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  • BSI
    BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint - Cyclic drop test
    Edition: 2009
    $435.35
    / user per year

Description of BS EN 62137-1-3:2009 2009

The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Standard NumberBS EN 62137-1-3:2009
TitleSurface mounting technology. Environmental and endurance test methods for surface mount solder joint - Cyclic drop test
StatusDefinitive
Publication Date2009-03-31
Identical National Standard OfEN 62137-1-3:2009, IEC 62137-1-3:2008
DescriptorsEndurance testing, Mechanical testing, Soldering, Surface mounting, Soldered joints, Surface mounting devices, Impact testing, Environmental testing, Printed-circuit boards, Drop tests, Integrated circuits, Cyclic
ICS31.190 Electronic component assemblies
CommitteeEPL/501
ISBN978 0 580 57386 6
PublisherBSI
Pages28

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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