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  • BSI
    BS EN IEC 61760-3:2021 Surface mounting technology - Standard method for the specification of components for through-hole reflow (THR) soldering
    Edition: 2021
    $442.60
    / user per year

Description of BS EN IEC 61760-3:2021 2021

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended. Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.

Standard NumberBS EN IEC 61760-3:2021
TitleSurface mounting technology - Standard method for the specification of components for through-hole reflow (THR) soldering
StatusDefinitive
Publication Date2021-03-18
ReplacesBS EN 61760-3:2010
Identical National Standard OfEN 61760-3 Ed.2.0, IEC 61760-3 Ed.2.0
DescriptorsMarking, Packaging, Surface mounting devices, Soldering, Electronic equipment and components, Cleaning, Integrated circuit technology, Solderability testing, Microassembling, Electrical components, Holes, Integrated circuits
ICS31.190 Electronic component assemblies
CommitteeEPL/501
ISBN978 0 539 04585 7
PublisherBSI
Pages34

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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