1. Scope

1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, ( 1 ) copper-modified wire, ( 2 ) beryllium-modified wire, ( 3 ) high-strength wire, and ( 4 ) special purpose wire.

Note 1--Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties or both. This practice is known variously as 'modifying,'' stabilizing,' or 'doping.' The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, 'high-strength' and 'special purpose' wire, the identity of modifying additives is not restricted.

1.2 The values stated in SI units shall be regarded as the standard.

1.2.1 A mixed system of metric and inch-pound units is in widespread use for specifying semiconductor lead-bonding wire. SI-equivalent values of other commonly used units are denoted by parentheses in text and tables.

1.3 The following hazard caveat pertains only to the test method portion, Section 9, of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

ASTM Standards

E16 Method of Free Bend Test for Ductility of Welds

F205 Test Method for Measuring Diameter of Fine Wire by Weighing

F219 Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps

F584 Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

Keywords

gold wire; semiconductor; internal; electrical connections; copper-modified wire; beryllium-modified wire; high-strength wire; special purpose wire; lead bonding; thermal stability; high purity gold wire;

ICS Code

ICS Number Code 29.060.10 (Wires)

DOI: 10.1520/F0072-95R01

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