit of an assembly)
- 5.2.3 Rated insulation voltage (Ui) (of a circuit of an assembly)
- 5.2.4 Rated impulse withstand voltage (Uimp) (of the assembly)
- 5.3 Current ratings [Go to Page]
- 5.3.1 Rated current of an assembly (InA)
- 5.3.2 Rated current of a main outgoing circuit (Inc)
- 5.3.3 Group rated current of a main circuit (Ing)
- 5.3.4 Rated peak withstand current (Ipk)
- 5.3.5 Rated short-time withstand current (Icw) (of a main circuit of an assembly)
- 5.3.6 Rated conditional short-circuit current (Icc) (of an assembly or a circuit of an assembly)
- 5.4 Rated diversity factor (RDF)
- 5.5 Rated frequency (fn)
- 5.6 Other characteristics
- 6 Information [Go to Page]
- 6.1 Assembly designation marking
- 6.2 Documentation [Go to Page]
- 6.2.1 Information relating to the assembly
- 6.2.2 Instructions for handling, installation, operation and maintenance
- 6.3 Device and/or component identification
- 7 Service conditions [Go to Page]
- 7.1 Normal service conditions [Go to Page]
- 7.1.1 Climatic conditions
- 7.1.2 Pollution degree
- 7.2 Special service conditions
- 7.3 Conditions during transport, storage and installation
- 8 Constructional requirements [Go to Page]
- 8.1 Strength of materials and parts [Go to Page]
- 8.1.1 General
- 8.1.2 Protection against corrosion
- 8.1.3 Properties of insulating materials
- 8.1.4 Resistance to ultra-violet (UV) radiation
- 8.1.5 Mechanical strength
- 8.1.6 Lifting provision
- 8.2 Degree of protection provided by an assembly enclosure [Go to Page]
- 8.2.1 Protection against mechanical impact (IK code)
- 8.2.2 Protection against contact with live parts, ingress of solid foreign bodies and water (IP code)
- 8.2.3 Assembly with removable parts
- 8.3 Clearances and creepage distances [Go to Page]
- 8.3.1 General
- 8.3.2 Clearances
- 8.3.3 Creepage distances
- 8.4 Protection against electric shock [Go to Page]
- 8.4.1 General
- 8.4.2 Basic protection
- 8.4.3 Fault protection
- 8.4.4 Additional requirements for class II assemblies
- 8.4.5 Limitation of steady-state touch currents and charge
- 8.4.6 Operating and servicing conditions
- 8.5 Incorporation of switching devices and components [Go to Page]
- 8.5.1 Fixed parts
- 8.5.2 Removable parts
- 8.5.3 Selection of switching devices and components
- 8.5.4 Installation of switching devices and components
- 8.5.5 Accessibility
- 8.5.6 Barriers
- 8.5.7 Direction of operation and indication of switching positions
- 8.5.8 Indicator lights and push-buttons
- 8.5.9 Power factor correction banks
- 8.6 Internal electrical circuits and connections [Go to Page]
- 8.6.1 Main circuits
- 8.6.2 Auxiliary circuits
- 8.6.3 Bare and insulated conductors
- 8.6.4 Selection and installation of non-protected live conductors to reduce the possibility of short-circuits
- 8.6.5 Identification of the conductors of main and auxiliary circuits
- 8.6.6 Identification of the protective conductor (PE, PEL, PEM, PEN) and of the neutral conductor (N) and the mid-point conductor (M) of the main circuits
- 8.6.7 Conductors in AC circuits passing through ferromagnetic enclosures or plates
- 8.7 Cooling
- 8.8 Terminals for external cables
- 9 Performance requirements [Go to Page]
- 9.1 Dielectric properties [Go to Page]
- 9.1.1 General
- 9.1.2 Power-frequency withstand voltage
- 9.1.3 Impulse withstand voltage
- 9.1.4 Protection of surge protective devices
- 9.2 Temperature-rise limits [Go to Page]
- 9.2.1 General
- 9.2.2 Adjustment of rated currents for alternative ambient air temperatures
- 9.3 Short-circuit protection and short-circuit withstand strength [Go to Page]
- 9.3.1 General
- 9.3.2 Information concerning short-circuit withstand strength
- 9.3.3 Relationship between peak current and short-time current
- 9.3.4 Coordination of protective devices
- 9.4 Electromagnetic compatibility (EMC)
- 10 Design verification [Go to Page]
- 10.1 General
- 10.2 Strength of materials and parts [Go to Page]
- 10.2.1 General
- 10.2.2 Resistance to corrosion
- 10.2.3 Properties of insulating materials
- 10.2.4 Resistance to ultraviolet (UV) radiation
- 10.2.5 Lifting
- 10.2.6 Verification of protection against mechanical impact (IK code)
- 10.2.7 Marking
- 10.2.8 Mechanical operation
- 10.3 Degree of protection of assemblies (IP Code)
- 10.4 Clearances and creepage distances
