2007,ASTM,"E2544-07 Standard Terminology for Three-Dimensional (3-D) Imaging Systems"
2007,ASTM,"E2544-07a Standard Terminology for Three-Dimensional (3-D) Imaging Systems"
2008,ASTM,"E2544-08 Standard Terminology for Three-Dimensional (3D) Imaging Systems"
2008,ASTM,"E2544-08a Standard Terminology for Three-Dimensional (3D) Imaging Systems"
2008,ASTM,"E2544-08b Standard Terminology for Three-Dimensional (3D) Imaging Systems"
1999,ASTM,"F1094-87(1999) Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method"
2005,ASTM,"F1094-87(2005) Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method"
1999,ASTM,"F1190-99 Standard Guide for Neutron Irradiation of Unbiased Electronic Components"
2005,ASTM,"F1190-99(2005) Standard Guide for Neutron Irradiation of Unbiased Electronic Components"
2000,ASTM,"F1192-00 Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices"
2006,ASTM,"F1192-00(2006) Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices"
1995,ASTM,"F1262M-95 Standard Guide for Transient Radiation Upset Threshold of Digital Integrated Circuits"
2002,ASTM,"F1262M-95(2002) Standard Guide for Transient Radiation Upset Threshold of Digital Integrated Circuits"
2008,ASTM,"F1262M-95(2008) Standard Guide for  Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric)"
1999,ASTM,"F1263-99 Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts"
2005,ASTM,"F1263-99(2005) Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts"
2006,ASTM,"F1269-06 Test Methods for Destructive Shear Testing of Ball Bonds"
2001,ASTM,"F1269-89(2001) Test Methods for Destructive Shear Testing of Ball Bonds"
1998,ASTM,"F1367-98 Standard Specification for Chromium Sputtering Targets for Thin Film Applications"
2003,ASTM,"F1367-98(2003) Standard Specification for Chromium Sputtering Targets for Thin Film Applications"
1999,ASTM,"F1372-93(1999) Standard Test Method for Scanning Electron Microscope (SEM) Analysis of Metallic Surface Condition for Gas Distribution System Components"
2005,ASTM,"F1372-93(2005) Standard Test Method for Scanning Electron Microscope (SEM) Analysis of Metallic Surface Condition for Gas Distribution System Components"
1999,ASTM,"F1373-93(1999) Standard Test Method for Determination of Cycle Life of Automatic Valves for Gas Distribution System Components"
2005,ASTM,"F1373-93(2005) Standard Test Method for Determination of Cycle Life of Automatic Valves for Gas Distribution System Components"
1999,ASTM,"F1374-92(1999) Standard Test Method for Ionic/Organic Extractables of Internal Surfaces-IC/GC/FTIR for Gas Distribution System Components"
2005,ASTM,"F1374-92(2005) Standard Test Method for Ionic/Organic Extractables of Internal Surfaces-IC/GC/FTIR for Gas Distribution System Components"
1999,ASTM,"F1375-92(1999) Standard Test Method for Energy Dispersive X-Ray Spectrometer (EDX) Analysis of Metallic Surface Condition for Gas Distribution System Components"
2005,ASTM,"F1375-92(2005) Standard Test Method for Energy Dispersive X-Ray Spectrometer (EDX) Analysis of Metallic Surface Condition for Gas Distribution System Components"
1999,ASTM,"F1376-92(1999) Standard Guide for Metallurgical Analysis for Gas Distribution System Components"
2005,ASTM,"F1376-92(2005) Standard Guide for Metallurgical Analysis for Gas Distribution System Components"
1999,ASTM,"F1394-92(1999) Standard Test Method for Determination of Particle Contribution from Gas Distribution System Valves"
2005,ASTM,"F1394-92(2005) Standard Test Method for Determination of Particle Contribution from Gas Distribution System Valves"
1999,ASTM,"F1396-93(1999) Standard Test Method for Determination of Oxygen Contribution by Gas Distribution System Components"
2005,ASTM,"F1396-93(2005) Standard Test Method for Determination of Oxygen Contribution by Gas Distribution System Components"
1999,ASTM,"F1397-93(1999) Standard Test Method for Determination of Moisture Contribution by Gas Distribution System Components"
2005,ASTM,"F1397-93(2005) Standard Test Method for Determination of Moisture Contribution by Gas Distribution System Components"
1999,ASTM,"F1398-93(1999) Standard Test Method for Determination of Total Hydrocarbon Contribution by Gas Distribution System Components"
2005,ASTM,"F1398-93(2005) Standard Test Method for Determination of Total Hydrocarbon Contribution by Gas Distribution System Components"
1999,ASTM,"F1404-92(1999) Test Method for Crystallographic Perfection of Gallium Arsenide by Molten Potassium Hydroxide (KOH) Etch Technique"
2007,ASTM,"F1404-92(2007) Test Method for  Crystallographic Perfection of Gallium Arsenide by Molten Potassium Hydroxide (KOH) Etch Technique"
1999,ASTM,"F1438-93(1999) Standard Test Method for Determination of Surface Roughness by Scanning Tunneling Microscopy for Gas Distribution System Components"
2005,ASTM,"F1438-93(2005) Standard Test Method for Determination of Surface Roughness by Scanning Tunneling Microscopy for Gas Distribution System Components"
1999,ASTM,"F1466-99 Standard Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications"
2005,ASTM,"F1466-99(2005) Standard Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications"
1999,ASTM,"F1467-99 Standard Guide for Use of an X-Ray Tester ([approximate]10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits"
2005,ASTM,"F1467-99(2005) Standard Guide for Use of an X-Ray Tester ([approximate]10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits"
1999,ASTM,"F1513-99 Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications"
2003,ASTM,"F1513-99(2003) Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications"
2000,ASTM,"F1578-00 Standard Practice for Contact Closure Cycling of a Membrane Switch"
2001,ASTM,"F1578-01 Standard Practice for Contact Closure Cycling of a Membrane Switch"
2007,ASTM,"F1578-07 Standard Test Method for  Contact Closure Cycling of a Membrane Switch"
2008,ASTM,"F1593-08 Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer"
1997,ASTM,"F1593-97 Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer"
2002,ASTM,"F1593-97(2002) Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer"
2000,ASTM,"F1595-00 Standard Practice for Viewing Conditions for Visual Inspection of Membrane Switches"
2005,ASTM,"F1595-00(2005) Standard Practice for Viewing Conditions for Visual Inspection of Membrane Switches"
2000,ASTM,"F1596-00 Standard Practice for Exposure of Membrane Switches to Temperature and Relative Humidity"
2005,ASTM,"F1596-00(2005) Standard Practice for Exposure of Membrane Switches to Temperature and Relative Humidity"
2007,ASTM,"F1596-07 Standard Test Method for  Exposure of Membrane Switches to Temperature and Relative Humidity"
1995,ASTM,"F1598-95 Standard Test Method for Determining the Effects of Chemical/Solvent Exposure to a Membrane Switch/Graphic Overlay (Spot Test Method)"
2002,ASTM,"F1598-95(2002) Standard Test Method for Determining the Effects of Chemical/Solvent Exposure to a Membrane Switch/Graphic Overlay (Spot Test Method)"
2007,ASTM,"F1598-95(2007) Standard Test Method  for Determining the Effects of Chemical/Solvent Exposure to a Membrane Switch/Graphic Overlay (Spot Test Method)"
2008,ASTM,"F1661-08 Standard Test Method for Determining the Contact Bounce Time of a Membrane Switch"
1996,ASTM,"F1661-96 Standard Test Method for Determining the Contact Bounce Time of a Membrane Switch"
2002,ASTM,"F1661-96(2002) Standard Test Method for Determining the Contact Bounce Time of a Membrane Switch"
1995,ASTM,"F1662-95 Standard Test Method for Verifying the Specified Dielectric Withstand Voltage of a Member Switch"
1995,ASTM,"F1663-95 Standard Test Method for Determining the Capacitance of a Membrane Switch"
2002,ASTM,"F1663-95(2002) Standard Test Method for Determining the Capacitance of a Membrane Switch"
2002,ASTM,"F1680-02 Standard Test Method for Determining Circuit Resistance of a Membrane Switch"
2007,ASTM,"F1680-07 Standard Test Method for Determining Circuit Resistance of a Membrane Switch"
2007,ASTM,"F1680-07a Standard Test Method for  Determining Circuit Resistance of a Membrane Switch"
1996,ASTM,"F1680-96 Standard Test Method for Determining Circuit Resistance of a Membrane Switch"
2007,ASTM,"F1681-07 Standard Test Method for Determining Current Carrying Capacity of a Conductor as Part of a Membrane Switch Circuit"
2007,ASTM,"F1681-07a Standard Test Method for  Determining Current Carrying Capacity of a Conductor as Part of a Membrane Switch Circuit"
1996,ASTM,"F1681-96 Standard Test Method for Determining Current Carrying Capacity of a Conductor as Part of a Membrane Switch Circuit"
2002,ASTM,"F1681-96(2002) Standard Test Method for Determining Current Carrying Capacity of a Conductor as Part of a Membrane Switch Circuit"
2002,ASTM,"F1683-02 Standard Practice for Creasing or Bending a Membrane Switch, Membrane Switch Tail Assembly or Membrane Switch Component"
2005,ASTM,"F1683-05 Standard Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component"
2005,ASTM,"F1683-05e1 Standard Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component"
1996,ASTM,"F1683-96a Standard Practice for Creasing or Bending a Membrane Switch, Membrane Switch Tail Assembly or Membrane Switch Component"
2006,ASTM,"F1684-06 Standard Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications"
1999,ASTM,"F1684-99 Standard Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications"
2002,ASTM,"F1689-02 Standard Test Method for Determining the Insulation Resistance of a Membrane Switch"
2005,ASTM,"F1689-05 Standard Test Method for Determining the Insulation Resistance of a Membrane Switch"
1996,ASTM,"F1689-96 Standard Test Method for Determining the Insulation Resistance of a Membrane Switch"
1997,ASTM,"F1709-97 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications"
2002,ASTM,"F1709-97(2002) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications"
2008,ASTM,"F1709-97(2008)  Standard Specification for  High Purity Titanium Sputtering Targets for Electronic Thin Film Applications"
2008,ASTM,"F1710-08 Standard Test Method for  Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer"
1997,ASTM,"F1710-97 Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer"
2002,ASTM,"F1710-97(2002) Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer"
1996,ASTM,"F1711-96 Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe"
2002,ASTM,"F1711-96(2002) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe"
2000,ASTM,"F1761-00 Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets"
2005,ASTM,"F1761-00(2005) Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets"
2002,ASTM,"F1762-02 Standard Practice for Exposing a Membrane Switch to Variation in Atmospheric Pressure"
2007,ASTM,"F1762-07 Standard Practice for  Exposing a Membrane Switch to Variation in Atmospheric Pressure"
1997,ASTM,"F1762-97 Standard Practice for Exposing a Membrane Switch to Variation in Atmospheric Pressure"
2002,ASTM,"F1812-02 Standard Test Method for Determining the Effectiveness of Membrane Switch ESD Shielding"
1997,ASTM,"F1812-97a Standard Test Method for Determining the Effectiveness of Membrane Switch ESD Shielding"
2002,ASTM,"F1842-02 Standard Test Method for Determining Ink or Coating Adhesion on Plastic Substrates for Membrane Switch Applications"
2002,ASTM,"F1843-97(2002) Standard Practice for Sample Preparation of Transparent Plastic Films for Specular Gloss Measurements, on Membrane Switch Overlays"
2008,ASTM,"F1844-97(2008) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage"
2008,ASTM,"F1845-08 Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer"
2004,ASTM,"F1892-04 Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices"
2006,ASTM,"F1892-06 Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices"
1998,ASTM,"F1892-98 Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices"
2003,ASTM,"F1893-98(2003) Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices"
1998,ASTM,"F1894-98 Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness"
2003,ASTM,"F1894-98(2003) Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness"
1998,ASTM,"F1895-98 Practice for Submersion of a Membrane Switch"
2004,ASTM,"F1895-98(2004) Practice for Submersion of a Membrane Switch"
1998,ASTM,"F1896-98 Test Method for Determining the Electrical Resistivity of a Printed Conductive Material"
2004,ASTM,"F1896-98(2004) Test Method for Determining the Electrical Resistivity of a Printed Conductive Material"
2000,ASTM,"F1996-00 Standard Test Method for Silver Migration for Membrane Switch Circuitry"
2001,ASTM,"F1996-01 Standard Test Method for Silver Migration for Membrane Switch Circuitry"
2006,ASTM,"F1996-06 Standard Test Method for Silver Migration for Membrane Switch Circuitry"
2000,ASTM,"F2072-00 Standard Practice for Hosedown of a Membrane Switch"
2001,ASTM,"F2072-01 Standard Practice for Hosedown of a Membrane Switch"
2000,ASTM,"F2073-00 Standard Test Method for Non-Destructive Short Circuit Testing of a Membrane Switch"
2001,ASTM,"F2073-01 Standard Test Method for Non-Destructive Short Circuit Testing of a Membrane Switch"
2006,ASTM,"F2073-01(2006) Standard Test Method for Non-Destructive Short Circuit Testing of a Membrane Switch"
2001,ASTM,"F2112-01 Standard Terminology for Membrane Switches"
2002,ASTM,"F2112-02 Standard Terminology for Membrane Switches"
2001,ASTM,"F2113-01 Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications"
2004,ASTM,"F2360-04 Standard Test Method for Determining Luminance of a Membrane Switch Backlit with Diffuse Light Source"
2008,ASTM,"F2360-08 Standard Test Method for Determining Luminance of a Membrane Switch Backlit with Diffuse Light Source"
2006,ASTM,"F2576-06 Standard Terminology Relating to Declarable Substances in Materials"
2006,ASTM,"F2576-06a Standard Terminology Relating to Declarable Substances in Materials"
2007,ASTM,"F2576-07a Standard Terminology Relating to Declarable Substances in Materials"
2008,ASTM,"F2576-08 Standard Terminology Relating to Declarable Substances in Materials"
2008,ASTM,"F2592-08 Standard Test Method for Measuring the Force-Displacement of a Membrane Switch"
