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BS EN 60191-6-17:2011 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitc, 2011
- iec60191-6-17{ed1.0}b.pdf [Go to Page]
- English
[Go to Page]
- CONTENTS
- FOREWORD
- INTRODUCTION
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- 4 Terminal position numbering
- 5 Drawings
- 6 Dimensions [Go to Page]
- 6.1 Group 1
- 6.2 Group 2
- 6.3 Combination of D, E, MD, and ME
- 7 Dimension table
- Figures
[Go to Page]
- Figure 1 – Individual stackable package, P-FBGA (cavity-up)
- Figure 2 – Individual stackable package, P-FBGA (cavity-down)
- Figure 3 – Individual stackable package, P-FLGA (cavity-up)
- Figure 4 – Stacked package outline, P-PFBGA (cavity-up BGA and cavity-up BGA)
- Figure 5 – Stacked package outline, P-PFBGA
(cavity-down BGA and cavity-down BGA)
- Figure 6 – Stacked package outline,
P-PFBGA (cavity-down BGA + cavity-up LGA)
- Figure 7 – Stacked package outline, P-PFLGA (cavity-up LGA + cavity-up BGA)
- Figure 8 – Functional gauge
- Figure 9 – Pattern of terminal position area
- Tables
[Go to Page]
- Table 1 – Dimensions, Group 1
- Table 2 – Dimensions Group 2
- Table 3 – Combination of D, E, MD, and ME, e = 0,80
mm pitch FBGA and FLGA
- Table 4 – Combination of D, E, MD, and ME, e = 0,65
mm pitch FBGA and FLGA
- Table 5 – Combination of D, E, MD, and ME, e = 0,50
mm pitch FBGA and FLGA
- Table 6 – Combination of D, E, MD, and ME, e = 0,40
mm pitch FBGA an FLGA
- Table 7 – Combination of D, E, MD, and ME, e = 0,30
mm pitch FLGA
- Table 8 – Dimension table
- Français
[Go to Page]
- SOMMAIRE
- AVANT-PROPOS
- INTRODUCTION
- 1 Domaine d'application
- 2 Références normatives
- 3 Termes et définitions
- 4 Numérotage de position des bornes
- 5 Dessins
- 6 Dimensions [Go to Page]
- 6.1 Groupe 1
- 6.2 Groupe 2
- 6.3 Combinaison de D, E, MD et ME
- 7 Tableau des dimensions
- Figures
[Go to Page]
- Figure 1 – Boîtier empilable individuel, P-FBGA (cavité vers le haut)
- Figure 2 – Boîtier empilable individuel, P-FBGA (cavité vers le bas)
- Figure 3 – Boîtier empilable individuel, P-FLGA (cavité vers le haut)
- Figure 4 – Encombrement d'un empilement de boîtiers, P-PFBGA (BGA
(matrice à billes) cavité vers le haut, et BGA cavité vers le haut)
- Figure 5 – Encombrement d'un empilement de boîtiers, P-PFBGA(BGA cavité vers le bas et BGA cavité vers le bas)
- Figure 6 – Encombrement d'un empilement de boîtiers, P-PFBGA (BGA cavité vers le bas + LGA (zone de contact plate) cavité vers le haut)
- Figure 7 – Encombrement d'un empilement de boîtiers, P-PFLGA(LGA cavité vers le haut + BGA cavité vers le haut)
- Figure 8 – Gabarit fonctionnelde position des bornes
- Figure 9 – Dessin des aires
- Tableaux
[Go to Page]
- Tableau 1 – Dimensions, Groupe 1
- Tableau 2 – Dimensions, Groupe 2
- Tableau 3 – Combinaison de D, E, MD et ME, FBGA et FLGA, e = pas de 0,80 mm
- Tableau 4 – Combinaison de D, E, MD et ME, FBGA et FLGA, e = pas de 0,65 mm
- Tableau 5 – Combinaison de D, E, MD et ME, FBGA et FLGA, e = pas de 0,50 mm
- Tableau 6 – Combinaison de D, E, MD et ME, FBGA et FLGA, e = pas de 0,40 mm
- Tableau 7 – Combinaison de D, E, MD et ME, FLGA, e = pas de 0,30 mm
- Tableau 8 – Tableau des dimensions [Go to Page]