ASTM D352-97(2003)
Historical Standard: ASTM D352-97(2003) Standard Test Methods for Pasted Mica Used in Electrical Insulation
SUPERSEDED (see Active link, below)
ASTM D352
1. Scope
1.1 These test methods cover the testing of bonded mica splittings and bonded mica paper to be used for commutator insulation, hot molding, heater plates, and other similar insulating purposes.
1.2 These test methods appear in the following sections:
Test | Sections |
Compressive Creep | 4-10 |
Dielectric Strength | 38-41 |
Mica or Binder Content | 19 |
Molding Test | 31-36 |
Organic Binder | 20-24 |
Resistivity | 42-46 |
Silicone Binder | 25-.30 |
Stability Under Heat and Pressure | 11-18 |
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 40.1 and 45.1 for specific hazard statements.
1.4 The values stated in inch-pound units are to be regarded as the standard.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
ASTM Standards
D149 Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials at Commercial Power Frequencies
D257 Test Methods for DC Resistance or Conductance of Insulating Materials
D1711 Terminology Relating to Electrical Insulation
Keywords
binder content; bonded mica paper; bonded mica splittings; commutator segment insulation; compressive creep; heater plates; pasted mica; Binder content; Commutator insulation; Compression testing--electrical insulating materials; Creep; Dielectric breakdown voltage; Electrical resistance/resistivity--insulating materials; Heater plates; Heat stability; Hot molding; Mica; Molding test; Organic binder; Pasted mica; Silicone binder; Stability;
ICS Code
ICS Number Code 29.035.50 (Mica based insulating materials)
DOI: 10.1520/D0352-97R03
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