2009,ASTM,"E2544-09a Standard Terminology for Three-Dimensional (3D) Imaging Systems"
2009,ASTM,"E2544-09b Standard Terminology for Three-Dimensional (3D) Imaging Systems"
2009,ASTM,"F1661-09 Standard Test Method for Determining the Contact Bounce Time of a Membrane Switch"
2009,ASTM,"F1663-09 Standard Test Method for Determining the Capacitance of a Membrane Switch"
2009,ASTM,"F1683-09 Standard Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component"
2008,ASTM,"F1711-96(2008) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method"
2009,ASTM,"F1842-09 Standard Test Method for Determining Ink or Coating Adhesion on Plastic Substrates for Membrane Switch Applications"
2009,ASTM,"F1843-09 Standard Practice for Sample Preparation of Transparent Plastic Films used on Membrane Switch Overlays for Specular Gloss Measurements"
2009,ASTM,"F2592-09 Standard Test Method for Measuring the Force-Displacement of a Membrane Switch"
2008,ASTM,"F2617-08 Standard Test Method for Identification and Quantification of Chromium, Bromine, Cadmium, Mercury, and Lead in Polymeric Material Using Energy Dispersive X-ray Spectrometry"
2008,ASTM,"F2750-08 Standard Test Method for Determining the Effects of Bending a Membrane Switch or Assembly"
2009,ASTM,"F2750-09 Standard Test Method for Determining the Effects of Bending a Membrane Switch or Assembly"
2003,ASTM,"F1512-94(2003) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies"
2006,ASTM,"F106-06 Standard Specification for Brazing Filler Metals for Electron Devices"
2004,ASTM,"F15-04 Standard Specification for Iron-Nickel-Cobalt Sealing Alloy"
2006,ASTM,"F16-67(2006) Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps"
2006,ASTM,"F18-64(2006) Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices"
2005,ASTM,"F180-94(2005) Standard Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices"
2009,ASTM,"F1812-09 Standard Test Method for Determining the Effectiveness of Membrane Switch ESD Shielding"
2009,ASTM,"F204-76(2009) Standard Test Method for Surface Flaws in Tungsten Seal Rod and Wire"
2005,ASTM,"F205-94(2005) Standard Test Method for Measuring Diameter of Fine Wire by Weighing"
2007,ASTM,"F2072-01(2007) Standard Practice for Hosedown of a Membrane Switch"
2009,ASTM,"F219-96(2009) Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps"
2009,ASTM,"F2576-09 Standard Terminology Relating to Declarable Substances in Materials"
2009,ASTM,"F269-60(2009) Standard Test Method for Sag of Tungsten Wire"
2009,ASTM,"F288-96(2009) Standard Specification for Tungsten Wire for Electron Devices and Lamps"
2009,ASTM,"F289-96(2009) Standard Specification for Molybdenum Wire and Rod for Electronic Applications"
2009,ASTM,"F29-97(2009) Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications"
2005,ASTM,"F290-94(2005) Standard Specification for Round Wire for Winding Electron Tube Grid Laterals"
2002,ASTM,"F30-96(2002) Standard Specification for Iron-Nickel Sealing Alloys"
2005,ASTM,"F31-05 Standard Specification for 42% Nickel-6% Chromium-Iron Sealing Alloy"
2009,ASTM,"F364-96(2009) Standard Specification for Molybdenum Flattened Wire for Electron Tubes"
2005,ASTM,"F375-89(2005) Standard Specification for Integrated Circuit Lead Frame Material"
2003,ASTM,"F390-98(2003) Standard Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array"
2006,ASTM,"F44-95(2006) Standard Specification for Metallized Surfaces on Ceramic"
2005,ASTM,"F448-99(2005) Test Method for Measuring Steady-State Primary Photocurrent"
2006,ASTM,"F458-06 Standard Practice for Nondestructive Pull Testing of Wire Bonds"
2006,ASTM,"F459-06 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds"
2006,ASTM,"F487-88(2006) Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding"
2008,ASTM,"F615M-95(2008) Standard Practice for  Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric)"
2006,ASTM,"F7-95(2006) Standard Specification for Aluminum Oxide Powder"
2006,ASTM,"F72-06 Standard Specification for Gold Wire for Semiconductor Lead Bonding"
2009,ASTM,"F73-96(2009) Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps"
2008,ASTM,"F76-08 Standard Test Methods for  Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors"
2009,ASTM,"F83-71(2009) Standard Practice for Definition and Determination of Thermionic Constants of Electron Emitters"
2009,ASTM,"F85-76(2009) Standard Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes"
2005,ASTM,"F96-77(2005) Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms"
2008,ASTM,"F2749-08 Standard Test Method for Determining the Effects of Creasing a Membrane Switch or Assembly"
2009,ASTM,"F2749-09 Standard Test Method for Determining the Effects of Creasing a Membrane Switch or Assembly"
2009,ASTM,"F2792-09 Standard Terminology for Additive Manufacturing Technologies"
2009,ASTM,"E2641-09 Standard Practice for Best Practices for Safe Application of 3D Imaging Technology"
2004,ASTM,"F2357-04 Standard Test Method for Determining the Abrasion Resistance of Inks and Coatings on Membrane Switches Using the Norman Tool ""RCA"" Abrader"
2004,ASTM,"F2359-04 Standard Test Method for Determining Color of a Membrane Switch Backlit with Diffuse Light Source"
2004,ASTM,"F2405-04 Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer"
2006,ASTM,"F2577-06 Standard Guide for Assessment of Materials and Products for Declarable Substances"
2008,ASTM,"F2725-08 Standard Guide for European Union's Registration, Evaluation, and Authorization of Chemicals (REACH) Supply Chain Information Exchange"
2009,ASTM,"F2771-09 Standard Test Method for Determining the Luminance Curve of an Electroluminescent Lamp at Ambient  Conditions"
2010,ASTM,"F744M-10 Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits [Metric]"
2010,ASTM,"F773M-10 Practice for Measuring Dose Rate Response of Linear Integrated Circuits [Metric]"
2010,ASTM,"E2544-10 Standard Terminology for Three-Dimensional (3D) Imaging Systems"
2010,ASTM,"F1662-10 Standard Test Method for Verifying the Specified Dielectric Withstand Voltage and Determining the Dielectric Breakdown Voltage of a Membrane Switch"
2010,ASTM,"F1895-10 Practice for Submersion of a Membrane Switch"
2010,ASTM,"F1896-10 Test Method for Determining the Electrical Resistivity of a Printed Conductive Material"
2010,ASTM,"F2357-10 Standard Test Method for Determining the Abrasion Resistance of Inks and Coatings on Membrane Switches Using the Norman Tool ""RCA"" Abrader"
2010,ASTM,"F2771-10 Standard Test Method for Determining the Luminance Curve of an Electroluminescent Lamp at Ambient  Conditions"
2010,ASTM,"F2792-10 Standard Terminology for Additive Manufacturing Technologies"
2010,ASTM,"F2853-10 Standard Test Method for Determination of Lead in Paint Layers and Similar Coatings or in Substrates and Homogenous Materials by Energy Dispersive X-Ray Fluorescence Spectrometry Using Multiple Monochromatic Excitation Beams"
2010,ASTM,"F996-10 Standard Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current-Voltage Characteristics"
2009,ASTM,"F15-04(2009) Standard Specification for Iron-Nickel-Cobalt Sealing Alloy (Redline)"
2008,ASTM,"F1593-08 Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer (Redline)"
2009,ASTM,"F1661-09 Standard Test Method for Determining the Contact Bounce Time of a Membrane Switch (Redline)"
2009,ASTM,"F1683-09 Standard Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component (Redline)"
2008,ASTM,"F1845-08 Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer (Redline)"
2010,ASTM,"F2357-10 Standard Test Method for Determining the Abrasion Resistance of Inks and Coatings on Membrane Switches Using the Norman Tool ""RCA"" Abrader (Redline)"
2008,ASTM,"F2360-08 Standard Test Method for Determining Luminance of a Membrane Switch Backlit with Diffuse Light Source (Redline)"
1993,ASTM,"F1190-93 Standard Guide for Neutron Irradiation of Unbiased Electronic Components"
2010,ASTM,"F1466-99(2010) Standard Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications"
2005,ASTM,"F1467-99(2005)e1 Standard Guide for Use of an X-Ray Tester ([approximate]10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits"
2002,ASTM,"F1844-97(2002) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage"
2002,ASTM,"F1845-97(2002) Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Reduction Glow Discharge Mass Spectrometer"
2010,ASTM,"F1895-10a Practice for Submersion of a Membrane Switch"
2010,ASTM,"F2592-10 Standard Test Method for Measuring the Force-Displacement of a Membrane Switch"
2011,ASTM,"F1893-11 Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices"
2011,ASTM,"F2725-11 Standard Guide for European Union's Registration, Evaluation, and Authorization of Chemicals (REACH) Supply Chain Information Exchange"
2011,ASTM,"E2544-11 Standard Terminology for Three-Dimensional (3D) Imaging Systems"
2011,ASTM,"E2544-11a Standard Terminology for Three-Dimensional (3D) Imaging Systems"
2011,ASTM,"F1238-95(2011) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications"
2011,ASTM,"F1263-11 Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts"
2011,ASTM,"F1367-98(2011) Standard Specification for Chromium Sputtering Targets for Thin Film Applications"
2011,ASTM,"F1512-94(2011) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies"
2011,ASTM,"F1513-99(2011) Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications"
2011,ASTM,"F1594-95(2011) Standard Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications"
2011,ASTM,"F1684-06(2011) Standard Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications"
2011,ASTM,"F1761-00(2011) Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets"
2011,ASTM,"F1894-98(2011) Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness"
2011,ASTM,"F2112-02(2011) Standard Terminology for Membrane Switches"
2011,ASTM,"F2113-01(2011) Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications"
2011,ASTM,"F2187-02(2011) Standard Test Method for Determining the Effect of Random Frequency Vibration on a Membrane Switch or Membrane Switch Assembly"
2011,ASTM,"F2188-02(2011) Standard Test Method for Determining the Effect of Variable Frequency Vibration on a Membrane Switch or Membrane Switch Assembly"
2011,ASTM,"F2405-04(2011) Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer"
2011,ASTM,"F7-95(2011) Standard Specification for Aluminum Oxide Powder"
2000,ASTM,"F7-95(2000) Standard Specification for Aluminum Oxide Powder"
2009,ASTM,"F15-04(2009) Standard Specification for Iron-Nickel-Cobalt Sealing Alloy"
1998,ASTM,"F15-98 Standard Specification for Iron-Nickel-Cobalt Sealing Alloy"
2000,ASTM,"F16-67(2000) Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps"
2011,ASTM,"F19-11 Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals"
2005,ASTM,"F19-64(2005)e1 Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals"
2000,ASTM,"F19-64(2000) Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals"
2002,ASTM,"F29-97(2002) Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications"
1997,ASTM,"F29-97 Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications"
2009,ASTM,"F30-96(2009) Standard Specification for Iron-Nickel Sealing Alloys"
1996,ASTM,"F30-96 Standard Specification for Iron-Nickel Sealing Alloys"
2010,ASTM,"F31-05(2010) Standard Specification for 42% Nickel-6% Chromium-Iron Sealing Alloy"
1999,ASTM,"F31-94(1999) Standard Specification for 42% Nickel-6% Chromium-Iron Sealing Alloy"
2011,ASTM,"F44-95(2011) Standard Specification for Metallized Surfaces on Ceramic"
2000,ASTM,"F44-95(2000) Standard Specification for Metallized Surfaces on Ceramic"
2001,ASTM,"F72-95(2001) Standard Specification for Gold Wire for Semiconductor Lead Bonding"
1995,ASTM,"F72-95 Standard Specification for Gold Wire for Semiconductor Lead Bonding"
2002,ASTM,"F73-96(2002) Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps"
1996,ASTM,"F73-96 Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps"
2002,ASTM,"F76-86(2002) Standard Test Methods for Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors"
1996,ASTM,"F76-86(1996)e1 Standard Test Methods for Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors"
2002,ASTM,"F83-71(2002) Standard Practice for Definition and Determination of Thermionic Constants of Electron Emitters"
1996,ASTM,"F83-71(1996)e1 Standard Practice for Definition and Determination of Thermionic Constants of Electron Emitters"
2002,ASTM,"F85-76(2002) Standard Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes"
1997,ASTM,"F85-76(1997)e1 Standard Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes"
2010,ASTM,"F96-77(2010) Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms"
2000,ASTM,"F106-00 Standard Specification for Brazing Filler Metals for Electron Devices"
1995,ASTM,"F106-95 Standard Specification for Brazing Filler Metals for Electron Devices"
2010,ASTM,"F180-94(2010)e1 Standard Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices"
1999,ASTM,"F180-94(1999) Standard Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices"
2010,ASTM,"F205-94(2010)e1 Standard Test Method for Measuring Diameter of Fine Wire by Weighing"
1999,ASTM,"F205-94(1999) Standard Test Method for Measuring Diameter of Fine Wire by Weighing"
2002,ASTM,"F219-96(2002) Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps"
2010,ASTM,"F256-05(2010) Standard Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium"
2005,ASTM,"F256-05e1 Standard Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium"
2005,ASTM,"F256-05 Standard Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium"
1999,ASTM,"F256-94(1999) Standard Specification for Chromium-Iron Sealing Alloys with 18 or 26 Percent Chromium"
2002,ASTM,"F269-60(2002) Standard Test Method for Sag of Tungsten Wire"
1996,ASTM,"F269-60(1996)e1 Standard Test Method for Sag of Tungsten Wire"
2002,ASTM,"F288-96(2002) Standard Specification for Tungsten Wire for Electron Devices and Lamps"
2002,ASTM,"F289-96(2002) Standard Specification for Molybdenum Wire and Rod for Electronic Applications"
1996,ASTM,"F289-96 Standard Specification for Molybdenum Wire and Rod for Electronic Applications"
