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  • BSI
    BS EN IEC 60749-20:2020 Semiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    Edition: 2020
    $435.35
    / user per year

Description of BS EN IEC 60749-20:2020 2020

IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.

Standard NumberBS EN IEC 60749-20:2020
TitleSemiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
StatusDefinitive
Publication Date2020-10-14
ReplacesBS EN 60749-20:2009
Identical National Standard OfEN 60749-20 Ed.3.0, IEC 60749-20 Ed.3.0
DescriptorsPlastics, Climate, Thermal testing, Encapsulated, Surface mounting devices, Damp-heat tests, Environmental testing, Electronic equipment and components, Semiconductor devices, Integrated circuits, Soldering, Solderability testing, Mechanical testing
ICS31.080.01 Semiconductor devices in general
CommitteeEPL/47
ISBN978 0 539 04584 0
PublisherBSI
Pages32

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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