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  • BSI
    BS EN 61190-1-2:2014 Attachment materials for electronic assembly - Requirements for soldering pastes for high-quality interconnects in electronics assembly
    Edition: 2014
    $435.35
    / user per year

Description of BS EN 61190-1-2:2014 2014

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.

Standard NumberBS EN 61190-1-2:2014
TitleAttachment materials for electronic assembly - Requirements for soldering pastes for high-quality interconnects in electronics assembly
StatusDefinitive
Publication Date2014-06-30
ReplacesBS EN 61190-1-2:2007
Identical National Standard OfEN 61190-1-2:2014, IEC 61190-1-2:2014
DescriptorsElectronic equipment and components, Pastes, Quality assurance, Electronic engineering, Classification systems, Soldered connectors, Solders, Soldering, Quality control, Electrical connections, Bonding
ICS31.190 Electronic component assemblies
CommitteeEPL/501
ISBN978 0 580 77840 7
PublisherBSI
Pages26

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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