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eLibrary > DD IEC/TS 62610-1:2009 Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect >

DD IEC/TS 62610-1:2009 Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect, 2010

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DD IEC/TS 62610-1:2009 Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect, 2010

iec62610-1{ed1.0}en.pdf [Go to Page]
CONTENTS
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Arrangement overview
4 Mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling system in a vertical alignment [Go to Page]
4.1 Cabinet with inside mounted thermoelectrical cooling system in a vertical alignment
4.2 Cabinet with inside mounted thermoelectrical cooling system in a horizontal alignment
5 Mounting location 2: cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet [Go to Page]
5.1 Overview
5.2 Cooling performance in cabinets with top mounted thermoelectrical cooling systems
6 Mounting location 3: cabinet with inbuilt thermoelectrical cooling system for hot spot cooling [Go to Page]
6.1 Overview
6.2 Cooling performance for an inbuilt thermoelectrical cooling system for hot spot cooling
7 Remark
Annex A (informative) Heat management under environmental aspects
Bibliography
Figures [Go to Page]
Figure 1 – Arrangement overview
Figure 2 – Mounting location 1
Figure 3 – Mounting location 1: arrangement of two cabinets with inside mounted Peltier system and minimized distance W1
Figure 4 – Performance guideline for cabinets with inside mounted thermoelectrical cooling system
Figure 5 – Mounting location 1a: cabinet with side mounted thermoelectrical cooling system in a horizontal alignment
Figure 6 – Mounting location 2: cabinet with top mounted thermoelectrical cooling system
Figure 7 – Performance guideline for a top mounted thermoelectrical cooling system
Figure 8 – Mounting location 3
Figure 9 – Performance guideline for inbuilt thermoelectrical cooling system for hot spot cooling
Figure A.1 – Current CO2 emission situation
Figure A.2 – Changes in greenhouse gases from ice-core and modern data [5]
Figure A.3 – Radiative forcing of climate between 1750 and 2005 [4]
Figure A.4 – Coefficient of performance depending on the cooling power at the boundary conditions of Ta = 50 °C
Figure A.5 – Electrical power usage of compressor cooling unit versus Peltier cooling unit at given ambient temperature and given heating dissipation to keep the internal temperature fixed
Table A.1 – Advantages and disadvantages of different cooling systems [Go to Page]

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DD IEC/TS 62610-1:2009 Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect, 2010

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