2010,ASTM,"F290-94(2010) Standard Specification for Round Wire for Winding Electron Tube Grid Laterals"
2002,ASTM,"F364-96(2002) Standard Specification for Molybdenum Flattened Wire for Electron Tubes"
1996,ASTM,"F364-96 Standard Specification for Molybdenum Flattened Wire for Electron Tubes"
2010,ASTM,"F375-89(2010) Standard Specification for Integrated Circuit Lead Frame Material"
1999,ASTM,"F375-89(1999) Standard Specification for Integrated Circuit Lead Frame Material"
2011,ASTM,"F390-11 Standard Test Method for  Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array"
2011,ASTM,"F390-11 Standard Test Method for  Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array (Redline)"
1998,ASTM,"F390-98 Standard Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array"
2011,ASTM,"F448-11 Test Method for Measuring Steady-State Primary Photocurrent"
1999,ASTM,"F448-99 Test Method for Measuring Steady-State Primary Photocurrent"
2001,ASTM,"F458-84(2001) Standard Practice for Nondestructive Pull Testing of Wire Bonds"
1995,ASTM,"F458-84(1995)e1 Standard Practice for Nondestructive Pull Testing of Wire Bonds"
2001,ASTM,"F459-84(2001) Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds"
1995,ASTM,"F459-84(1995)e1 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds"
2001,ASTM,"F487-88(2001) Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding"
1995,ASTM,"F487-88(1995)e1 Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding"
2006,ASTM,"F584-06e1 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire"
2006,ASTM,"F584-06 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire"
2005,ASTM,"F584-87(2005) Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire"
1999,ASTM,"F584-87(1999) Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire"
2002,ASTM,"F615M-95(2002) Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components [Metric]"
1995,ASTM,"F615M-95 Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components [Metric]"
2003,ASTM,"F744M-97(2003) Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits [Metric]"
1997,ASTM,"F744M-97 Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits"
2003,ASTM,"F773M-96(2003) Practice for Measuring Dose Rate Response of Linear Integrated Circuits [Metric]"
1996,ASTM,"F773M-96 Practice for Measuring Dose Rate Response of Linear Integrated Circuits"
2010,ASTM,"F980-10 Standard Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices"
2011,ASTM,"F996-11 Standard Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current-Voltage Characteristics"
2011,ASTM,"F996-11 Standard Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current-Voltage Characteristics (Redline)"
2003,ASTM,"F996-98(2003) Standard Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current-Voltage Characteristics"
1998,ASTM,"F996-98 Standard Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current-Voltage Characteristics"
2011,ASTM,"F1190-11 Standard Guide for Neutron Irradiation of Unbiased Electronic Components"
2011,ASTM,"F1263-11 Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts (Redline)"
1995,ASTM,"F1269-89(1995)e1 Test Methods for Destructive Shear Testing of Ball Bonds"
2011,ASTM,"F1467-11 Standard Guide for Use of an X-Ray Tester (<span class=""unicode"">≈10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits</span>"
1999,ASTM,"F1512-94(1999) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies"
2005,ASTM,"F1684-99(2005)e1 Standard Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications"
2011,ASTM,"F2359-04(2011) Standard Test Method for Determining Color of a Membrane Switch Backlit with Diffuse Light Source"
2006,ASTM,"F2576-06e1 Standard Terminology Relating to Declarable Substances in Materials"
2008,ASTM,"F2617-08e1 Standard Test Method for Identification and Quantification of Chromium, Bromine, Cadmium, Mercury, and Lead in Polymeric Material Using Energy Dispersive X-ray Spectrometry"
2010,ASTM,"F2792-10e1 Standard Terminology for Additive Manufacturing Technologies"
2009,ASTM,"F2792-09e1 Standard Terminology for Additive Manufacturing Technologies"
2010,ASTM,"F2853-10e1 Standard Test Method for Determination of Lead in Paint Layers and Similar Coatings or in Substrates and Homogenous Materials by Energy Dispersive X-Ray Fluorescence Spectrometry Using Multiple Monochromatic Excitation Beams"
2011,ASTM,"F2866-11 Standard Test Method for Flammability of a Membrane Switch in Defined Assembly"
2011,ASTM,"F2866-11 Standard Test Method for Flammability of a Membrane Switch in Defined Assembly (Redline)"
2010,ASTM,"F2866-10 Standard Test Method for Flammability of a Membrane Switch in Defined Assembly"
2011,ASTM,"F2915-11 Standard Specification for Additive Manufacturing File Format (AMF)"
2011,ASTM,"F2921-11 Standard Terminology for Additive Manufacturing - Coordinate Systems and Test Methodologies"
2011,ASTM,"E2807-11 Standard Specification for 3D Imaging Data Exchange, Version 1.0"
2008,ASTM,"F76-08 Standard Test Methods for  Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors (Redline)"
1999,ASTM,"F96-77(1999) Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms"
1996,ASTM,"F219-96 Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps"
1996,ASTM,"F288-96 Standard Specification for Tungsten Wire for Electron Devices and Lamps"
1999,ASTM,"F290-94(1999) Standard Specification for Round Wire for Winding Electron Tube Grid Laterals"
2011,ASTM,"F1192-11 Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices"
1998,ASTM,"F1893-98 Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices"
2007,ASTM,"F2576-07 Standard Terminology Relating to Declarable Substances in Materials"
2011,ASTM,"F2865-11 Standard Guide for Classifying the Degrees of Ingression Protection Provided by   a Membrane Switch"
2011,ASTM,"F2931-11 Standard Guide for Analytical Testing of Substances of Very High Concern in Materials and Products"
2009,ASTM,"E2544-09 Standard Terminology for Three-Dimensional (3D) Imaging Systems"
1997,ASTM,"F1842-97 Standard Test Method for Determining Ink or Coating Adhesion on Plastic Substrates for Membrane Switch Applications"
1997,ASTM,"F1843-97 Standard Practice for Sample Preparation of Transparent Plastic Films for Specular Gloss Measurements, on Membrane Switch Overlays"
1997,ASTM,"F1844-97 Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage"
1997,ASTM,"F1845-97 Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Reduction Glow Discharge Mass Spectrometer"
2011,ASTM,"F2576-11 Standard Terminology Relating to Declarable Substances in Materials"
2012,ASTM,"F1689-05(2012) Standard Test Method for  Determining the Insulation Resistance of a Membrane Switch"
2012,ASTM,"F2792-12a Standard Terminology for Additive Manufacturing Technologies<sup>,</sup>"
2012,ASTM,"F2792-12 Standard Terminology for Additive Manufacturing Technologies<sup>,</sup>"
2000,ASTM,"F18-64(2000) Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices"
2003,ASTM,"F1238-95(2003) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications"
1999,ASTM,"F1238-95(1999) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications"
2003,ASTM,"F1594-95(2003) Standard Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications"
1999,ASTM,"F1594-95(1999) Standard Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications"
2001,ASTM,"F2113-01e1 Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications"
2007,ASTM,"F2113-01(2007) Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications"
2012,ASTM,"F18-12 Standard Specification and Test Method for  Evaluation of Glass-to-Metal Headers Used in Electron Devices "
2012,ASTM,"F1995-12 Standard Test Method for Determining the Shear Force of a Surface Mount Device (SMD) in a Membrane Switch"
2012,ASTM,"F16-12 Standard Test Methods for  Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps  (Redline)"
2012,ASTM,"F18-12 Standard Specification and Test Method for  Evaluation of Glass-to-Metal Headers Used in Electron Devices  (Redline)"
2012,ASTM,"F106-12 Standard Specification for  Brazing Filler Metals for Electron Devices  (Redline)"
2012,ASTM,"F2924-12 Standard Specification for  Additive Manufacturing Titanium-6 Aluminum-4 Vanadium with Powder Bed Fusion "
2012,ASTM,"F16-12 Standard Test Methods for  Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps "
2012,ASTM,"F106-12 Standard Specification for  Brazing Filler Metals for Electron Devices "
2012,ASTM,"F1595-00(2012) Standard Practice for  Viewing Conditions for Visual Inspection of Membrane Switches "
2012,ASTM,"F2915-12 Standard Specification for Additive Manufacturing File Format (AMF) Version 1.1 (Redline)"
2012,ASTM,"F29-97(2012) Standard Specification for  Dumet Wire for Glass-to-Metal Seal Applications"
2012,ASTM,"F30-96(2012) Standard Specification for  Iron-Nickel Sealing Alloys"
2012,ASTM,"F31-12 Standard Specification for  Nickel-Chromium-Iron Sealing Alloys"
2012,ASTM,"F1372-93(2012) Standard Test Method for  Scanning Electron Microscope (SEM) Analysis of Metallic Surface  Condition for Gas Distribution System Components"
2012,ASTM,"F1373-93(2012) Standard Test Method for  Determination of Cycle Life of Automatic Valves for Gas Distribution  System Components"
2012,ASTM,"F1374-92(2012) Standard Test Method for Ionic/Organic Extractables of Internal Surfaces-IC/GC/FTIR  for Gas Distribution System Components"
2012,ASTM,"F1375-92(2012) Standard Test Method for  Energy Dispersive X-Ray Spectrometer (EDX) Analysis of Metallic  Surface Condition for Gas Distribution System Components"
2012,ASTM,"F1376-92(2012) Standard Guide for  Metallurgical Analysis for Gas Distribution System Components"
2012,ASTM,"F1394-92(2012) Standard Test Method for  Determination of Particle Contribution from Gas Distribution   System Valves"
2012,ASTM,"F1396-93(2012) Standard Test Method for  Determination of Oxygen Contribution by Gas Distribution System  Components"
2012,ASTM,"F1397-93(2012) Standard Test Method for  Determination of Moisture Contribution by Gas Distribution   System Components"
2012,ASTM,"F1398-93(2012) Standard Test Method for  Determination of Total Hydrocarbon Contribution by Gas Distribution  System Components"
2012,ASTM,"F1438-93(2012) Standard Test Method for Determination of Surface Roughness by Scanning Tunneling Microscopy  for Gas Distribution System Components"
2012,ASTM,"F1892-12 Standard Guide for  Ionizing Radiation (Total Dose) Effects Testing of Semiconductor   Devices"
2012,ASTM,"F1094-87(2012) Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron  and Microelectronic Devices by Direct Pressure Tap Sampling Valve  and by the Presterilized   Plastic Bag Method"
2012,ASTM,"F1892-12 Standard Guide for  Ionizing Radiation (Total Dose) Effects Testing of Semiconductor   Devices (Redline)"
2011,ASTM,"F2921-11e2 Standard Terminology for  Additive Manufacturing—Coordinate Systems and Test Methodologies"
2011,ASTM,"F2921-11e1 Standard Terminology for  Additive Manufacturing—Coordinate Systems and Test Methodologies"
2012,ASTM,"F2964-12 Standard Test Method for Determining the Uniformity of the Luminance of an Electroluminescent  Lamp or Other Diffuse Lighting Device"
2002,ASTM,"F204-76(2002) Standard Test Method for Surface Flaws in Tungsten Seal Rod and Wire"
1996,ASTM,"F204-76(1996)e1 Standard Test Method for Surface Flaws in Tungsten Seal Rod and Wire"
2004,ASTM,"F1662-04 Standard Test Method for Verifying the Specified Dielectric Withstand Voltage and Determining the Dielectric Breakdown Voltage of a Membrane Switch"
2003,ASTM,"F1662-03 Standard Test Method for Verifying the Specified Dielectric Withstand Voltage and Determining the Dielectric Breakdown Voltage of a Membrane Switch"
2002,ASTM,"F1662-95(2002) Standard Test Method for Verifying the Specified Dielectric Withstand Voltage of a Member Switch"
2005,ASTM,"F1995-00(2005) Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane Switch"
2000,ASTM,"F1995-00 Standard Test Method for Determining the Bond Strength for a Surface Mount Device (SMD) by Applying Shear Force on a Membrane Switch"
2002,ASTM,"F2187-02 Standard Test Method for Determining the Effect of Random Frequency Vibration on a Membrane Switch or Membrane Switch Assembly"
2002,ASTM,"F2188-02 Standard Test Method for Determining the Effect of Variable Frequency Vibration on a Membrane Switch or Membrane Switch Assembly"
2007,ASTM,"F2592-07a Standard Test Method for Measuring the Force-Displacement of a Membrane Switch"
2007,ASTM,"F2592-07 Standard Test Method for Measuring the Force-Displacement of a Membrane Switch"
2006,ASTM,"F2592-06 Standard Test Method for Measuring the Force-Displacement of a Membrane Switch"
2013,ASTM,"F458-13 Standard Practice for Nondestructive Pull Testing of Wire Bonds1,2"
2013,ASTM,"F458-13 Standard Practice for Nondestructive Pull Testing of Wire Bonds1,2 (Redline)"
2013,ASTM,"F459-13 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds"
2013,ASTM,"F459-13 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Redline)"
2013,ASTM,"F487-13 Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding"
2013,ASTM,"F1269-13 Standard Test Methods for Destructive Shear Testing of Ball Bonds"
2013,ASTM,"F1269-13 Standard Test Methods for Destructive Shear Testing of Ball Bonds (Redline)"
2013,ASTM,"F2865-13 Standard Guide for Classifying the Degrees of Ingress of Dust and Water into a Membrane Switch"
2013,ASTM,"F2865-13 Standard Guide for Classifying the Degrees of Ingress of Dust and Water into a Membrane Switch (Redline)"
2012,ASTM,"F2924-12a Standard Specification for  Additive Manufacturing Titanium-6 Aluminum-4 Vanadium with   Powder Bed Fusion"
2013,ASTM,"F2980-13 Standard Test Method for Analysis of Heavy Metals in Glass by Field Portable X-Ray Fluorescence  (XRF)"
2013,ASTM,"F3001-13 Standard Specification for Additive Manufacturing Titanium-6 Aluminum-4 Vanadium ELI (Extra  Low Interstitial) with Powder Bed Fusion"
2013,ASTM,"F615M-95(2013) Standard Practice for  Determining Safe Current Pulse-Operating Regions for Metallization  on Semiconductor Components (Metric)"
