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eLibrary > BS IEC 62047-43:2024 Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices >

BS IEC 62047-43:2024 Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices, 2024

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BS IEC 62047-43:2024 Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices, 2024

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CONTENTS
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test piece [Go to Page]
4.1 General
4.2 Shape of a test piece
Figures [Go to Page]
Figure 1 – Schematic explanation of cyclic bending test
Figure 2 – Schematic illustration of flexible MEMS test piece
5 Test method [Go to Page]
5.1 Principle
Figure 3 – Selection of bending axis
5.2 Test apparatus and instrumentation [Go to Page]
5.2.1 Test apparatus
5.2.2 Instrumentation
Figure 4 – Folding procedures
5.3 Procedure [Go to Page]
5.3.1 Testing conditions
5.3.2 Selection of bending direction
5.3.3 Determination of bending axes
5.3.4 Measurement of test piece dimensions
5.3.5 Measurement of folding distance
5.3.6 Number of testing
5.3.7 Instrumentation
5.3.8 End of testing
6 Test report [Go to Page]
6.1 General
6.2 Bending direction(s) and in-plane locations of bending axes
6.3 Dimensions of the test piece
6.4 Performance degradation characteristics with the folding distance
6.5 Testing conditions
Figure 5 – 3-dimensional P-S-N plot
Annex A (informative)Example of P-S-N plot of flexible MEMS device [Go to Page]
Figure A.1 – Test piece – Printed wiring on paper substrate
Figure A.2 – Test apparatus
Figure A.3 – 3-dimensional P-S-N plot
Figure A.4 – 2-dimensional P-S-N plot [Go to Page]

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BS IEC 62047-43:2024 Semiconductor devices. Micro-electromechanical devices - Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices, 2024

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