Significance and Use

The use of FXR or LINAC radiation sources for the determination of high dose-rate burnout in semiconductor devices is addressed in this guide. The goal of this guide is to provide a systematic approach to testing semiconductor devices for burnout or survivability.

The different types of failure modes that are possible are defined and discussed in this guide. Specifically, failure can be defined by a change in device parameters, or by a catastrophic failure of the device.

This guide can be used to determine if a device survives (that is, continues to operate and function within the specified performance parameters) when irradiated to a predetermined dose-rate level; or, the guide can be used to determine the dose-rate burnout failure level (that is, the minimum dose rate at which burnout failure occurs). However, since this latter test is destructive, the minimum dose-rate burnout failure level must be determined statistically.

1. Scope

1.1 This guide defines the detailed requirements for testing semiconductor devices for short-pulse high dose-rate ionization-induced survivability and burnout failure. The test facility shall be capable of providing the necessary dose rates to perform the measurements. Typically, large flash X-ray (FXR) machines operated in the photon mode, or FXR e-beam facilities are utilized because of their high dose-rate capabilities. Electron Linear Accelerators (LINACs) may be used if the dose rate is sufficient. Two modes of test are described: ( 1 ) A survivability test, and ( 2 ) A burnout failure level test.

1.2 The values stated in International System of Units (SI) are to be regarded as standard. No other units of measurement are included in this standard.

2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

ASTM Standards

E170 Terminology Relating to Radiation Measurements and Dosimetry

E668 Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose in Radiation-Hardness Testing of Electronic Devices

E1894 Guide for Selecting Dosimetry Systems for Application in Pulsed X-Ray Sources

F526 Test Method for Using Calorimeters for Total Dose Measurements in Pulsed Linear Accelerator or Flash X-ray Machines

Keywords

burnout; failure; high dose-rate; integrated circuits; ionizing radiation; latchup; microcircuits; semiconductor devices; survivability;

ICS Code

ICS Number Code 31.080.01 (Semi-conductor devices in general)

DOI: 10.1520/F1893-11

ASTM International is a member of CrossRef.

ASTM F1893