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  • BSI
    DD IEC/PAS 62588:2008 Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
    Edition: 2008
    $313.97
    / user per year

Description of DD IEC/PAS 62588:2008 2008

IEC/PAS 62588:2008(E) applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This document describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit. This document also applies to 2nd level terminal materials for bumped die that are used for direct board attach. IEC/PAS 62588:2008(E) also applies to boards/assemblies, to identify the type of Pb-free or Pb-containing solder used. This document documents a method for identifying board surface finishes and Printed Circuit Board (PCB) resin systems. This document applies to PCB base materials and for marking the type of conformal coating utilized on Printed Circuit Board Assemblies (PCBAs).

Standard NumberDD IEC/PAS 62588:2008
TitleMarking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
StatusRevision Underway
Publication Date2008-10-31
Identical National Standard OfIEC/PAS 62588:2008
DescriptorsMarking, Lead, Electronic equipment and components, Printed-circuit bases, Circuits, Soldering, Recycling, Solders, Lead-free alloys, Assembling, Designations, Printed-circuit boards, Repair
ICS31.190 Electronic component assemblies
CommitteeEPL/501
ISBN978 0 580 64571 6
PublisherBSI
Pages22

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
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