- 10.5 Protection against electric shock and integrity of protective circuits [Go to Page]
- 10.5.1 General
- 10.5.2 Effective earth continuity between the exposed-conductive-parts of the class I assembly and the protective circuit
- 10.5.3 Short-circuit withstand strength of the protective circuit
- 10.6 Incorporation of switching devices and components [Go to Page]
- 10.6.1 General
- 10.6.2 Electromagnetic compatibility
- 10.7 Internal electrical circuits and connections
- 10.8 Terminals for external conductors
- 10.9 Dielectric properties [Go to Page]
- 10.9.1 General
- 10.9.2 Power-frequency withstand voltage
- 10.9.3 Impulse withstand voltage
- 10.9.4 Testing of enclosures made of insulating material
- 10.9.5 External door or cover mounted operating handles of insulating material
- 10.9.6 Testing of conductors and hazardous live parts covered by insulating material to provide protection against electric shock
- 10.10 Temperature-rise [Go to Page]
- 10.10.1 General
- 10.10.2 Verification by testing
- 10.10.3 Verification by comparison
- 10.10.4 Verification assessment
- 10.11 Short-circuit withstand strength [Go to Page]
- 10.11.1 General
- 10.11.2 Circuits of assemblies which are exempted from the verification of the short-circuit withstand strength
- 10.11.3 Verification by comparison with a reference design – Using a checklist
- 10.11.4 Verification by comparison with a reference design(s) – Using calculation
- 10.11.5 Verification by test
- 10.12 Electromagnetic compatibility (EMC)
- 11 Routine verification [Go to Page]
- 11.1 General
- 11.2 Degree of protection against contact with hazardous live parts, ingress of solid foreign bodies and water of enclosures
- 11.3 Clearances and creepage distances
- 11.4 Protection against electric shock and integrity of protective circuits
- 11.5 Incorporation of built-in components
- 11.6 Internal electrical circuits and connections
- 11.7 Terminals for external conductors
- 11.8 Mechanical operation
- 11.9 Dielectric properties
- 11.10 Wiring, operational performance and function
- Tables [Go to Page]
- Table 1 – Minimum clearances in air (8.3.2)
- Table 2 – Minimum creepage distances (8.3.3)
- Table 3 – Cross-sectional area of a copper protective conductor (8.4.3.2.2)
- Table 4 – Conductor selection and installation requirements (8.6.4)
- Table 5 – Minimum terminal capacity for copper protective conductors (PE) (8.8)
- Table 6 – Temperature-rise limits (9.2)
- Table 7 – Values for the factor na (9.3.3)
- Table 8 – Power-frequency withstand voltage for main circuits (10.9.2)
- Table 9 – Power-frequency withstand voltage for auxiliary circuits (10.9.2)
- Table 10 – Impulse withstand test voltages (10.9.3)
- Table 11 – Copper test conductors for rated currents up to 400 A inclusive (10.10.2.3.2)
- Table 12 – Copper test conductors for rated currents from 400 A to 7 000 A (10.10.2.3.2)
- Table 13 – Short-circuit verification by comparison with reference designs: checklist (10.5.3.3, 10.11.3 and 10.11.4)
- Table 14 – Relationship between prospective fault current and diameter of copper wire
- Table 15 – Climatic conditions
- Annexes [Go to Page]
- Annex A (normative) Minimum and maximum cross-section of copper cables suitable for connection to terminals for external cables (see 8.8)
- Table A.1 – Cross-section of copper cables suitable for connection to terminals for external cables
- Annex B (normative) Method of calculating the cross-sectional area of protective conductors with regard to thermal stresses due to currents of short duration
- Table B.1 – Values of k for insulated protective conductors not incorporated in cables or bare protective conductors in contact with cable covering
- Annex C (informative) User information template
- Table C.1 – User information template
- Annex D (informative) Design verification
- Table D.1 – List of design verifications to be performed
- Annex E (informative) Rated diversity factor [Go to Page]
- E.1 General
- E.2 Rated diversity factor for outgoing circuits within an assembly [Go to Page]
- E.2.1 General
- Figures [Go to Page]
- Figure E.1 – Typical assembly
- Table E.1 – Examples of loading for an assembly [Go to Page]
- [Go to Page]
- E.2.2 Example of an assembly with an RDF of 0,68
- Figure E.2 – Example 1: Table E.1 – Functional unit loading for an assembly with a rated diversity factor of 0,68 [Go to Page]