2013,ASTM,"F1995-13 Standard Test Method for  Determining the Shear Strength of the Bond between a Surface  Mount Device (SMD) and Substrate in a Membrane Switch"
2013,ASTM,"F15-04(2013) Standard Specification for  Iron-Nickel-Cobalt Sealing Alloy"
2013,ASTM,"F73-96(2013) Standard Specification for  Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps"
2013,ASTM,"F83-71(2013) Standard Practice for  Definition and Determination of Thermionic Constants of Electron  Emitters"
2013,ASTM,"F85-76(2013) Standard Practice for  Nomenclature for Wire Leads Used as Conductors in Electron  Tubes"
2013,ASTM,"F204-76(2013) Standard Test Method for  Surface Flaws in Tungsten Seal Rod and Wire"
2013,ASTM,"F219-96(2013) Standard Test Methods of Testing  Fine Round and Flat Wire for Electron Devices and Lamps"
2013,ASTM,"F1995-13 Standard Test Method for  Determining the Shear Strength of the Bond between a Surface  Mount Device (SMD) and Substrate in a Membrane Switch (Redline)"
2013,ASTM,"F2576-13 Standard Terminology Relating to  Declarable Substances in Materials"
2013,ASTM,"F2931-13 Standard Guide for  Analytical Testing of Substances of Very High Concern in Materials   and Products"
2013,ASTM,"E2919-13 Standard Test Method for Evaluating the Performance of Systems that Measure Static,  Six Degrees of Freedom (6DOF), Pose"
1992,ASTM,"F980-92 Guide for The Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices"
2012,ASTM,"F2792-12a Standard Terminology for Additive Manufacturing Technologies<sup>,</sup> (Redline)"
2013,ASTM,"F487-13 Standard Specification for Fine Aluminum&#x2013;1&#x2009;% Silicon Wire for Semiconductor Lead-Bonding (Redline)"
1996,ASTM,"F1763-96 Standard Test Methods for Measuring Contrast of a Linear Polarizer"
1996,ASTM,"E1392-96 Standard Practice for Angle Resolved Optical Scatter Measurements on Specular or Diffuse Surfaces"
2000,ASTM,"F1-94(2000) Standard Specification for Nickel-Clad and Nickel-Plated Steel Strip for Electron Tubes"
2002,ASTM,"F3-02 Standard Specification for Nickel Strip for Electron Tubes"
1999,ASTM,"F4-66(1999) Standard Specification for Carbonized Nickel Strip and Carbonized Nickel-Plated and Nickel-Clad Steel Strip for Electron Tubes"
1997,ASTM,"F28-91(1997) Standard Test Methods for Minority-Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay"
1997,ASTM,"F42-93(1997) Standard Test Methods for Conductivity Type of Extrinsic Semiconducting Materials"
1997,ASTM,"F78-97 Standard Test Method for Calibration of Helium Leak Detectors by Use of Secondary Standards"
1997,ASTM,"F97-72(1997)e1 Standard Practices for Determining Hermeticity of Electron Devices by Dye Penetration"
1997,ASTM,"F357-78(1997)e1 Standard Practice for Determining Solderability of Thick Film Conductors"
2000,ASTM,"F374-00a Standard Test Method for Sheet Resistance of Silicon Epitaxial, Diffused, Polysilicon, and Ion-implanted Layers Using an In-Line Four-Point Probe with the Single-Configuration Procedure"
1996,ASTM,"F391-96 Standard Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-State Surface Photovoltage"
1999,ASTM,"F397-93(1999) Standard Test Method for Resistivity of Silicon Bars Using a Two-Point Probe"
1997,ASTM,"F398-92(1997) Standard Test Method for Majority Carrier Concentration in Semiconductors by Measurement of Wavenumber or Wavelength of the Plasma Resonance Minimum"
1997,ASTM,"F508-77(1997)e1 Standard Practice for Specifying Thick-Film Pastes"
1997,ASTM,"F523-93(1997) Standard Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces"
1999,ASTM,"F528-99 Standard Test Method of Measurement of Common-Emitter D-C Current Gain of Junction Transistors"
2002,ASTM,"F533-02 Standard Test Method for Thickness and Thickness Variation of Silicon Wafers"
2002,ASTM,"F534-02 Standard Test Method for Bow of Silicon Wafers"
1996,ASTM,"F673-90(1996)e1 Standard Test Methods for Measuring Resistivity of Semiconductor Slices or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gage"
1997,ASTM,"F676-97 Standard Test Method for Measuring Unsaturated TTL Sink Current"
1997,ASTM,"F692-97 Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates"
1997,ASTM,"F728-81(1997)e1 Standard Practice for Preparing An Optical Microscope for Dimensional Measurements"
1997,ASTM,"F798-97 Standard Practice for Determining Gettering Rate, Sorption Capacity, and Gas Content of Nonevaporable Getters in the Molecular Flow Region"
1998,ASTM,"F816-83(1998)e1 Standard Test Method for Combined Fine and Gross Leaks for Large Hybrid Microcircuit Packages"
1999,ASTM,"F847-94(1999) Standard Test Methods for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques"
1998,ASTM,"F950-98 Standard Test Method for Measuring the Depth of Crystal Damage of a Mechanically Worked Silicon Slice Surface by Angle Polishing and Defect Etching"
1998,ASTM,"F979-86(1998)e1 Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding"
2000,ASTM,"F1049-00 Standard Practice for Shallow Etch Pit Detection on Silicon Wafers"
1997,ASTM,"F1153-92(1997) Standard Test Method for Characterization of Metal-Oxide-Silicon (MOS) Structures by Capacitance-Voltage Measurements"
2000,ASTM,"F1188-00 Standard Test Method for Interstitial Atomic Oxygen Content of Silicon by Infrared Absorption"
1996,ASTM,"F1261M-96 Standard Test Method for Determining the Average Electrical Width of a Straight, Thin-Film Metal Line [Metric]"
,ASTM,"F1263-99 Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts"
1997,ASTM,"F1366-92(1997)e1 Standard Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometry"
1997,ASTM,"F1390-97 Standard Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning"
2000,ASTM,"F1392-00 Standard Test Method for Determining Net Carrier Density Profiles in Silicon Wafers by Capacitance-Voltage Measurements With a Mercury Probe"
1997,ASTM,"F1393-92(1997) Standard Test Method for Determining Net Carrier Density in Silicon Wafers by Miller Feedback Profiler Measurements With a Mercury Probe"
1994,ASTM,"F1530-94 Standard Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning"
1998,ASTM,"F1617-98 Standard Test Method for Measuring Surface Sodium, Aluminum, Potassium, and Iron on Silicon and EPI Substrates by Secondary Ion Mass Spectrometry"
1996,ASTM,"F980M-96 Standard Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices [Metric]"
1996,ASTM,"F1259M-96 Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric]"
1996,ASTM,"F1260M-96 Standard Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations [Metric]"
1997,ASTM,"F1811-97 Standard Practice for Estimating the Power Spectral Density Function and Related Finish Parameters from Surface Profile Data"
1997,ASTM,"F1725-97 Standard Guide for Analysis of Crystallographic Perfection of Silicon Ingots"
1997,ASTM,"F1726-97 Standard Guide for Analyis of Crystallographic Perfection of Silicon Wafers"
1997,ASTM,"F1727-97 Standard Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers"
1997,ASTM,"F1810-97 Standard Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers"
1996,ASTM,"F616M-96 Standard Test Method for Measuring MOSFET Drain Leakage Current (Metric)"
1997,ASTM,"F1771-97 Standard Test Method for Evaluating Gate Oxide Integrity by Voltage Ramp Technique"
1997,ASTM,"F1809-97 Standard Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon"
1999,ASTM,"F1997-99 Standard Test Method for Determining the Sensitivity (Teasing) of a Tactile Membrane Switch"
1996,ASTM,"F111-96 Standard Practice for Determining Barium Yield, Getter Gas Content, and Getter Sorption Capacity for Barium Flash Getters"
1994,ASTM,"F1211-89(1994)e1 Standard Specification for Semiconductor Device Passivation Opening Layouts"
1994,ASTM,"F637-85(1994)e1 Standard Specification for Format, Physical Properties, and Test Methods for 19 and 35 mm Testable Tape Carrier for Perimeter Tape Carrier-Bonded Semiconductor Devices"
1995,ASTM,"F638-88(1995)e1 Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding"
1999,ASTM,"F3-99 Standard Specification for Nickel Strip for Electron Tubes"
1996,ASTM,"F533-96 Standard Test Method for Thickness and Thickness Variation of Silicon Wafers"
2000,ASTM,"F576-00 Standard Test Method for Measurement of Insulator Thickness and Refractive Index on Silicon Substrates by Ellipsometry"
1999,ASTM,"F928-93(1999) Standard Test Methods for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates"
2001,ASTM,"F951-01 Standard Test Method for Determination of Radial Interstitial Oxygen Variation in Silicon Wafers"
1996,ASTM,"F1724-96 Standard Test Method for Measuring Surface Metal Contamination of Polycrystalline Silicon by Acid Extraction-Atomic Absorption Spectroscopy"
2000,ASTM,"F1619-95(2000) Standard Test Method for Measurement of Interstitial Oxygen Content of Silicon Wafers by Infrared Absorption Spectroscopy with <i>p</i>-Polarized Radiation Incident at the Brewster Angle"
2001,ASTM,"F1597-01 Standard Test Method for Determining the Actuation Force and Contact Force of a Membrane Switch"
2000,ASTM,"F1597-00 Standard Test Method for Determining the Actuation Force and Contact Force of a Membrane Switch"
2000,ASTM,"F81-00 Standard Test Method for Measuring Radial Resistivity Variation on Silicon Wafers"
2000,ASTM,"F154-00 Standard Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces"
2001,ASTM,"F1570-01 Standard Test Method for Determining the Tactile Ratio of a Membrane Switch"
2001,ASTM,"F1152-93(2001) Standard Test Method for Dimensions of Notches on Silicon Wafers"
1996,ASTM,"F951-96 Standard Test Method for Determination of Radial Interstitial Oxygen Variation in Silicon Wafers"
1996,ASTM,"F358-83(1996)e1 Standard Test Method for Wavelength of Peak Photoluminescence and the Corresponding Composition of Gallium Arsenide Phosphide Wafers"
1996,ASTM,"F1723-96 Standard Practice for Evaluation of Polycrystalline Silicon Rods by Float-Zone Crystal Growth and Spectroscopy"
1996,ASTM,"F1708-96 Standard Practice for Evaluation of Granular Polysilicon by Meter-Zoner Spectroscopies"
1996,ASTM,"F418-77(1996)e1 Standard Practice for Preparation of Samples of the Constant Composition Region of Epitaxial Gallium Arsenide Phosphide for Hall Effect Measurements"
1997,ASTM,"F534-97 Standard Test Method for Bow of Silicon Wafers"
1995,ASTM,"F672-88(1995)e1 Standard Test Method for Measuring Resistivity Profiles Perpendicular to the Surface of a Silicon Wafer Using a Spreading Resistance Probe"
1996,ASTM,"F1682-96 Standard Test Method for Determining Travel of a Membrane Switch"
1994,ASTM,"F1570-94 Standard Test Method for Determining the Tactile Ratio of a Membrane Switch"
1996,ASTM,"F1212-89(1996)e1 Standard Test Method for Thermal Stability Testing of Gallium Arsenide Wafers"
1994,ASTM,"F1239-94 Standard Test Methods for Oxygen Precipitation Characterization of Silicon Wafers by Measurement of Interstitial Oxygen Reduction"
1993,ASTM,"F1152-93 Standard Test Method for Dimensions of Notches on Silicon Wafers"
1996,ASTM,"F978-90(1996)e1 Standard Test Method for Characterizing Semiconductor Deep Levels by Transient Capacitance Techniques"
2002,ASTM,"F1529-02 Standard Test Method for Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure"
2003,ASTM,"F980M-96(2003) Standard Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices [Metric]"
2005,ASTM,"F1997-99(2005) Standard Test Method for Determining the Sensitivity (Teasing) of a Tactile Membrane Switch"
2014,ASTM,"F1681-14 Standard Test Method for  Determining Current Carrying Capacity of a Membrane Switch  Circuit"
2014,ASTM,"F1681-14 Standard Test Method for  Determining Current Carrying Capacity of a Membrane Switch  Circuit (Redline)"
2014,ASTM,"F1762-14 Standard Test Method for  Determining the Effects of Atmospheric Pressure Variation on  a Membrane Switch"
2014,ASTM,"F1762-14 Standard Test Method for  Determining the Effects of Atmospheric Pressure Variation on  a Membrane Switch (Redline)"
2014,ASTM,"F1895-14 Standard Test Method for  Submersion of a Membrane Switch"
2014,ASTM,"F1895-14 Standard Test Method for  Submersion of a Membrane Switch (Redline)"
2014,ASTM,"F2072-14 Standard Test Method for  Hosedown of a Membrane Switch"
2014,ASTM,"F2072-14 Standard Test Method for  Hosedown of a Membrane Switch (Redline)"
2013,ASTM,"F2971-13 Standard Practice for Reporting Data for Test Specimens Prepared by Additive Manufacturing"
2014,ASTM,"F2924-14 Standard Specification for  Additive Manufacturing Titanium-6 Aluminum-4 Vanadium with   Powder Bed Fusion"
2014,ASTM,"F2924-14 Standard Specification for  Additive Manufacturing Titanium-6 Aluminum-4 Vanadium with   Powder Bed Fusion (Redline)"
2014,ASTM,"F3001-14 Standard Specification for Additive Manufacturing Titanium-6 Aluminum-4 Vanadium ELI &#40;Extra  Low Interstitial&#41; with Powder Bed Fusion"
2014,ASTM,"F3001-14 Standard Specification for Additive Manufacturing Titanium-6 Aluminum-4 Vanadium ELI &#40;Extra  Low Interstitial&#41; with Powder Bed Fusion (Redline)"
2014,ASTM,"F3055-14 Standard Specification for Additive Manufacturing Nickel Alloy &#40;UNS N07718&#41; with Powder  Bed Fusion"
2014,ASTM,"F3056-14 Standard Specification for Additive Manufacturing Nickel Alloy &#40;UNS N06625&#41; with Powder  Bed Fusion"
2014,ASTM,"F2577-14 Standard Guide for  Assessment of Materials and Products for Declarable Substances"
2014,ASTM,"F2931-14 Standard Guide for  Analytical Testing of Substances of Very High Concern in Materials   and Products"
2014,ASTM,"F1578-07(2014) Standard Test Method for  Contact Closure Cycling of a Membrane Switch"
2014,ASTM,"F269-60(2014) Standard Test Method for  Sag of Tungsten Wire"
2014,ASTM,"F1262M-14 Standard Guide for  Transient Radiation Upset Threshold Testing of Digital Integrated   Circuits &#40;Metric&#41;"
2014,ASTM,"F288-96(2014) Standard Specification for  Tungsten Wire for Electron Devices and Lamps"
2014,ASTM,"F3091/F3091M-14 Standard Specification for Powder Bed Fusion of Plastic Materials"
2014,ASTM,"F289-96(2014) Standard Specification for  Molybdenum Wire and Rod for Electronic Applications"
2014,ASTM,"F364-96(2014) Standard Specification for  Molybdenum Flattened Wire for Electron Tubes?"
