ASTM F1893-98(2003)
Historical Standard: ASTM F1893-98(2003) Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices
SUPERSEDED (see Active link, below)
ASTM F1893
1. Scope
1.1 This guide defines the detailed requirements for testing microcircuits for short pulse high dose-rate ionization-induced failure. Large flash x-ray (FXR) machines operated in the photon mode, or FXR e-beam facilities are required because of the high dose-rate levels that are necessary to cause burnout. Two modes of test are possible (1) survival test, and (2) A failure level test.
1.2 The values stated in International System of Units (SI) are to be regarded as standard. No other units of measurement are included in this standard.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
ASTM Standards
E170 Terminology Relating to Radiation Measurements and Dosimetry
E668 Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose in Radiation-Hardness Testing of Electronic Devices
E1894 Guide for Selecting Dosimetry Systems for Application in Pulsed X-Ray Sources
F526 Test Method for Using Calorimeters for Total Dose Measurements in Pulsed Linear Accelerator or Flash X-ray Machines
Keywords
burnout; failure; high dose-rate; integrated circuits; ionizing radiation; latchup; microcircuits; semiconductor devices; survivability;
ICS Code
ICS Number Code 31.080.01 (Semi-conductor devices in general)
DOI: 10.1520/F1893-98R03
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