- [Go to Page]
- E.2.3 Example of an assembly with RDF declared for each section
- Figure E.3 – Example 2: Table E.1 – Functional unit loading for an assembly with a rated diversity factor of 0,6 in Section B and 0,68 in Section C
- Annex F (normative) Measurement of clearances and creepage distances 5F [Go to Page]
- F.1 Basic principles
- F.2 Use of ribs
- Table F.1 – Minimum width of grooves
- Figure F.1 – Measurement of clearance and creepage distances
- Annex G (normative) Correlation between the nominal voltage of the supply system and the rated impulse withstand voltage of the equipment 6F
- Table G.1 – Correspondence between the nominal voltage of the supply system and the equipment rated impulse withstand voltage
- Annex H (informative) Operating current and power loss of copper cables
- Table H.1 – Operating current and power loss of single-core copper cables with a permissible conductor temperature of 70 °C (ambient temperature inside the assembly: 55 °C)
- Table H.2 – Reduction factor k1 for cables with a permissible conductor temperature of 70 °C (extract from IEC 60364-5-52:2009, Table B.52.14)
- Annex I (informative) Thermal equivalent of an intermittent current
- Figure I.1 – Example of average heating effect calculation
- Annex J (normative) Electromagnetic compatibility (EMC) [Go to Page]
- J.1 General
- Figure J.1 – Examples of ports
- Table J.1 – Tests for EMC immunity for environment A (see J.10.12.2)
- Table J.2 – Tests for EMC immunity for environment B (see J.10.12.2)
- Table J.3 – Acceptance criteria when electromagnetic disturbances are present
- Annex K (normative) Operating current and power loss of bare copper bars
- Table K.1 – Operating current and power loss of bare copper bars with rectangular cross-section, run horizontally and arranged with their largest face vertical, frequency 50 Hz to 60 Hz (ambient air temperature inside the assembly: 55 °C,temperature of the conductor 70 °C)
- Table K.2 – Factor k4 for different temperatures of the air inside the assembly and/or for the conductors
- Annex L (informative) Guidance on verification of temperature-rise [Go to Page]
- L.1 General [Go to Page]
- L.1.1 Principles
- L.1.2 Current ratings of assemblies
- L.2 Temperature-rise limits
- L.3 Test [Go to Page]
- L.3.1 General
- L.3.2 Method a) – Verification of the complete assembly (10.10.2.3.5)
- L.3.3 Method b) – Verification considering individual functional units separately and the complete assembly (10.10.2.3.6)
- L.3.4 Method c) – Verification considering individual functional units and the main and distribution busbars separately as well as the complete assembly (10.10.2.3.7)
- L.4 Verification assessment [Go to Page]
- L.4.1 General
- L.4.2 Single compartment assembly with a rated current (InA) not exceeding 630 A
- L.4.3 Assembly with rated currents (InA) not exceeding 1 600 A
- L.5 Verification by comparison with a reference design
- Figure L.1 – Verification of temperature-rise
- Annex M (normative) Verification of the short-circuit withstand strength of busbar structures by comparison with a reference design by calculation [Go to Page]
- M.1 General
- M.2 Terms and definitions
- Figure M.1 – Tested busbar structure (TS) [Go to Page]
- M.3 Method of verification
- Figure M.2 – Non tested busbar structure (NTS) [Go to Page]
- M.4 Conditions for application [Go to Page]
- M.4.1 General
- M.4.2 Peak short-circuit current
- M.4.3 Thermal short-circuit strength
- M.4.4 Busbar supports
- M.4.5 Busbar connections, equipment connections
- M.4.6 Angular busbar configurations
- Figure M.3 – Angular busbar configuration with supports at the corners [Go to Page]
- [Go to Page]
- M.4.7 Calculations with special regard to conductor oscillation
- Annex N (informative) List of notes concerning certain countries
- Bibliography
- 30438884-WEB.pdf [Go to Page]
- 1 Overview [Go to Page]
- 1.1 Reasons for change
- 1.2 Summary
- 2 Main commentary [Go to Page]
- 2.1 Greater focus on DC assemblies
- 2.2 Group rated current of a main circuit
- 2.3 Macro and micro environment
- 2.4 Class I and Class II assemblies
- 2.5 Deterioration of insulation over time
- 3 Wider context
- 4 Conclusion
- 5 Further reading
- Author
- Technical reviewer
- Disclaimer [Go to Page]