2014,ASTM,"F1598-95(2014) Standard Test Method  for Determining the Effects of Chemical/Solvent Exposure to  a Membrane Switch/Graphic Overlay &#40;Spot Test Method&#41;"
2014,ASTM,"F1680-07a(2014) Standard Test Method for  Determining Circuit Resistance of a Membrane Switch"
2014,ASTM,"F3049-14 Standard Guide for Characterizing Properties of Metal Powders Used for Additive  Manufacturing Processes"
2014,ASTM,"E2919-14 Standard Test Method for Evaluating the Performance of Systems that Measure Static,  Six Degrees of Freedom &#40;6DOF&#41;, Pose"
2014,ASTM,"F1262M-14 Standard Guide for  Transient Radiation Upset Threshold Testing of Digital Integrated   Circuits &#40;Metric&#41; (Redline)"
2010,ASTM,"F980-10e1 Standard Guide for  Measurement of Rapid Annealing of Neutron-Induced Displacement   Damage in Silicon Semiconductor Devices"
2014,ASTM,"F3056-14e1 Standard Specification for Additive Manufacturing Nickel Alloy &#40;UNS N06625&#41; with Powder  Bed Fusion"
2014,ASTM,"F1996-14 Standard Test Method for  Silver Migration for Membrane Switch Circuitry (Redline)"
2014,ASTM,"F2073-14 Standard Test Method for  Non-Destructive Short Circuit Testing of a Membrane Switch (Redline)"
2014,ASTM,"F3055-14e1 Standard Specification for Additive Manufacturing Nickel Alloy (UNS N07718) with Powder  Bed Fusion"
2014,ASTM,"F3055-14a Standard Specification for Additive Manufacturing Nickel Alloy (UNS N07718) with Powder  Bed Fusion"
2014,ASTM,"F3055-14a Standard Specification for Additive Manufacturing Nickel Alloy (UNS N07718) with Powder  Bed Fusion (Redline)"
2014,ASTM,"F1996-14 Standard Test Method for  Silver Migration for Membrane Switch Circuitry"
2014,ASTM,"F2073-14 Standard Test Method for  Non-Destructive Short Circuit Testing of a Membrane Switch"
2014,ASTM,"F3122-14 Standard Guide for Evaluating Mechanical Properties of Metal Materials Made via  Additive Manufacturing Processes"
2015,ASTM,"F2931-15 Standard Guide for  Analytical Testing of Substances of Very High Concern in Materials   and Products"
2015,ASTM,"E2938-15 Standard Test Method for Evaluating the Relative-Range Measurement Performance of 3D  Imaging Systems in the Medium Range"
2015,ASTM,"F2360-08(2015)e1 Standard Test Method for  Determining Luminance of a Membrane Switch Backlit with Diffuse  Light Source"
2015,ASTM,"F3139-15 Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry"
2015,ASTM,"F1661-09(2015) Standard Test Method for  Determining the Contact Bounce Time of a Membrane Switch"
2015,ASTM,"F2749-15 Standard Test Method for  Determining the Effects of Creasing a Membrane Switch or Printed  Electronic Device"
2015,ASTM,"F2749-15 Standard Test Method for  Determining the Effects of Creasing a Membrane Switch or Printed  Electronic Device (Redline)"
2015,ASTM,"F1843-15 Standard Practice for  Sample Preparation of Plastic Films used on Membrane Switch  Overlays for Specular Gloss Measurements"
2015,ASTM,"F1843-15 Standard Practice for  Sample Preparation of Plastic Films used on Membrane Switch  Overlays for Specular Gloss Measurements (Redline)"
2015,ASTM,"F1842-15 Standard Test Method for  Determining Ink or Coating Adhesion on Flexible Substrates  for a Membrane Switch or Printed Electronic Device"
2015,ASTM,"F1842-15 Standard Test Method for  Determining Ink or Coating Adhesion on Flexible Substrates  for a Membrane Switch or Printed Electronic Device (Redline)"
2015,ASTM,"F3147-15 Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD)  Joints on a  Flexible Circuit by  a Rolling  Mandrel Bend"
2015,ASTM,"F1663-15 Standard Test Method for  Determining the Capacitance of a Membrane Switch or Printed  Electronic Device"
2015,ASTM,"F1663-15 Standard Test Method for  Determining the Capacitance of a Membrane Switch or Printed  Electronic Device (Redline)"
2015,ASTM,"F1812-15 Standard Test Method for  Determining the Effect of an ESD Discharge on a Membrane Switch  or Printed Electronic Device"
2015,ASTM,"F1812-15 Standard Test Method for  Determining the Effect of an ESD Discharge on a Membrane Switch  or Printed Electronic Device (Redline)"
2015,ASTM,"F1596-15 Standard Test Method for  Exposure of a Membrane Switch or Printed Electronic Device  to Temperature and Relative Humidity"
2015,ASTM,"F1596-15 Standard Test Method for  Exposure of a Membrane Switch or Printed Electronic Device  to Temperature and Relative Humidity (Redline)"
2015,ASTM,"F3152-15 Standard Test Method for Determining Abrasion Resistance of Inks and Coatings on Substrates  Using Norman Tool &#x201c;WA-1010 Wet Abrader&#x201d;"
2015,ASTM,"F2576-15 Standard Terminology Relating to  Declarable Substances in Materials"
2015,ASTM,"F3078-15 Standard Test Method for Identification and Quantification of Lead in Paint and Similar  Coating Materials using Energy Dispersive X-ray Fluorescence Spectrometry  (EDXRF)"
2015,ASTM,"F2576-15a Standard Terminology Relating to  Declarable Substances in Materials"
2015,ASTM,"F2576-15a Standard Terminology Relating to  Declarable Substances in Materials (Redline)"
2015,ASTM,"F96-77(2015) Standard Specification for  Electronic Grade Alloys of Copper and Nickel in Wrought Forms"
2015,ASTM,"F180-94(2015) Standard Test Method for  Density of Fine Wire and Ribbon Wire for Electronic Devices"
2015,ASTM,"F205-94(2015) Standard Test Method for  Measuring Diameter of Fine Wire by Weighing"
2015,ASTM,"F256-05(2015) Standard Specification for  Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium"
2015,ASTM,"F290-94(2015) Standard Specification for  Round Wire for Winding Electron Tube Grid Laterals"
2015,ASTM,"F375-89(2015) Standard Specification for  Integrated Circuit Lead Frame Material"
2015,ASTM,"F1466-99(2015) Standard Specification for  Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications"
2015,ASTM,"F2853-10(2015) Standard Test Method for  Determination of Lead in Paint Layers and Similar Coatings   or in Substrates and Homogenous Materials by Energy Dispersive X-Ray   Fluorescence Spectrometry Using Multiple Monochromatic Excitation   Beams"
2015,ASTM,"F2617-15 Standard Test Method for  Identification and Quantification of Chromium, Bromine, Cadmium,  Mercury, and Lead in Polymeric Material Using Energy Dispersive X-ray  Spectrometry"
2015,ASTM,"F2617-15 Standard Test Method for  Identification and Quantification of Chromium, Bromine, Cadmium,  Mercury, and Lead in Polymeric Material Using Energy Dispersive X-ray  Spectrometry (Redline)"
2016,ASTM,"ISO/ASTM52915-16 Standard Specification for  Additive Manufacturing File Format (AMF) Version 1.2"
2016,ASTM,"F31-16 Standard Specification for  Nickel-Chromium-Iron Sealing Alloys"
2016,ASTM,"F44-16 Standard Specification for  Metallized Surfaces on Ceramic"
2016,ASTM,"F7-95(2016) Standard Specification for  Aluminum Oxide Powder"
2016,ASTM,"F19-11(2016) Standard Test Method for  Tension and Vacuum Testing Metallized Ceramic Seals"
2016,ASTM,"F76-08(2016) Standard Test Methods for  Measuring Resistivity and Hall Coefficient and Determining  Hall Mobility in Single-Crystal Semiconductors"
2016,ASTM,"F1593-08(2016) Standard Test Method for  Trace Metallic Impurities in Electronic Grade Aluminum by High  Mass-Resolution Glow-Discharge Mass Spectrometer"
2016,ASTM,"F1684-06(2016) Standard Specification for  Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion   Applications"
2016,ASTM,"F1709-97(2016) Standard Specification for  High Purity Titanium Sputtering Targets for Electronic Thin  Film Applications"
2016,ASTM,"F1710-08(2016) Standard Test Method for  Trace Metallic Impurities in Electronic Grade Titanium by High   Mass-Resolution Glow Discharge Mass Spectrometer"
2016,ASTM,"F1844-97(2016) Standard Practice for  Measuring Sheet Resistance of Thin Film Conductors For Flat  Panel Display Manufacturing Using a Noncontact Eddy Current Gage"
2016,ASTM,"F1845-08(2016) Standard Test Method for  Trace Metallic Impurities in Electronic Grade Aluminum-Copper,  Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution  Glow Discharge Mass Spectrometer"
2016,ASTM,"F2771-10(2016) Standard Test Method for  Determining the Luminance Curve of an Electroluminescent Lamp   at Ambient  Conditions"
2016,ASTM,"F1896-16 Test Method for  Determining the Electrical Resistivity of a Printed Conductive   Material"
2016,ASTM,"F1896-16 Test Method for  Determining the Electrical Resistivity of a Printed Conductive   Material (Redline)"
2016,ASTM,"F1662-16 Standard Test Method for  Verifying the Specified Dielectric Withstand Voltage and Determining   the Dielectric Breakdown Voltage of a Membrane Switch or Printed  Electronic Device"
2016,ASTM,"F1662-16 Standard Test Method for  Verifying the Specified Dielectric Withstand Voltage and Determining   the Dielectric Breakdown Voltage of a Membrane Switch or Printed  Electronic Device (Redline)"
2016,ASTM,"F2592-16 Standard Test Method for  Measuring the Force-Displacement of a Membrane Switch"
2016,ASTM,"F2592-16 Standard Test Method for  Measuring the Force-Displacement of a Membrane Switch (Redline)"
2016,ASTM,"F2750-16 Standard Test Method for  Determining the Effects of Bending a Membrane Switch or Printed  Electronic Device"
2016,ASTM,"F2750-16 Standard Test Method for  Determining the Effects of Bending a Membrane Switch or Printed  Electronic Device (Redline)"
2016,ASTM,"F3152-16 Standard Test Method for Determining Abrasion Resistance of Inks and Coatings on Substrates  Using Dry or Wet Abrasive Medium"
2016,ASTM,"F3152-16 Standard Test Method for Determining Abrasion Resistance of Inks and Coatings on Substrates  Using Dry or Wet Abrasive Medium (Redline)"
2016,ASTM,"F744M-16 Standard Test Method for  Measuring Dose Rate Threshold for Upset of Digital Integrated   Circuits (Metric)"
2016,ASTM,"F744M-16 Standard Test Method for  Measuring Dose Rate Threshold for Upset of Digital Integrated   Circuits (Metric) (Redline)"
2016,ASTM,"F1711-96(2016) Standard Practice for  Measuring Sheet Resistance of Thin Film Conductors for Flat   Panel Display Manufacturing Using a Four-Point Probe Method"
2016,ASTM,"F773M-16 Standard Practice for  Measuring Dose Rate Response of Linear Integrated Circuits   (Metric)"
2016,ASTM,"F773M-16 Standard Practice for  Measuring Dose Rate Response of Linear Integrated Circuits   (Metric) (Redline)"
2016,ASTM,"E3064-16 Standard Test Method for Evaluating the Performance of Optical Tracking Systems that  Measure Six Degrees of Freedom (6DOF) Pose"
2016,ASTM,"F3166-16 Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon  Vias (TSV) Metallization"
2016,ASTM,"F2931-16 Standard Guide for  Analytical Testing of Substances of Very High Concern in Materials   and Products"
2016,ASTM,"F3192-16 Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon  Vias (TSV) Mettalization"
2016,ASTM,"F3184-16 Standard Specification for Additive Manufacturing Stainless Steel Alloy (UNS S31603) with  Powder Bed Fusion"
2016,ASTM,"F3187-16 Standard Guide for Directed Energy Deposition of Metals"
2016,ASTM,"F980-16 Standard Guide for  Measurement of Rapid Annealing of Neutron-Induced Displacement   Damage in Silicon Semiconductor Devices"
2016,ASTM,"F980-16 Standard Guide for  Measurement of Rapid Annealing of Neutron-Induced Displacement   Damage in Silicon Semiconductor Devices (Redline)"
2016,ASTM,"F2931-16e1 Standard Guide for  Analytical Testing of Substances of Very High Concern in Materials   and Products"
2017,ASTM,"ISO/ASTM52910-17 Standard Guidelines for Design for Additive Manufacturing "
2016,ASTM,"ISO/ASTM52901-16 Standard Guide for Additive Manufacturing &#x2013; General Principles &#x2013;  Requirements for Purchased AM Parts"
2017,ASTM,"E2641-09(2017) Standard Practice for  Best Practices for Safe Application of 3D Imaging Technology"
2016,ASTM,"F76-08(2016)e1 Standard Test Methods for  Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors"
2017,ASTM,"F15-04(2017) Standard Specification for  Iron-Nickel-Cobalt Sealing Alloy"
2017,ASTM,"F16-12(2017) Standard Test Methods for  Measuring Diameter or Thickness of Wire and Ribbon for Electronic   Devices and Lamps"
2017,ASTM,"F18-12(2017) Standard Specification and Test Method for  Evaluation of Glass-to-Metal Headers Used in Electron Devices"
2017,ASTM,"F29-97(2017) Standard Specification for  Dumet Wire for Glass-to-Metal Seal Applications"
2017,ASTM,"F30-96(2017) Standard Specification for  Iron-Nickel Sealing Alloys"
2017,ASTM,"F73-96(2017) Standard Specification for  Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps"
2017,ASTM,"F106-12(2017) Standard Specification for  Brazing Filler Metals for Electron Devices"
2017,ASTM,"F2931-17 Standard Guide for  Analytical Testing of Substances of Very High Concern in Materials   and Products"
2017,ASTM,"F2980-13(2017) Standard Test Method for Analysis of Heavy Metals in Glass by Field Portable X-Ray Fluorescence  (XRF)"
2017,ASTM,"F3291-17 Standard Test Method for Measuring the Force-Resistance of a Membrane Force Sensor"
2017,ASTM,"F3290-17 Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic  Device to its Final Support Structure"
2017,ASTM,"E3125-17 Standard Test Method for Evaluating the Point-to-Point Distance Measurement Performance  of Spherical Coordinate 3D Imaging Systems in the Medium Range"
2017,ASTM,"E3124-17 Standard Test Method for Measuring System Latency Performance of Optical Tracking Systems  that Measure Six Degrees of Freedom (6DOF) Pose"
2017,ASTM,"F3213-17 Standard for Additive Manufacturing &#x2013; Finished Part Properties &#x2013;  Standard Specification for Cobalt-28 Chromium-6 Molybdenum via Powder  Bed Fusion"
2017,ASTM,"F72-17 Standard Specification for Gold Wire for Semiconductor Lead Bonding"
2018,ASTM,"F3318-18 Standard for Additive Manufacturing &#x2013; Finished Part Properties &#x2013;  Specification for AlSi10Mg with Powder Bed Fusion &#x2013; Laser Beam"
2018,ASTM,"F3301-18 Standard for Additive Manufacturing &#x2013; Post Processing Methods &#x2013;  Standard Specification for Thermal Post-Processing Metal Parts Made  Via Powder Bed Fusion"
2018,ASTM,"F3302-18 Standard for Additive Manufacturing &#x2013; Finished Part Properties &#x2013;  Standard Specification for Titanium Alloys via Powder Bed Fusion"
2018,ASTM,"F1190-18 Standard Guide for  Neutron Irradiation of Unbiased Electronic Components"
2018,ASTM,"F83-71(2018) Standard Practice for  Definition and Determination of Thermionic Constants of Electron  Emitters"
2018,ASTM,"F85-76(2018) Standard Practice for  Nomenclature for Wire Leads Used as Conductors in Electron  Tubes"
2018,ASTM,"F204-76(2018) Standard Test Method for  Surface Flaws in Tungsten Seal Rod and Wire"
