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  • BSI
    BS EN IEC 61190-1-3:2018 - TC Tracked Changes. Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
    Edition: 2020
    $685.82
    / user per year

Description of BS EN IEC 61190-1-3:2018 - TC 2020

IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
This edition includes the following significant technical changes with respect to the previous edition:
a)   The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.


Standard NumberBS EN IEC 61190-1-3:2018 - TC
TitleTracked Changes. Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
StatusDefinitive
Publication Date2020-02-27
DescriptorsElectrical connections, Solders, Pastes, Test methods, Quality assurance, Bonding, Particulate materials, Fluxes (materials), Soldering, Classification systems, Bars (materials), Quality control, Electronic engineering, Electronic equipment and components
ICS31.190 Electronic component assemblies
CommitteeEPL/501
ISBN978 0 539 11142 2
PublisherBSI
Pages0

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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