2018,ASTM,"F219-96(2018) Standard Test Methods of Testing  Fine Round and Flat Wire for Electron Devices and Lamps"
2018,ASTM,"F458-13(2018) Standard Practice for  Nondestructive Pull Testing of Wire Bonds"
2018,ASTM,"F459-13(2018) Standard Test Methods for  Measuring Pull Strength of Microelectronic Wire Bonds"
2018,ASTM,"F487-13(2018) Standard Specification for  Fine Aluminum&#x2013;1&#x2009;% Silicon Wire for Semiconductor  Lead-Bonding"
2018,ASTM,"F996-11(2018) Standard Test Method for  Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage   Shift Into Components Due to Oxide Trapped Holes and Interface States   Using the  Subthreshold Current&#x2013;Voltage Characteristics"
2018,ASTM,"F1192-11(2018) Standard Guide for the  Measurement of Single Event Phenomena (SEP) Induced by Heavy   Ion Irradiation of Semiconductor Devices "
2018,ASTM,"F1269-13(2018) Standard Test Methods for  Destructive Shear Testing of Ball Bonds"
2018,ASTM,"F1892-12(2018) Standard Guide for  Ionizing Radiation (Total Dose) Effects Testing of Semiconductor   Devices"
2018,ASTM,"F448-18 Standard Test Method for  Measuring Steady-State Primary Photocurrent"
2018,ASTM,"F1467-18 Standard Guide for  Use of an X-Ray Tester (&#x2248;10 keV Photons) in Ionizing  Radiation Effects Testing of Semiconductor Devices and Microcircuits"
2018,ASTM,"F1893-18 Guide for  Measurement of Ionizing Dose-Rate Survivability and Burnout   of Semiconductor Devices"
2018,ASTM,"F3303-18 Standard for Additive Manufacturing &#x2013; Process Characteristics and  Performance: Practice for Metal Powder Bed Fusion Process to Meet  Critical Applications"
2018,ASTM,"F3301-18a Standard for Additive Manufacturing &#x2013; Post Processing Methods &#x2013;  Standard Specification for Thermal Post-Processing Metal Parts Made  Via Powder Bed Fusion"
2018,ASTM,"F3301-18a Standard for Additive Manufacturing &#x2013; Post Processing Methods &#x2013;  Standard Specification for Thermal Post-Processing Metal Parts Made  Via Powder Bed Fusion (Redline)"
2019,ASTM,"F2931-19 Standard Guide for  Analytical Testing of Substances of Very High Concern in Materials   and Products"
2019,ASTM,"E2807-11(2019) Standard Specification for  3D Imaging Data Exchange, Version 1.0"
2019,ASTM,"E2544-11a(2019) Standard Terminology for  Three-Dimensional (3D) Imaging Systems"
2019,ASTM,"F269-60(2019) Standard Test Method for  Sag of Tungsten Wire"
2019,ASTM,"F288-96(2019) Standard Specification for  Tungsten Wire for Electron Devices and Lamps"
2019,ASTM,"F289-96(2019) Standard Specification for  Molybdenum Wire and Rod for Electronic Applications"
2019,ASTM,"F364-96(2019) Standard Specification for  Molybdenum Flattened Wire for Electron Tubes&#x2009;"
2019,ASTM,"F2725-19 Standard Guide for  European Union&apos;s Registration, Evaluation, and Authorization   of Chemicals (REACH) Supply Chain Information Exchange"
2019,ASTM,"F2725-19 Standard Guide for  European Union&apos;s Registration, Evaluation, and Authorization   of Chemicals (REACH) Supply Chain Information Exchange (Redline)"
2019,ASTM,"ISO/ASTM52902-19  Additive manufacturing &#x2014; Test artifacts &#x2014; Geometric  capability assessment of additive manufacturing systems"
2019,ASTM,"ISO/ASTM52911-1-19  Additive manufacturing &#x2014; Design &#x2014; Part 1: Laser-based  powder bed fusion of metals"
2019,ASTM,"ISO/ASTM52911-2-19  Additive manufacturing &#x2014; Design &#x2014; Part 2: Laser-based  powder bed fusion of polymers"
2013,ASTM,"ISO/ASTM52921-13 Standard Terminology for Additive Manufacturing-Coordinate Systems and Test Methodologies"
2019,ASTM,"ISO/ASTM52921-13(2019) Standard Terminology for  Additive Manufacturing&#x2014;Coordinate Systems and Test Methodologies"
2019,ASTM,"ISO/ASTM52907-19  Additive manufacturing &#x2014; Feedstock materials &#x2014;  Methods to characterize metallic powders"
2019,ASTM,"F1263-11(2019) Standard Guide for  Analysis of Overtest Data in Radiation Testing of Electronic   Parts"
2019,ASTM,"F2112-02(2019) Standard Terminology for  Membrane Switches"
2019,ASTM,"F2187-02(2019) Standard Test Method for  Determining the Effect of Random Frequency Vibration on a Membrane   Switch or Membrane Switch Assembly"
2019,ASTM,"F2188-02(2019) Standard Test Method for  Determining the Effect of Variable Frequency Vibration on a   Membrane Switch or Membrane Switch Assembly"
2019,ASTM,"F2359-04(2019) Standard Test Method for  Determining Color of a Membrane Switch Backlit with Diffuse   Light Source"
2019,ASTM,"F2866-11(2019) Standard Test Method for  Flammability of a Membrane Switch in Defined Assembly"
2019,ASTM,"F2931-19a Standard Guide for  Analytical Testing of Substances of Very High Concern in Materials   and Products"
2019,ASTM,"F2931-19a Standard Guide for  Analytical Testing of Substances of Very High Concern in Materials   and Products (Redline)"
2019,ASTM,"ISO/ASTM52904-19  Additive Manufacturing &#x2013; Process Characteristics and  Performance: Practice for Metal Powder Bed Fusion Process to Meet  Critical Applications"
2017,ASTM,"F72-17e1 Standard Specification for Gold Wire for Semiconductor Lead Bonding"
2019,ASTM,"F3413-19 Guide for Additive Manufacturing &#x2014; Design &#x2014; Directed Energy  Deposition"
2020,ASTM,"F1094-87(2020) Standard Test Methods for  Microbiological Monitoring of Water Used for Processing Electron  and Microelectronic Devices by Direct Pressure Tap Sampling Valve  and by the Presterilized   Plastic Bag Method"
2020,ASTM,"F1372-93(2020) Standard Test Method for  Scanning Electron Microscope (SEM) Analysis of Metallic Surface  Condition for Gas Distribution System Components"
2020,ASTM,"F1373-93(2020) Standard Test Method for  Determination of Cycle Life of Automatic Valves for Gas Distribution  System Components"
2020,ASTM,"F1374-92(2020) Standard Test Method for  Ionic/Organic Extractables of Internal Surfaces-IC/GC/FTIR  for Gas Distribution System Components"
2020,ASTM,"F1375-92(2020) Standard Test Method for  Energy Dispersive X-Ray Spectrometer (EDX) Analysis of Metallic  Surface Condition for Gas Distribution System Components"
2020,ASTM,"F1376-92(2020) Standard Guide for  Metallurgical Analysis for Gas Distribution System Components"
2020,ASTM,"F1394-92(2020) Standard Test Method for  Determination of Particle Contribution from Gas Distribution   System Valves"
2002,ASTM,"E1392-96(2002) Standard Practice for Angle Resolved Optical Scatter Measurements on Specular or Diffuse Surfaces (Withdrawn 2003)"
2003,ASTM,"F1-03 Standard Specification for Nickel-Clad and Nickel-Plated Steel Strip for Electron Tubes (Withdrawn 2009)"
2002,ASTM,"F3-02a Standard Specification for Nickel Strip for Electron Tubes (Withdrawn 2008)"
2005,ASTM,"F4-66(2005) Standard Specification for Carbonized Nickel Strip and Carbonized Nickel-Plated and Nickel-Clad Steel Strip for Electron Tubes (Withdrawn 2010)"
1999,ASTM,"F26-87a(1999) Standard Test Methods for Determining the Orientation of a Semiconductive Single Crystal (Withdrawn 2003)"
2002,ASTM,"F28-02 Standard Test Methods for Minority-Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay (Withdrawn 2003)"
2002,ASTM,"F42-02 Standard Test Methods for Conductivity Type of Extrinsic Semiconducting Materials (Withdrawn 2003)"
1999,ASTM,"F43-99 Standard Test Methods for Resistivity of Semiconductor Materials (Withdrawn 2003)"
2002,ASTM,"F78-97(2002) Standard Test Method for Calibration of Helium Leak Detectors by Use of Secondary Standards (Withdrawn 2008)"
2001,ASTM,"F81-01 Standard Test Method for Measuring Radial Resistivity Variation on Silicon Wafers (Withdrawn 2003)"
2002,ASTM,"F84-02 Standard Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Probe (Withdrawn 2003)"
2000,ASTM,"F95-89(2000) Standard Test Method for Thickness of Lightly Doped Silicon Epitaxial Layers on Heavily Doped Silicon Substrates Using an Infrared Dispersive Spectrophotometer (Withdrawn 2003)"
2002,ASTM,"F97-72(2002)e1 Standard Practices for Determining Hermeticity of Electron Devices by Dye Penetration (Withdrawn 2008)"
2000,ASTM,"F110-00a Standard Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique (Withdrawn 2003)"
2002,ASTM,"F111-96(2002) Standard Practice for Determining Barium Yield, Getter Gas Content, and Getter Sorption Capacity for Barium Flash Getters (Withdrawn 2008)"
2002,ASTM,"F154-02 Standard Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces (Withdrawn 2003)"
2002,ASTM,"F357-78(2002) Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)"
2002,ASTM,"F358-83(2002) Standard Test Method for Wavelength of Peak Photoluminescence and the Corresponding Composition of Gallium Arsenide Phosphide Wafers (Withdrawn 2008)"
2002,ASTM,"F374-02 Standard Test Method for Sheet Resistance of Silicon Epitaxial, Diffused, Polysilicon, and Ion-implanted Layers Using an In-Line Four-Point Probe with the Single-Configuration Procedure (Withdrawn 2003)"
2002,ASTM,"F391-02 Standard Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-State Surface Photovoltage (Withdrawn 2003)"
2002,ASTM,"F397-02 Standard Test Method for Resistivity of Silicon Bars Using a Two-Point Probe (Withdrawn 2003)"
2002,ASTM,"F398-92(2002) Standard Test Method for Majority Carrier Concentration in Semiconductors by Measurement of Wavenumber or Wavelength of the Plasma Resonance Minimum (Withdrawn 2003)"
2002,ASTM,"F418-77(2002) Standard Practice for Preparation of Samples of the Constant Composition Region of Epitaxial Gallium Arsenide Phosphide for Hall Effect Measurements (Withdrawn 2008)"
1994,ASTM,"F419-94 Test Method for Determining Carrier Density in Silicon Epitaxial Layers by Capacitance-Voltage Measurements on Fabricated Junction or Schottky Diodes (Withdrawn 2001)"
2002,ASTM,"F508-77(2002) Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)"
2002,ASTM,"F523-02 Standard Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces (Withdrawn 2003)"
1992,ASTM,"F524-77(1992) Test Methods for Measuring Beam Divergence of Pulsed Lasers by the Apertured-Detector Technique (Withdrawn 2001)"
2000,ASTM,"F525-00a Standard Test Method for Measuring Resistivity of Silicon Wafers Using a Spreading Resistance Probe (Withdrawn 2003)"
2005,ASTM,"F528-99(2005) Standard Test Method of Measurement of Common-Emitter D-C Current Gain of Junction Transistors (Withdrawn 2011)"
2002,ASTM,"F533-02a Standard Test Method for Thickness and Thickness Variation of Silicon Wafers (Withdrawn 2003)"
2002,ASTM,"F534-02a Standard Test Method for Bow of Silicon Wafers (Withdrawn 2003)"
2001,ASTM,"F576-01 Standard Test Method for Measurement of Insulator Thickness and Refractive Index on Silicon Substrates by Ellipsometry (Withdrawn 2003)"
1993,ASTM,"F613-93 Test Method for Measuring Diameter of Semiconductor Wafers (Withdrawn 2001)"
2003,ASTM,"F616M-96(2003) Standard Test Method for Measuring MOSFET Drain Leakage Current (Metric) (Withdrawn 2009)"
2000,ASTM,"F617-00 Standard Test Method for Measuring MOSFET Linear Threshold Voltage (Withdrawn 2006)"
2001,ASTM,"F637-85(2001) Standard Specification for Format, Physical Properties, and Test Methods for 19 and 35 mm Testable Tape Carrier for Perimeter Tape Carrier-Bonded Semiconductor Devices (Withdrawn 2006)"
2001,ASTM,"F638-88(2001) Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)"
1999,ASTM,"F657-92(1999) Standard Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning (Withdrawn 2003)"
1999,ASTM,"F671-99 Standard Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials (Withdrawn 2003)"
2001,ASTM,"F672-01 Standard Test Method for Measuring Resistivity Profiles Perpendicular to the Surface of a Silicon Wafer Using a Spreading Resistance Probe (Withdrawn 2003)"
2002,ASTM,"F673-02 Standard Test Methods for Measuring Resistivity of Semiconductor Slices or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gage (Withdrawn 2003)"
1999,ASTM,"F674-92(1999) Standard Practice for Preparing Silicon for Spreading Resistance Measurements (Withdrawn 2003)"
2003,ASTM,"F676-97(2003) Standard Test Method for Measuring Unsaturated TTL Sink Current (Withdrawn 2009)"
2002,ASTM,"F692-97(2002) Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates (Withdrawn 2008)"
1999,ASTM,"F723-99 Standard Practice for Conversion Between Resistivity and Dopant Density for Boron-Doped, Phosphorus-Doped, and Arsenic-Doped Silicon (Withdrawn 2003)"
2003,ASTM,"F728-81(2003) Standard Practice for Preparing An Optical Microscope for Dimensional Measurements (Withdrawn 2003)"
2000,ASTM,"F769-00 Standard Test Method for Measuring Transistor and Diode Leakage Currents (Withdrawn 2006)"
2002,ASTM,"F798-97(2002) Standard Practice for Determining Gettering Rate, Sorption Capacity, and Gas Content of Nonevaporable Getters in the Molecular Flow Region (Withdrawn 2008)"
2003,ASTM,"F816-83(2003) Standard Test Method for Combined Fine and Gross Leaks for Large Hybrid Microcircuit Packages (Withdrawn 2009)"
1990,ASTM,"F817-83(1990) Test Method for Characterization of Film Resistor Materials and Processes (Withdrawn 1996)"
2002,ASTM,"F847-02 Standard Test Methods for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques (Withdrawn 2003)"
2002,ASTM,"F928-02 Standard Test Methods for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates (Withdrawn 2003)"
2002,ASTM,"F950-02 Standard Test Method for Measuring the Depth of Crystal Damage of a Mechanically Worked Silicon Slice Surface by Angle Polishing and Defect Etching (Withdrawn 2003)"
2002,ASTM,"F951-02 Standard Test Method for Determination of Radial Interstitial Oxygen Variation in Silicon Wafers (Withdrawn 2003)"
2002,ASTM,"F978-02 Standard Test Method for Characterizing Semiconductor Deep Levels by Transient Capacitance Techniques (Withdrawn 2003)"
2003,ASTM,"F979-86(2003) Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding (Withdrawn 2009)"
1999,ASTM,"F1048-87(1999) Standard Test Method for Measuring the Effective Surface Roughness of Optical Components by Total Integrated Scattering (Withdrawn 2003)"
2002,ASTM,"F1049-02 Standard Practice for Shallow Etch Pit Detection on Silicon Wafers (Withdrawn 2003"
1994,ASTM,"F1095-88(1994)E01 Test Method for Rapid Enumeration of Bacteria in Electronics-Grade Purified Water Systems by Direct-Count Epifluorescence Microscopy (Withdrawn 2001)"
2002,ASTM,"F1152-02 Standard Test Method for Dimensions of Notches on Silicon Wafers (Withdrawn 2003)"
2002,ASTM,"F1153-92(2002) Standard Test Method for Characterization of Metal-Oxide-Silicon (MOS) Structures by Capacitance-Voltage Measurements (Withdrawn 2003)"
2002,ASTM,"F1188-02 Standard Test Method for Interstitial Atomic Oxygen Content of Silicon by Infrared Absorption with Short Baseline (Withdrawn 2003)"
2001,ASTM,"F1211-89(2001) Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)"
2002,ASTM,"F1212-89(2002) Standard Test Method for Thermal Stability Testing of Gallium Arsenide Wafers (Withdrawn 2008)"
2002,ASTM,"F1239-02 Standard Test Methods for Oxygen Precipitation Characterization of Silicon Wafers by Measurement of Interstitial Oxygen Reduction (Withdrawn 2003)"
2000,ASTM,"F1241-95(2000) Standard Terminology of Silicon Technology (Withdrawn 2003)"
2003,ASTM,"F1259M-96(2003) Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric] (Withdrawn 2009)"
2003,ASTM,"F1260M-96(2003) Standard Test Method for Estimating Electromigration Median Time-to-Failure and Sigma of Integrated Circuit Metallizations [Metric] (Withdrawn 2009)"
2003,ASTM,"F1261M-96(2003) Standard Test Method for Determining the Average Electrical Width of a Straight, Thin-Film Metal Line [Metric] (Withdrawn 2009)"
2002,ASTM,"F1366-92(2002) Standard Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometry (Withdrawn 2003)"
2000,ASTM,"F1388-92(2000) Standard Test Method for Generation Lifetime and Generation Velocity of Silicon Material by Capacitance-Time Measurements of Metal-Oxide-Silicon (MOS) Capacitors (Withdrawn 2003)"
2000,ASTM,"F1389-00 Standard Test Methods for Photoluminescence Analysis of Single Crystal Silicon for III-V Impurities (Withdrawn 2003)"
2002,ASTM,"F1390-02 Standard Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning (Withdrawn 2003)"
2000,ASTM,"F1391-93(2000) Standard Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption (Withdrawn 2003)"
2002,ASTM,"F1392-02 Standard Test Method for Determining Net Carrier Density Profiles in Silicon Wafers by Capacitance-Voltage Measurements With a Mercury Probe (Withdrawn 2003)"
2002,ASTM,"F1393-02 Standard Test Method for Determining Net Carrier Density in Silicon Wafers by Miller Feedback Profiler Measurements With a Mercury Probe (Withdrawn 2003)"
2020,ASTM,"F1396-93(2020) Standard Test Method for  Determination of Oxygen Contribution by Gas Distribution System  Components"
2020,ASTM,"F1397-93(2020) Standard Test Method for  Determination of Moisture Contribution by Gas Distribution   System Components"
2020,ASTM,"F1398-93(2020) Standard Test Method for  Determination of Total Hydrocarbon Contribution by Gas Distribution  System Components"
2020,ASTM,"F1438-93(2020) Standard Test Method for  Determination of Surface Roughness by Scanning Tunneling Microscopy  for Gas Distribution System Components"
1999,ASTM,"F1451-92(1999) Standard Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning (Withdrawn 2003)"
2000,ASTM,"F1526-95(2000) Standard Test Method for Measuring Surface Metal Contamination on Silicon Wafers by Total Reflection X-Ray Fluorescence Spectroscopy (Withdrawn 2003)"
2002,ASTM,"F1527-02 Standard Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon (Withdrawn 2003)"
1999,ASTM,"F1528-94(1999) Standard Test Method for Measuring Boron Contamination in Heavily Doped N-Type Silicon Substrates by Secondary Ion Mass Spectrometry (Withdrawn 2003)"
1997,ASTM,"F1529-97 Standard Test Method for Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure (Withdrawn 2003)"
2002,ASTM,"F1530-02 Standard Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning (Withdrawn 2003)"
2000,ASTM,"F1535-00 Standard Test Method for Carrier Recombination Lifetime in Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance (Withdrawn 2003)"
1999,ASTM,"F1569-94(1999) Standard Guide for Generation of Consensus Reference Materials for Semiconductor Technology (Withdrawn 2003)"
2001,ASTM,"F1570-01e1 Standard Test Method for Determining the Tactile Ratio of a Membrane Switch (Withdrawn 2007)"
2002,ASTM,"F1617-98(2002) Standard Test Method for Measuring Surface Sodium, Aluminum, Potassium, and Iron on Silicon and EPI Substrates by Secondary Ion Mass Spectrometry (Withdrawn 2003)"
2002,ASTM,"F1618-02 Standard Practice for Determination of Uniformity of Thin Films on Silicon Wafers (Withdrawn 2003)"
2000,ASTM,"F1619-95(2000)e1 Standard Test Method for Measurement of Interstitial Oxygen Content of Silicon Wafers by Infrared Absorption Spectroscopy with <i>p</i>-Polarized Radiation Incident at the Brewster Angle (Withdrawn 2003)"
1996,ASTM,"F1620-96 Standard Practice for Calibrating a Scanning Surface Inspection System Using Monodisperse Polystyrene Latex Spheres Deposited on Polished or Epitaxial Wafer Surfaces (Withdrawn 2003)"
1996,ASTM,"F1621-96 Standard Practice for Determining the Positional Accuracy Capabilities of a Scanning Surface Inspection System (Withdrawn 2003)"
2000,ASTM,"F1630-00 Standard Test Method for Low Temperature FT-IR Analysis of Single Crystal Silicon for III-V Impurities (Withdrawn 2003)"
2002,ASTM,"F1708-02 Standard Practice for Evaluation of Granular Polysilicon by Meter-Zoner Spectroscopies (Withdrawn 2003)"
2002,ASTM,"F1723-02 Standard Practice for Evaluation of Polycrystalline Silicon Rods by Float-Zone Crystal Growth and Spectroscopy (Withdrawn 2003)"
2001,ASTM,"F1724-01 Standard Test Method for Measuring Surface Metal Contamination of Polycrystalline Silicon by Acid Extraction-Atomic Absorption Spectroscopy (Withdrawn 2003)"
2002,ASTM,"F1725-02 Standard Guide for Analysis of Crystallographic Perfection of Silicon Ingots (Withdrawn 2003)"
2002,ASTM,"F1726-02 Standard Guide for Analyis of Crystallographic Perfection of Silicon Wafers (Withdrawn 2003)"
2002,ASTM,"F1727-02 Standard Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers (Withdrawn 2003)"
2002,ASTM,"F1763-96(2002) Standard Test Methods for Measuring Contrast of a Linear Polarizer (Withdrawn 2003)"
2002,ASTM,"F1771-97(2002) Standard Test Method for Evaluating Gate Oxide Integrity by Voltage Ramp Technique (Withdrawn 2003)"
2002,ASTM,"F1809-02 Standard Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon (Withdrawn 2003)"
2002,ASTM,"F1810-97(2002) Standard Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers (Withdrawn 2003)"
2002,ASTM,"F1811-97(2002) Standard Practice for Estimating the Power Spectral Density Function and Related Finish Parameters from Surface Profile Data (Withdrawn 2003)"
1999,ASTM,"F1982-99e1 Standard Test Methods for Analyzing Organic Contaminants on Silicon Wafer Surfaces by Thermal Desorption Gas Chromatography (Withdrawn 2003)"
2000,ASTM,"F2074-00 Standard Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers (Withdrawn 2003)"
2001,ASTM,"F2086-01 Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets, Method 2 (Withdrawn 2007)"
2002,ASTM,"F2114-02 Standard Guide for ASTM Standard Test Methods, Standard Practices, and Typical Values of a Membrane Switch (Withdrawn 2009)"
2001,ASTM,"F2139-01 Standard Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry (Withdrawn 2003)"
2002,ASTM,"F2166-02 Standard Practices for Monitoring Non-Contact Dielectric Characterization Systems Through Use of Special Reference Wafers (Withdrawn 2003)"
2004,ASTM,"F2358-04 Standard Guide for Measuring Characteristics of Sapphire Substrates"
2013,ASTM,"ISO/ASTM52915-13 Standard Specification for Additive Manufacturing File Format (AMF) Version 1.1"
2018,ASTM,"ISO/ASTM52910-18  Additive manufacturing &#x2014; Design &#x2014; Requirements,  guidelines and recommendations"
2015,ASTM,"ISO/ASTM52900-15 Standard Terminology for Additive Manufacturing &ndash; General Principles &ndash; Terminology"
2018,ASTM,"F448-18 Standard Test Method for  Measuring Steady-State Primary Photocurrent (Redline)"
2018,ASTM,"F1467-18 Standard Guide for  Use of an X-Ray Tester (&#x2248;10 keV Photons) in Ionizing  Radiation Effects Testing of Semiconductor Devices and Microcircuits (Redline)"
2018,ASTM,"F1893-18 Guide for  Measurement of Ionizing Dose-Rate Survivability and Burnout   of Semiconductor Devices (Redline)"
2020,ASTM,"F96-77(2020) Standard Specification for  Electronic Grade Alloys of Copper and Nickel in Wrought Forms"
2020,ASTM,"F180-94(2020) Standard Test Method for  Density of Fine Wire and Ribbon Wire for Electronic Devices"
2020,ASTM,"F205-94(2020) Standard Test Method for  Measuring Diameter of Fine Wire by Weighing"
2020,ASTM,"F256-05(2020) Standard Specification for  Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium"
2020,ASTM,"F290-94(2020) Standard Specification for  Round Wire for Winding Electron Tube Grid Laterals"
2020,ASTM,"F3434-20 Guide for Additive manufacturing &#x2013; Installation/Operation and  Performance Qualification (IQ/OQ/PQ) of Laser-Beam Powder Bed Fusion  Equipment for Production Manufacturing"
2020,ASTM,"ISO/ASTM52915-20 Specification for  additive manufacturing file format (AMF) Version 1.2"
2020,ASTM,"F1595-00(2020) Standard Practice for  Viewing Conditions for Visual Inspection of Membrane Switches"
2020,ASTM,"F2964-12(2020) Standard Test Method for Determining the Uniformity of the Luminance of an Electroluminescent  Lamp or Other Diffuse Lighting Device"
2020,ASTM,"F375-20 Standard Specification for  Integrated Circuit Lead Frame Material"
2020,ASTM,"F375-20 Standard Specification for  Integrated Circuit Lead Frame Material (Redline)"
2020,ASTM,"F1689-05(2020) Standard Test Method for  Determining the Insulation Resistance of a Membrane Switch"
2020,ASTM,"F1466-20 Standard Specification for  Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications"
2020,ASTM,"F1466-20 Standard Specification for  Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications (Redline)"
2020,ASTM,"ISO/ASTM52942-20 Additive manufacturing &#x2014; Qualification principles &#x2014;  Qualifying machine operators of laser metal powder bed fusion machines  and equipment used in aerospace applications"
2020,ASTM,"ISO/ASTM52903-2-20 Additive manufacturing &#x2014; Material extrusion-based additive  manufacturing of plastic materials &#x2014; Part 2: Process equipment"
2020,ASTM,"ISO/ASTM52941-20 Additive manufacturing — System performance and reliability  — Acceptance tests for laser metal powder-bed fusion machines  for metallic materials for aerospace application"
2021,ASTM,"F72-21 Standard Specification for Gold Wire for Semiconductor Lead Bonding"
2021,ASTM,"F72-21 Standard Specification for Gold Wire for Semiconductor Lead Bonding (Redline)"
2021,ASTM,"ISO/ASTM52950-21 Additive manufacturing — General principles —  Overview of data processing"
2020,ASTM,"ISO/ASTM52903-1-20 Additive manufacturing — Material extrusion-based additive  manufacturing of plastic materials — Part 1: Feedstock materials"
2000,ASTM,"F1527-00 Standard Guide for Application of Silicon Standard Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon"
1996,ASTM,"F1618-96 Standard Practice for Determination of Uniformity of Thin Films on Silicon Wafers"
1995,ASTM,"F23-90(1995)E01 Guide for Selecting Methods of Temperature Measurement of Thermionic Emitters (Withdrawn 2001)"
1978,ASTM,"F63-68(1978) Specification for Electronic Grade Soluble Cellulose Nitrate (Withdrawn 1984)"
1983,ASTM,"F65-68(1983) Specification for Primary Amyl Acetate (Mixed Isomers) for Use in Fabricating Electron Devices (Withdrawn 1989)"
1983,ASTM,"F70-68(1983) Specification for Cathode Carbonates (Withdrawn 1989)"
1989,ASTM,"F74-73(1989) Practice for Determining Hydrolytic Stability of Plastic Encapsulants for Electronic Devices (Withdrawn 1994)"
1991,ASTM,"F113-82(1991) Method for Stiffness Testing of Wire for Electron Devices and Lamps (Withdrawn 1995)"
1983,ASTM,"F128-66(1983) Methods of Testing Sleeves and Tubing for Electron Tube Cathodes (Withdrawn 1991)"
1990,ASTM,"F134-85(1990) Test Methods for Determining Hermeticity of Electron Devices with a Helium Mass Spectrometer Leak Detector (Withdrawn 1996)"
1987,ASTM,"F239-81(1987) Specification for Nickel Alloy Cathode Sleeves for Electron Devices (Withdrawn 1992)"
2000,ASTM,"F399-00a Standard Test Method for Thickness of Heteroepitaxial or Polysilicon Layers (Withdrawn 2002)"
1992,ASTM,"F466-79(1992) Test Method for Small-Signal Scattering Parameters of Low-Power Transistors in the 0.2 to 2.0 GHZ Frequency Range (Withdrawn 1997)"
1990,ASTM,"F632-90 Test Method for Measuring Small-Signal Comon Emitter Current Gain of Transistors at High Frequencies (Withdrawn 1995)"
1991,ASTM,"F635-85(1991) Guide for Selection of Tests for Material Properties of Liquid Thermoset Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)"
1991,ASTM,"F636-85(1991) Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)"
1991,ASTM,"F675-91 Test Method for Measuring Nonequilibrium Transient Photocurrents in P-N Junctions (Withdrawn 1995)"
1990,ASTM,"F729-81(1990)E01 Test Methods for Temperature Coefficient of Resistance of Film Resistors (Withdrawn 1992)"
1990,ASTM,"F730-81(1990)E01 Test Methods for Hermeticity of Electron Devices by a Weight-Gain Test (Withdrawn 1993)"
1989,ASTM,"F752-82(1989) Test Method for Effective Series Resistance (ESR) and Capitance of Multilayer Ceramic Capacitors at High Frequencies (Withdrawn 1994)"
1990,ASTM,"F772-82(1990) Test Method for Noise Quality of Film-Type Resistors (Withdrawn 1996)"
1982,ASTM,"F774-82 Guide for Analysis of Latchup Susceptibility in Bipolar Integrated Circuits (Withdrawn 1987)"
1988,ASTM,"F775-88 Test Method for Wafer and Slice Flatness by Interferometric (Withdrawn 1991)"
1990,ASTM,"F784-82(1990) Test Method for Calibrating Radioisotope Hermetric Test Apparatus (Withdrawn 1996)"
1990,ASTM,"F785-82(1990)E01 Test Method for Hermeticity of Sealed Devices by a Radioisotope Test (Withdrawn 1996)"
1990,ASTM,"F866-84(1990)E01 Test Method for Measuring the Package Attenuation Coefficient of a Sealed Device for Radioisotope Hermetic Test (Withdrawn 1996)"
1990,ASTM,"F889-84(1990) Test Method for Characterizing a Combination of Properties of Planar Surfaces to a Technical Level by a Vacuum Hold-Down Technique (Withdrawn 1996)"
1991,ASTM,"F1032-91 Guide for Measuring Time-Dependant Total-Dose Effects in Semiconductor Devices Exposed to Pulsed Ionizing Radiation (Withdrawn 1994)"
1987,ASTM,"F1096-87 Method for Measuring Mosfet Saturated Threshold Voltage (Withdrawn 1992)"
1988,ASTM,"F1191-88 Guide for the Radiation Testing of Semiconductor Memories (Withdrawn 1993)"
1994,ASTM,"F1226-89(1994)e1 Standard Test Method for Calibration of Liquid-Borne Particle Counters for Submicrometer Particle Sizing (Withdrawn 2002)"
1992,ASTM,"F1340-92 Test Method for Determining the Mean Interface Trap Density of Mosfets by Charge-Pumping (Withdrawn 1997)"
1988,ASTM,"F615-79(1988) Practice for Determining Safe Current Pulse Operating Regions for Metallization on Semiconductor Components (Withdrawn 1995)"
1994,ASTM,"F867M-94A Guide for Ionizing Radiation Effects (Total Dose) Testing of Semiconductor Devices [Metric] (Withdrawn 1998)"
2021,ASTM,"F7-95(2021) Standard Specification for  Aluminum Oxide Powder"
2021,ASTM,"F1684-06(2021) Standard Specification for  Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion   Applications"
2021,ASTM,"F1995-13(2021) Standard Test Method for  Determining the Shear Strength of the Bond between a Surface  Mount Device (SMD) and Substrate in a Membrane Switch"
2021,ASTM,"F2865-13(2021) Standard Guide for  Classifying the Degrees of Ingress of Dust and Water into a  Membrane Switch"
2021,ASTM,"F19-21 Standard Test Method for  Tension and Vacuum Testing Metallized Ceramic Seals"
2021,ASTM,"F19-21 Standard Test Method for  Tension and Vacuum Testing Metallized Ceramic Seals (Redline)"
2021,ASTM,"F44-21 Standard Specification for  Metallized Surfaces on Ceramic"
2021,ASTM,"F44-21 Standard Specification for  Metallized Surfaces on Ceramic (Redline)"
1983,ASTM,"F2-68(1983)e1 Specification for Aluminum-Clad Steel Strip and Nickel-Steel-Aluminum Composite Strip for Electron Tubes"
1969,ASTM,"F9-69 Specification for Round Wire for Use as Grid Siderods in Electron Tubes"
1981,ASTM,"F10-69(1981)e1 Specification for Miniature Electron Tube Leads"
1966,ASTM,"F20-66 Specification for High Conductivity Composite Aluminum-Steel-Copper Strip for Electron Tubes"
1984,ASTM,"F94-69(1984)e1 Method of Test for Aluminum in Electronic Grade Hydrogen Peroxide"
1981,ASTM,"F100-71(1981) Test Method for Shrinkage Stresses in Plastic Embedment Materials Using a Photoelastic Technique for Electronic and Similar Applications"
1983,ASTM,"F102-71(1983)e1 Method for Spectrochemical Analysis of Emissive Carbonates by the Powder D-C Arc Technique"
1965,ASTM,"F155-65 Method of Test for for Temper of Strip and Sheet Metals for Electronic Devices (Spring-Back Method"
1987,ASTM,"F300-64(1987)e1 Methods of Measuring Interface Impedance Characteristics of Electron Tube Cathodes"
1991,ASTM,"F580-78(1991)e1 Test Method for Adhesion Strength of Bondable Films to Substrates in Ribbon-Wire Bonds"
1979,ASTM,"F618-79e1 Method for Measuring MOSFET Saturated Threshold Voltage"
1985,ASTM,"F652-68(1985)e2 Method for Measuring Mica Stampings or Substitutes Used in Electron Devices and Lamps"
2021,ASTM,"F2971-13(2021) Standard Practice for Reporting Data for Test Specimens Prepared by Additive Manufacturing"
1977,ASTM,"F98-72(1977)e1 Recommended Practices for Determining Hermeticity of Electron Devices by a Bubble Test"
2021,ASTM,"F2924-14(2021) Standard Specification for  Additive Manufacturing Titanium-6 Aluminum-4 Vanadium with   Powder Bed Fusion"
2021,ASTM,"F3001-14(2021) Standard Specification for Additive Manufacturing Titanium-6 Aluminum-4 Vanadium ELI (Extra  Low Interstitial) with Powder Bed Fusion"
2021,ASTM,"F3049-14(2021) Standard Guide for Characterizing Properties of Metal Powders Used for Additive  Manufacturing Processes"
2021,ASTM,"F3055-14a(2021) Standard Specification for Additive Manufacturing Nickel Alloy (UNS N07718) with Powder  Bed Fusion"
2021,ASTM,"F3056-14(2021) Standard Specification for Additive Manufacturing Nickel Alloy (UNS N06625) with Powder  Bed Fusion"
2021,ASTM,"F3091/F3091M-14(2021) Standard Specification for Powder Bed Fusion of Plastic Materials"
2021,ASTM,"ISO/ASTM52930-21 Additive manufacturing — Qualification principles —  Installation, operation and performance (IQ/OQ/PQ) of PBF-LB equipment"
2021,ASTM,"F31-21 Standard Specification for  Nickel-Chromium-Iron Sealing Alloys"
2021,ASTM,"F31-21 Standard Specification for  Nickel-Chromium-Iron Sealing Alloys (Redline)"
2021,ASTM,"F3529-21 Guide for Additive Manufacturing — Design — Material Extrusion of Polymers"
2021,ASTM,"ISO/ASTM52900-21 Additive manufacturing — General principles —  Fundamentals and vocabulary"
2021,ASTM,"F3490-21 Standard Practice for Additive Manufacturing — General Principles —  Overview of Data Pedigree"
2019,ASTM,"E2544-11A(2019)e1 Standard Terminology for  Three-Dimensional (3D) Imaging Systems"
2022,ASTM,"ISO/ASTM52925-22 Additive manufacturing of polymers — Feedstock materials  — Qualification of materials for laser-based powder bed fusion  of parts"
2022,ASTM,"F3122-14(2022) Standard Guide for Evaluating Mechanical Properties of Metal Materials Made via  Additive Manufacturing Processes"
2022,ASTM,"F3456-22 Standard Guide for Powder Reuse Schema in Powder Bed Fusion Processes for Medical  Applications for Additive Manufacturing Feedstock Materials"
2022,ASTM,"F15-04(2022) Standard Specification for  Iron-Nickel-Cobalt Sealing Alloy"
2022,ASTM,"F16-12(2022) Standard Test Methods for  Measuring Diameter or Thickness of Wire and Ribbon for Electronic  Devices and Lamps"
2022,ASTM,"F18-12(2022) Standard Specification and Test Method for  Evaluation of Glass-to-Metal Headers Used in Electron Devices"
2022,ASTM,"F29-97(2022) Standard Specification for  Dumet Wire for Glass-to-Metal Seal Applications"
2022,ASTM,"F3530-22 Standard Guide for Additive Manufacturing — Design — Post-Processing  for Metal PBF-LB"
2022,ASTM,"F3572-22 Standard Practice for Additive Manufacturing – General Principles –  Part Classifications for Additive Manufactured Parts Used in Aviation"
2022,ASTM,"F3571-22 Standard Guide for Additive Manufacturing – Feedstock – Particle  Shape Image Analysis by Optical Photography to Identify and Quantify  the Agglomerates/Satellites in Metal Powder Feedstock"
2022,ASTM,"F3560-22 Standard Specification for Additive Manufacturing – Data – Common Exchange  Format for Particle Size Analysis by Light Scattering"
2022,ASTM,"ISO/ASTM52909-22 Additive manufacturing of metals — Finished part properties  — Orientation and location dependence of mechanical properties  for metal powder bed fusion"
2019,ASTM,"F3413-19e1 Guide for Additive Manufacturing — Design — Directed Energy  Deposition"
2022,ASTM,"F3554-22 Standard Specification for Additive Manufacturing – Finished Part Properties –  Grade 4340 (UNS G43400) via Laser Beam Powder Bed Fusion for Transportation  Applications"
2022,ASTM,"F2577-22 Standard Guide for  Compositional Evaluation of Declarable Substances and Substances  of Concern for Materials in Products"
2022,ASTM,"F2577-22 Standard Guide for  Compositional Evaluation of Declarable Substances and Substances  of Concern for Materials in Products (Redline)"
2019,ASTM,"E2807-11(2019)e1 Standard Specification for  3D Imaging Data Exchange, Version 1.0"
2022,ASTM,"F3606-22 Standard Guide for Additive Manufacturing — Feedstock Materials —  Testing Moisture Content in Powder Feedstock"
2022,ASTM,"F3522-22 Standard Guide for Additive Manufacturing of Metals — Feedstock Materials  — Assessment of Powder Spreadability"
2023,ASTM,"ISO/ASTM52936-1-23 Additive manufacturing of polymers — Qualification principles  — Part  1: General principles and preparation of test specimens  for PBF-LB"
2023,ASTM,"ISO/ASTM52931-23 Additive manufacturing of metals — Environment, health  and safety — General principles for use of metallic materials"
2022,ASTM,"E2919-22 Standard Test Method for Evaluating the Performance of Systems that Measure Static,  Six Degrees of Freedom (6DOF), Pose"
2022,ASTM,"E2919-22 Standard Test Method for Evaluating the Performance of Systems that Measure Static,  Six Degrees of Freedom (6DOF), Pose (Redline)"
2023,ASTM,"ISO/ASTM52911-3-23 Additive manufacturing — Design — Part 3: PBF-EB  of metallic materials"
2023,ASTM,"F3605-23 Standard Guide for Additive Manufacturing of Metals — Data — File  Structure for In-Process Monitoring of Powder Bed Fusion (PBF)"
2023,ASTM,"F3624-23 Standard Guide for Additive Manufacturing of Metals – Powder Bed Fusion  – Measurement and Characterization of Surface Texture"
2023,ASTM,"F3626-23 Standard Guide for Additive Manufacturing — Test Artifacts — Accelerated  Build Quality Assurance for Laser Beam Powder Bed Fusion (PBF-LB)"
2023,ASTM,"F3489-23 Standard Guide for Additive Manufacturing of Polymers — Material Extrusion  — Recommendation for Material Handling and Evaluation of Static  Mechanical Properties"
2023,ASTM,"F3637-23 Standard Guide for Additive Manufacturing of Metal — Finished Part Properties  — Methods for Relative Density Measurement"
2023,ASTM,"ISO/ASTM52920-23 Additive manufacturing — Qualification principles —  Requirements for industrial additive manufacturing processes and production  sites"
2023,ASTM,"F3592-23 Standard Guide for Additive Manufacturing of Metals – Powder Bed Fusion  – Guidelines for Feedstock Re-use and Sampling Strategies"
2023,ASTM,"F3615-23 Standard Practice for Additive Manufacturing — Powder Bed Fusion —  Condition-Defined Maintenance for Optical Systems"
2022,ASTM,"F3607-22 Standard Specification for Additive Manufacturing – Finished Part Properties –  Maraging Steel via Powder Bed Fusion"
2023,ASTM,"ISO/ASTM52902-23 Additive manufacturing — Test artefacts — Geometric  capability assessment of additive manufacturing systems"
2023,ASTM,"F2617-15(2023) Standard Test Method for  Identification and Quantification of Chromium, Bromine, Cadmium,  Mercury, and Lead in Polymeric Material Using Energy Dispersive X-ray  Spectrometry"
2023,ASTM,"F2853-10(2023) Standard Test Method for  Determination of Lead in Paint Layers and Similar Coatings   or in Substrates and Homogenous Materials by Energy Dispersive X-Ray   Fluorescence Spectrometry Using Multiple Monochromatic Excitation   Beams"
2023,ASTM,"F3078-15(2023) Standard Test Method for Identification and Quantification of Lead in Paint and Similar  Coating Materials using Energy Dispersive X-ray Fluorescence Spectrometry  (EDXRF)"
2023,ASTM,"F3139-15(2023) Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements  Using Inductively Coupled Plasma Atomic Emission Spectrometry"
2023,ASTM,"ISO/ASTM52935-23 Additive manufacturing of metals — Qualification principles  — Qualification of coordination personnel"
2023,ASTM,"E2938-15(2023) Standard Test Method for Evaluating the Relative-Range Measurement Performance of 3D  Imaging Systems in the Medium Range"
2023,ASTM,"ISO/ASTM52939-23 Additive manufacturing for construction — Qualification  principles — Structural and infrastructure elements"
2023,ASTM,"F3635-23 Standard Specification for Additive Manufacturing – Finished Part Properties –  Standard Specification for Niobium-Hafnium Alloy UNS R04295 via Laser  Beam Powder Bed Fusion for Spaceflight Applications"
2024,ASTM,"F980-16(2024) Standard Guide for  Measurement of Rapid Annealing of Neutron-Induced Displacement   Damage in Silicon Semiconductor Devices"
2023,ASTM,"F3184-16(2023) Standard Specification for Additive Manufacturing Stainless Steel Alloy (UNS S31603) with  Powder Bed Fusion"
2023,ASTM,"F3187-16(2023) Standard Guide for Directed Energy Deposition of Metals"
2023,ASTM,"F3604-23 Standard Practice for Validating the Additive Manufacturing (AM) Production Process  for Medical Devices Produced Using Laser Powder Bed Fusion"
2024,ASTM,"F3674-24 Standard Practice for Additive Manufacturing – Part Grades for Automotive"
2024,ASTM,"E2544-24 Standard Terminology for Three-Dimensional (3D) Imaging Systems"
2024,ASTM,"E2544-24 Standard Terminology for Three-Dimensional (3D) Imaging Systems (Redline)"
2024,ASTM,"F3682-24 Standard Terminology for Goods Movement Process (GMP) Precise Foundational Definitions"
2023,ASTM,"ISO/ASTM52945-23 Additive manufacturing for automotive — Qualification  principles — Generic machine evaluation and specification of  key performance indicators for PBF-LB/M processes"
2023,ASTM,"ISO/ASTM52926-1-23 Additive manufacturing of metals — Qualification principles  — Part 1: General qualification of operators"
2023,ASTM,"ISO/ASTM52926-4-23 Additive manufacturing of metals — Qualification principles  — Part 4: Qualification of operators for DED-LB"
2023,ASTM,"ISO/ASTM52926-2-23 Additive manufacturing of metals — Qualification principles  — Part 2: Qualification of operators for PBF-LB"
2023,ASTM,"ISO/ASTM52926-3-23 Additive manufacturing of metals — Qualification principles  — Part 3: Qualification of operators for PBF-EB"
2023,ASTM,"ISO/ASTM52908-23 Additive manufacturing of metals — Finished part properties  — Post-processing, inspection and testing of parts produced  by powder bed fusion"
2024,ASTM,"ISO/ASTM52933-24 Additive manufacturing — Environment, health and safety  — Test method for the hazardous substances emitted from material  extrusion type 3D printers in the non-industrial places"
2024,ASTM,"ISO/ASTM52927-24 Additive manufacturing — General principles —  Main characteristics and corresponding test methods"
2024,ASTM,"F72-24 Standard Specification for Gold Wire for Semiconductor Lead Bonding"
2024,ASTM,"F106-24 Standard Specification for  Brazing Filler Metals for Electron Devices"
2024,ASTM,"F1578-24 Standard Test Method for  Contact Closure Cycling of a Membrane Switch"
2024,ASTM,"F3682-24a Standard Terminology for Goods Movement Process (GMP) Precise Foundational Definitions"
2024,ASTM,"F1190-24 Standard Guide for  Neutron Irradiation of Unbiased Electronic Components"
2024,ASTM,"F1190-24 Standard Guide for  Neutron Irradiation of Unbiased Electronic Components (Redline)"
2024,ASTM,"F1192-24 Standard Guide for the  Measurement of Single Event Phenomena (SEP) Induced by Heavy   Ion Irradiation of Semiconductor Devices"
2024,ASTM,"F1192-24 Standard Guide for the  Measurement of Single Event Phenomena (SEP) Induced by Heavy   Ion Irradiation of Semiconductor Devices (Redline)"
2024,ASTM,"ISO/ASTM52943-2-24 Additive manufacturing for aerospace — Process characteristics  and performance — Part 2: Directed energy deposition using  wire and arc"
2024,ASTM,"D8558-24 Standard Guide for Verification of a Certificate of Authentication Used to Track  Products through Their Supply Chain by Utilizing Blockchain Technology"
2024,ASTM,"F3682-24b Standard Terminology for Goods Movement Process (GMP) Precise Foundational Definitions"
2024,ASTM,"ISO/ASTM52904-24 Additive manufacturing of metals — Process characteristics  and performance — Metal powder bed fusion process to meet critical  applications"
2022,ASTM,"F3488-22 Standard Guide for Additive Manufacturing — Design — Decision Support"
2024,ASTM,"F3682-24c Standard Terminology for Goods Movement Process (GMP) Precise Foundational Definitions"
2024,ASTM,"F3682-24c Standard Terminology for Goods Movement Process (GMP) Precise Foundational Definitions (Redline)"
2024,ASTM,"F3704/F3704M-24 Standard Practice for Nondestructive Testing (NDT), Inspection Levels and Acceptance  Criteria for Parts Manufactured with Laser Based Powder Fusion"